Patents by Inventor Minoru Morita

Minoru Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11458435
    Abstract: An acidic gas separation device includes: a first separation device which has an inorganic separation membrane and is configured to separate a gaseous hydrocarbon fluid containing an acidic gas into a first gaseous fluid having a large acidic gas content and a second gaseous fluid having a smaller acidic gas content than the first gaseous fluid by the inorganic separation membrane; and a second separation device which has an organic polymer separation membrane and is configured to separate the second gaseous fluid into a third gaseous fluid having a large acidic gas content and a fourth gaseous fluid having a smaller acidic gas content than the third gaseous fluid by the organic polymer separation membrane.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: October 4, 2022
    Assignee: Japan Oil, Gas and Metals National Corporation
    Inventors: Yoshinori Mashiko, Minoru Morita, Takeo Kawase, Yosuke Kunishi
  • Publication number: 20220310547
    Abstract: A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attach film satisfies the following (a): (a) when 1.0 g of the die attach film is immersed in 10.0 mL of acetone at 4° C. for 24 hours, an amount of the organic solvent extracted into the acetone is 800 ?g or less.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 29, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Minoru MORITA, Yota OTANI, Hiromitsu MARUYAMA
  • Patent number: 11377546
    Abstract: The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: July 5, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Takao Tanigawa, Tetsuroh Irino, Minoru Kakitani, Kouji Morita
  • Publication number: 20220186095
    Abstract: A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 ?m or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.
    Type: Application
    Filed: March 3, 2022
    Publication date: June 16, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Minoru MORITA, Koyuki SAKAI, Keita WATAHIKI
  • Publication number: 20220077101
    Abstract: A dicing die attach film, including an adhesive layer and a temporary-adhesive layer, the adhesive layer and the temporary-adhesive layer being laminated, wherein the adhesive layer is a film-like adhesive layer containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D); an elastic modulus of the phenoxy resin (C) at 25° C. is 500 MPa or more; in the adhesive layer, a proportion of the phenoxy resin (C) in total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60% by mass; a peeling strength between the adhesive layer and the temporary-adhesive layer at a range of 25 to 80° C. is 0.40 N/25 mm or less; and a thermal conductivity of the adhesive layer after thermal curing is 1.0 W/m·K or more.
    Type: Application
    Filed: November 18, 2021
    Publication date: March 10, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Minoru MORITA
  • Patent number: 11198771
    Abstract: A method for producing an anisotropic conductive sheet that can be used for an inspection of a semiconductor package or a high-frequency component part, in which the pitch of wiring is narrowed and the wiring itself has been subjected to wire thinning, and that can be easily produced. A method for producing an anisotropic conductive sheet, includes a molding step of molding a conductive filler material-containing composition including (A) a conductive filler material dispersed in an organic solvent and (B) a binder resin, into a sheet-like body, and an organic solvent volatilization step of heating one surface of the sheet-like body and thereby volatilizing the organic solvent through the other surface of the sheet-like body.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: December 14, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Minoru Morita
  • Patent number: 11139261
    Abstract: Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 ?m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m·K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m·K or higher.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: October 5, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Minoru Morita, Noriyuki Kirikae
  • Publication number: 20210292617
    Abstract: An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 ?m) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Minoru MORITA
  • Publication number: 20210129074
    Abstract: An acidic gas separation device includes: a first separation device which has an inorganic separation membrane and is configured to separate a gaseous hydrocarbon fluid containing an acidic gas into a first gaseous fluid having a large acidic gas content and a second gaseous fluid having a smaller acidic gas content than the first gaseous fluid by the inorganic separation membrane; and a second separation device which has an organic polymer separation membrane and is configured to separate the second gaseous fluid into a third gaseous fluid having a large acidic gas content and a fourth gaseous fluid having a smaller acidic gas content than the third gaseous fluid by the organic polymer separation membrane.
    Type: Application
    Filed: June 18, 2018
    Publication date: May 6, 2021
    Applicant: Japan Oil, Gas and Metals National Corporation
    Inventors: Yoshinori MASHIKO, Minoru MORITA, Takeo KAWASE, Yosuke KUNISHI
  • Publication number: 20200308354
    Abstract: Provided is a method for producing an anisotropic conductive sheet that can be used for an inspection of a semiconductor package or a high-frequency component part, in which the pitch of wiring is narrowed and the wiring itself has been subjected to wire thinning, and that can be easily produced. Disclosed is a method for producing an anisotropic conductive sheet, the method including a molding step of molding a conductive filler material-containing composition including (A) a conductive filler material dispersed in an organic solvent and (B) a binder resin, into a sheet-like body, and an organic solvent volatilization step of heating one surface of the sheet-like body and thereby volatilizing the organic solvent through the other surface of the sheet-like body.
    Type: Application
    Filed: June 16, 2020
    Publication date: October 1, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Minoru MORITA
  • Publication number: 20190181113
    Abstract: Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 ?m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m·K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m·K or higher.
    Type: Application
    Filed: February 5, 2019
    Publication date: June 13, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Minoru MORITA, Noriyuki KIRIKAE
  • Patent number: 9989513
    Abstract: An oil content measurement device includes a fluid device which mixes water to be treated containing oil content with a solvent and extracts the oil content into the solvent, a sensor unit which has a casing storing a quartz crystal oscillator therein with a ring-like spacer in between, a dispensing nozzle which is disposed above the oscillator at a predetermined gap there between and feeds a predetermined amount of the solvent after the oil content has been extracted on the oscillator, a sensor circuit which measures a resonance frequency of the oscillator, and controller which controls at least the fluid device and the sensor circuit. Provided is a arithmetic logical unit, based on a change amount of the received resonance frequency of the oscillator in the sensor unit to which the solvent after the oil content has been extracted has been fed, measures the oil content remaining on the oscillator.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: June 5, 2018
    Assignee: HITACHI, LTD.
    Inventors: Hajime Kato, Shigeki Terui, Minoru Morita, Yoshio Nakayama, Makoto Onishi
  • Publication number: 20170030885
    Abstract: An oil content measurement device includes a fluid device which mixes water to be treated containing oil content with a solvent and extracts the oil content into the solvent, a sensor unit which has a casing storing a quartz crystal oscillator therein with a ring-like spacer in between, a dispensing nozzle which is disposed above the oscillator at a predetermined gap there between and feeds a predetermined amount of the solvent after the oil content has been extracted on the oscillator, a sensor circuit which measures a resonance frequency of the oscillator, and controller which controls at least the fluid device and the sensor circuit. Provided is a arithmetic logical unit, based on a change amount of the received resonance frequency of the oscillator in the sensor unit to which the solvent after the oil content has been extracted has been fed, measures the oil content remaining on the oscillator.
    Type: Application
    Filed: June 21, 2016
    Publication date: February 2, 2017
    Applicant: HITACHI, LTD.
    Inventors: Hajime KATO, Shigeki TERUI, Minoru MORITA, Yoshio NAKAYAMA, Makoto ONISHI
  • Patent number: 8893498
    Abstract: [Problem] To provide a waste combustion method enabling to utilize efficiently heat energy of a large amount of a wet gas generated from a high temperature gas, which is discharged from a waste combustion furnace so as to be cooled and washed [Means for Solving Problem] A method of power generation by waste combustion comprising supplying the waste into a combustion furnace 1 for combustion, feeding a combustion gas from the combustion furnace 1 into a quenching vessel 4 containing a cooling/dissolving water and bringing the combustion exhaust gas into direct contact with the cooling/dissolving water and thus generating a wet gas wherein this wet gas G is supplied directly into a power generation system 10 employing a working medium, or a heat recovery medium, which has been exchanged with the wet gas G, is supplied into the power generation system 10, so that the power generation system is operated.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: November 25, 2014
    Assignee: Tsukishima Kankyo Engineering Ltd.
    Inventors: Minoru Morita, Jun Hidari, Yoshinobu Sato, Mai Matsuda
  • Publication number: 20140287124
    Abstract: Provided is a method of producing a feed or food product in which an inner layer is encrusted with a gelled outer layer composition, the method including the steps of: preparing an outer layer composition feedstock by adding a secondary feedstock to a protein feedstock and/or a starch feedstock that forms a gel upon heating and then mixing by stirring, and preparing an inner layer composition that is encrusted with the outer layer composition; extrusion molding with an extruder provided with a double nozzle so as to cover a surface of the inner layer composition while simultaneously gelling the outer layer composition feedstock by heat treatment; and cutting a continuously extruded cylindrically shaped product to a fixed length with a shutter mechanism while simultaneously encrusting a cut surface with the gelled outer layer composition.
    Type: Application
    Filed: October 19, 2012
    Publication date: September 25, 2014
    Inventors: Tsuyoshi Goto, Kazuya Shimizu, Hiromi Ito, Minoru Morita, Yuji Takayama
  • Patent number: 8562829
    Abstract: A magnetic separation apparatus comprising: a separation vessel into which waste water containing a coagulated magnetic floc is supplied; a drum separator that is provided in the separation vessel and adsorbs the magnetic floc with a magnetic force while being rotated; a scraper that is abutted against a surface of the separator and scrapes the magnetic floc adsorbed by the surface of the separator; a scraper guide that is connected to the scraper and discharges the magnetic floc scraped by the scraper; and a scraping brush that scrapes the magnetic floc scraped by the scraper from the scraper and guides the magnetic floc to the scraper guide, wherein a lower portion of the separator is submerged in the waste water in the separation vessel, a rotational direction of the separation vessel in the waste water is set to the same direction as a flow direction of the waste water flowing in the separator, and a rotational direction of the scraping brush is set to a direction opposite to the rotational direction of t
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: October 22, 2013
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Hisashi Isogami, Satoshi Miyabayashi, Minoru Morita
  • Publication number: 20110215041
    Abstract: A magnetic separation apparatus comprising: a separation vessel into which waste water containing a coagulated magnetic floc is supplied; a drum separator that is provided in the separation vessel and adsorbs the magnetic floc with a magnetic force while being rotated; a scraper that is abutted against a surface of the separator and scrapes the magnetic floc adsorbed by the surface of the separator; a scraper guide that is connected to the scraper and discharges the magnetic floc scraped by the scraper; and a scraping brush that scrapes the magnetic floc scraped by the scraper from the scraper and guides the magnetic floc to the scraper guide, wherein a lower portion of the separator is submerged in the waste water in the separation vessel, a rotational direction of the separation vessel in the waste water is set to the same direction as a flow direction of the waste water flowing in the separation vessel, and a rotational direction of the scraping brush is set to a direction opposite to the rotational dir
    Type: Application
    Filed: March 4, 2011
    Publication date: September 8, 2011
    Inventors: Hisashi ISOGAMI, Satoshi Miyabayashi, Minoru Morita
  • Publication number: 20110209478
    Abstract: [Problem] To provide a waste combustion method enabling to utilize efficiently heat energy of a large amount of a wet gas generated from a high temperature gas, which is discharged from a waste combustion furnace so as to be cooled and washed [Means for Solving Problem] A method of power generation by waste combustion comprising supplying the waste into a combustion furnace 1 for combustion, feeding a combustion gas from the combustion furnace 1 into a quenching vessel 4 containing a cooling/dissolving water and bringing the combustion exhaust gas into direct contact with the cooling/dissolving water and thus generating a wet gas wherein this wet gas G is supplied directly into a power generation system 10 employing a working medium, or a heat recovery medium, which has been exchanged with the wet gas G, is supplied into the power generation system 10, so that the power generation system is operated
    Type: Application
    Filed: November 6, 2009
    Publication date: September 1, 2011
    Inventors: Minoru Morita, Jun Hidari, Yoshinobu Sato, Mai Matsuda
  • Patent number: 7371320
    Abstract: A magnetic separation unit can prevent any magnetic flocs deposited on an inner wall of a water passing pipe from closing a water channel for stabilizing a magnetic separation performance and reduce cost by a small-diameter portion of the water passing pipe. The magnetic separation unit has an air-core solenoid type magnet provided around the water passing pipe guiding, from a lower side, treated water including magnetic flocs in which contaminants and magnetic particles are flocculated, a rotating disc type magnetic filter case provided above the air-core solenoid type magnet for attracting the magnetic flocs in the treated water supplied from the water passing pipe and flushing means for flushing the matrixes to which the magnetic flocs are attracted. The water passing pipe has a small-diameter pipe positioned in the air-core solenoid type magnet, and an enlarged pipe enlarged from the small-diameter pipe toward a water passing part of the rotating disc type magnetic filter case.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: May 13, 2008
    Assignees: Hitachi Plant Technologies, Ltd., T-Tec Co., Ltd.
    Inventors: Hiroaki Yoda, Satoshi Yumoto, Minoru Morita
  • Publication number: 20080011574
    Abstract: A clutch structure of a mechanical automatic transmission capable of suppressing the occurrence of vibration by preventing the pressing force of a clutch from being interfered with a thrust force generated by helical gears, wherein a pressing device pressing a disk in a direction opposite to the axial thrust force generated by the engagement of the first gear with the second gear is formed of a disk pressing device and a counterforce imparting pressing device pressing a clutch hub in a direction opposite to the thrust force.
    Type: Application
    Filed: April 30, 2004
    Publication date: January 17, 2008
    Applicant: Hitachi, Ltd.
    Inventors: Masaru Yamasaki, Hitoshi Konno, Hiroshi Kuroiwa, Naoyuki Ozaki, Minoru Morita