Abstract: One aspect of the present invention is a multilayer ceramic capacitor including a plurality of dielectric layers composed of a dielectric ceramic containing grains whose main component is barium titanate having a core-shell structure made up of a core part and a shell part, and grains whose main component is calcium titanate having a core-shell structure made up of a core part and a shell part; and a plurality of internal electrodes stacked alternately with each of the plurality of dielectric layers.

Abstract: An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), in which the phenoxy resin (C) has an elastic modulus of 500 MPa or more at 25° C., a proportion of the phenoxy resin (C) in a total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60 mass%, a nanoindentation hardness at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 0.10 MPa or more, and the Young’s modulus at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 100 MPa or more; a film-like adhesive using the adhesive composition; and a semiconductor package using the film-like adhesive and a producing method thereof.

Abstract: A dicing die attach film including a dicing film and a die attach film laminated on the dicing film, in which the die attach film has an arithmetic average roughness Ra1 of from 0.05 to 2.50 ?m at a surface in contact with the dicing film, and a value of ratio of Ra1 to an arithmetic average roughness Ra2 at a surface that is of the die attach film and is opposite to the surface in contact with the dicing film is from 1.05 to 28.00.

Abstract: An acidic gas separation device includes: a first separation device which has an inorganic separation membrane and is configured to separate a gaseous hydrocarbon fluid containing an acidic gas into a first gaseous fluid having a large acidic gas content and a second gaseous fluid having a smaller acidic gas content than the first gaseous fluid by the inorganic separation membrane; and a second separation device which has an organic polymer separation membrane and is configured to separate the second gaseous fluid into a third gaseous fluid having a large acidic gas content and a fourth gaseous fluid having a smaller acidic gas content than the third gaseous fluid by the organic polymer separation membrane.

Abstract: A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attach film satisfies the following (a): (a) when 1.0 g of the die attach film is immersed in 10.0 mL of acetone at 4° C. for 24 hours, an amount of the organic solvent extracted into the acetone is 800 ?g or less.

Abstract: A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 ?m or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.

Abstract: A dicing die attach film, including an adhesive layer and a temporary-adhesive layer, the adhesive layer and the temporary-adhesive layer being laminated, wherein the adhesive layer is a film-like adhesive layer containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D); an elastic modulus of the phenoxy resin (C) at 25° C. is 500 MPa or more; in the adhesive layer, a proportion of the phenoxy resin (C) in total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60% by mass; a peeling strength between the adhesive layer and the temporary-adhesive layer at a range of 25 to 80° C. is 0.40 N/25 mm or less; and a thermal conductivity of the adhesive layer after thermal curing is 1.0 W/m·K or more.

Abstract: A method for producing an anisotropic conductive sheet that can be used for an inspection of a semiconductor package or a high-frequency component part, in which the pitch of wiring is narrowed and the wiring itself has been subjected to wire thinning, and that can be easily produced. A method for producing an anisotropic conductive sheet, includes a molding step of molding a conductive filler material-containing composition including (A) a conductive filler material dispersed in an organic solvent and (B) a binder resin, into a sheet-like body, and an organic solvent volatilization step of heating one surface of the sheet-like body and thereby volatilizing the organic solvent through the other surface of the sheet-like body.

Abstract: Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 ?m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m·K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m·K or higher.

Abstract: An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 ?m) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.

Abstract: An acidic gas separation device includes: a first separation device which has an inorganic separation membrane and is configured to separate a gaseous hydrocarbon fluid containing an acidic gas into a first gaseous fluid having a large acidic gas content and a second gaseous fluid having a smaller acidic gas content than the first gaseous fluid by the inorganic separation membrane; and a second separation device which has an organic polymer separation membrane and is configured to separate the second gaseous fluid into a third gaseous fluid having a large acidic gas content and a fourth gaseous fluid having a smaller acidic gas content than the third gaseous fluid by the organic polymer separation membrane.

Abstract: Provided is a method for producing an anisotropic conductive sheet that can be used for an inspection of a semiconductor package or a high-frequency component part, in which the pitch of wiring is narrowed and the wiring itself has been subjected to wire thinning, and that can be easily produced. Disclosed is a method for producing an anisotropic conductive sheet, the method including a molding step of molding a conductive filler material-containing composition including (A) a conductive filler material dispersed in an organic solvent and (B) a binder resin, into a sheet-like body, and an organic solvent volatilization step of heating one surface of the sheet-like body and thereby volatilizing the organic solvent through the other surface of the sheet-like body.

Abstract: Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 ?m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m·K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m·K or higher.

Abstract: An oil content measurement device includes a fluid device which mixes water to be treated containing oil content with a solvent and extracts the oil content into the solvent, a sensor unit which has a casing storing a quartz crystal oscillator therein with a ring-like spacer in between, a dispensing nozzle which is disposed above the oscillator at a predetermined gap there between and feeds a predetermined amount of the solvent after the oil content has been extracted on the oscillator, a sensor circuit which measures a resonance frequency of the oscillator, and controller which controls at least the fluid device and the sensor circuit. Provided is a arithmetic logical unit, based on a change amount of the received resonance frequency of the oscillator in the sensor unit to which the solvent after the oil content has been extracted has been fed, measures the oil content remaining on the oscillator.

Abstract: An oil content measurement device includes a fluid device which mixes water to be treated containing oil content with a solvent and extracts the oil content into the solvent, a sensor unit which has a casing storing a quartz crystal oscillator therein with a ring-like spacer in between, a dispensing nozzle which is disposed above the oscillator at a predetermined gap there between and feeds a predetermined amount of the solvent after the oil content has been extracted on the oscillator, a sensor circuit which measures a resonance frequency of the oscillator, and controller which controls at least the fluid device and the sensor circuit. Provided is a arithmetic logical unit, based on a change amount of the received resonance frequency of the oscillator in the sensor unit to which the solvent after the oil content has been extracted has been fed, measures the oil content remaining on the oscillator.

Abstract: [Problem] To provide a waste combustion method enabling to utilize efficiently heat energy of a large amount of a wet gas generated from a high temperature gas, which is discharged from a waste combustion furnace so as to be cooled and washed [Means for Solving Problem] A method of power generation by waste combustion comprising supplying the waste into a combustion furnace 1 for combustion, feeding a combustion gas from the combustion furnace 1 into a quenching vessel 4 containing a cooling/dissolving water and bringing the combustion exhaust gas into direct contact with the cooling/dissolving water and thus generating a wet gas wherein this wet gas G is supplied directly into a power generation system 10 employing a working medium, or a heat recovery medium, which has been exchanged with the wet gas G, is supplied into the power generation system 10, so that the power generation system is operated.

Abstract: Provided is a method of producing a feed or food product in which an inner layer is encrusted with a gelled outer layer composition, the method including the steps of: preparing an outer layer composition feedstock by adding a secondary feedstock to a protein feedstock and/or a starch feedstock that forms a gel upon heating and then mixing by stirring, and preparing an inner layer composition that is encrusted with the outer layer composition; extrusion molding with an extruder provided with a double nozzle so as to cover a surface of the inner layer composition while simultaneously gelling the outer layer composition feedstock by heat treatment; and cutting a continuously extruded cylindrically shaped product to a fixed length with a shutter mechanism while simultaneously encrusting a cut surface with the gelled outer layer composition.

Abstract: A magnetic separation apparatus comprising: a separation vessel into which waste water containing a coagulated magnetic floc is supplied; a drum separator that is provided in the separation vessel and adsorbs the magnetic floc with a magnetic force while being rotated; a scraper that is abutted against a surface of the separator and scrapes the magnetic floc adsorbed by the surface of the separator; a scraper guide that is connected to the scraper and discharges the magnetic floc scraped by the scraper; and a scraping brush that scrapes the magnetic floc scraped by the scraper from the scraper and guides the magnetic floc to the scraper guide, wherein a lower portion of the separator is submerged in the waste water in the separation vessel, a rotational direction of the separation vessel in the waste water is set to the same direction as a flow direction of the waste water flowing in the separator, and a rotational direction of the scraping brush is set to a direction opposite to the rotational direction of t

Abstract: A magnetic separation apparatus comprising: a separation vessel into which waste water containing a coagulated magnetic floc is supplied; a drum separator that is provided in the separation vessel and adsorbs the magnetic floc with a magnetic force while being rotated; a scraper that is abutted against a surface of the separator and scrapes the magnetic floc adsorbed by the surface of the separator; a scraper guide that is connected to the scraper and discharges the magnetic floc scraped by the scraper; and a scraping brush that scrapes the magnetic floc scraped by the scraper from the scraper and guides the magnetic floc to the scraper guide, wherein a lower portion of the separator is submerged in the waste water in the separation vessel, a rotational direction of the separation vessel in the waste water is set to the same direction as a flow direction of the waste water flowing in the separation vessel, and a rotational direction of the scraping brush is set to a direction opposite to the rotational dir

Abstract: [Problem] To provide a waste combustion method enabling to utilize efficiently heat energy of a large amount of a wet gas generated from a high temperature gas, which is discharged from a waste combustion furnace so as to be cooled and washed [Means for Solving Problem] A method of power generation by waste combustion comprising supplying the waste into a combustion furnace 1 for combustion, feeding a combustion gas from the combustion furnace 1 into a quenching vessel 4 containing a cooling/dissolving water and bringing the combustion exhaust gas into direct contact with the cooling/dissolving water and thus generating a wet gas wherein this wet gas G is supplied directly into a power generation system 10 employing a working medium, or a heat recovery medium, which has been exchanged with the wet gas G, is supplied into the power generation system 10, so that the power generation system is operated