Abstract: An image analysis section executes instruction processing to image electronic component while changing a shutter speed of measurement camera between a predetermined lower limit speed and a predetermined upper limit speed calculation processing of comparing an image of lower surface of each lead included in each of multiple imaging data acquired from the measurement camera with an ideal image of lower surface of each lead included in ideal imaging data to calculate a missing rate at which the image of lower surface of each lead is missing with respect to the ideal image for each of the multiple imaging data, detection processing of detecting imaging data having a missing rate equal to or less than a predetermined first threshold among multiple missing rates calculated by the calculation processing, and selection processing of selecting a shutter speed used for capturing the imaging data detected by the detection processing.

Abstract: A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

Abstract: A solder paste printer for which a pressing force of squeegee 62 towards a stencil when spreading solder paste 110, that is, a printing pressure, is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.