Patents by Inventor Minoru KINUTA

Minoru KINUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11148411
    Abstract: A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: October 19, 2021
    Assignee: FUJI CORPORATION
    Inventors: Minoru Kinuta, Shoji Fukakusa, Kento Asaoka
  • Publication number: 20200093003
    Abstract: A solder paste printer for which a pressing force of squeegee 62 towards a stencil when spreading solder paste 110, that is, a printing pressure, is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.
    Type: Application
    Filed: June 17, 2016
    Publication date: March 19, 2020
    Applicant: FUJI CORPORATION
    Inventors: Minoru KINUTA, Shoji FUKAKUSA, Kento ASAOKA