Abstract: An antenna sharing device has a common signal terminal pair, a first terminal pair, a second terminal pair, a first filter, a second filter, a first inductor element, second inductor elements, third inductor elements. The second and third inductor elements have a plurality of inductor elements, respectively. An inductor element closest to the first terminal pair among the inductor elements included in the second inductor elements and an inductor element closest to the second terminal pair among the third inductor elements are arranged further away from the first inductor element than the other inductor elements included in the second and third inductor elements, or formed on a substrate different from a substrate on which the first inductor element is formed, or formed opposite to the first inductor element by sandwiching a shielding pattern.

Abstract: An antenna sharing device has a common signal terminal pair, a first terminal pair, a second terminal pair, a first filter, a second filter, a first inductor element, second inductor elements, third inductor elements. The second and third inductor elements have a plurality of inductor elements, respectively. An inductor element closest to the first terminal pair among the inductor elements included in the second inductor elements and an inductor element closest to the second terminal pair among the third inductor elements are arranged further away from the first inductor element than the other inductor elements included in the second and third inductor elements, or formed on a substrate different from a substrate on which the first inductor element is formed, or formed opposite to the first inductor element by sandwiching a shielding pattern.

Abstract: An elastic surface wave element including first and a second two-port surface acoustic wave filters and a one-port elastic surface acoustic wave resonator filter with a single inter-digital transducer is connected via bumps to electrodes formed on a housing by face down bonding techniques. The housing has an opening section in a ground terminal electrode in a part facing the one-port elastic surface acoustic wave resonator filter.

Abstract: In an elastic surface wave device according to this invention, an elastic surface wave element including a first and a second two-port surface acoustic wave filter and a one-port surface acoustic wave filter with a single inter-digital transducer is connected via bumps to electrodes formed on a housing by face down bonding techniques. The housing has an opening section for a ground terminal electrode in a part facing the one-port surface acoustic wave filter.

Abstract: A surface acoustic wave filter element and a method of producing the same. The element is constructed in a manner such that a conductive film, which constitutes a plurality of electrode fingers, a bus bar connecting the electrode fingers in common, an electrode pad connected to the bus bar, etc., is formed on a piezoelectric substrate. When using the surface acoustic wave filter element with this arrangement in a high-frequency band, the thickness of the conductive film and the line width of electrodes are reduced, so that the mechanical strength is a critical problem. According to the present invention, therefore, the conductive film has a two-layer structure, including a layer containing tantalum and aluminum and a metallic layer of aluminum or an alloy consisting mainly of aluminum formed thereon, for example. The composition ratio between tantalum and aluminum is set so that the tantalum content ranges from 39% to 75% (atomic percentage).

Abstract: An object of the present invention is to provide a filter that enables to manufacture in a multi-chip package with ease and that is of small size and multi-function or multi-mode. In a constitution of the present invention, a filter comprises a package comprising a base on one main surface thereof a conductor is formed, and a plurality of surface acoustic wave chips comprising a plurality of interdigital transducers formed on one main surface of a piezoelectric substrate, signal terminals disposed on facing sides on the piezoelectric substrate, and ground terminals disposed on the piezoelectric substrate. Here, the plurality of surface acoustic wave chips, at the signal terminals and the ground terminals, is bonded to the conductor in a face down way.