Abstract: [Task] To provide an automatic ice maker with improved corrosion resistance to prevent ice-making water and ice from being contaminated by a corrosion product such as rust, thereby enhancing the reliability of food sanitation. [Means for solution] The automatic ice maker produces ice having a required shape by supplying ice-making water in circulation to an ice compartment 10 that is cooled by a cooling pipe 48. The automatic ice maker has an electroless nickel-phosphorus plated coating 23 formed in a thickness of 15 ?m or more on an outermost layer of the ice compartment 10, which coating 23 contains a 10% to 15% phosphorus component.

Abstract: [Task] To provide an automatic ice maker with improved corrosion resistance to prevent ice-making water and ice from being contaminated by a corrosion product such as rust, thereby enhancing the reliability of food sanitation. [Means for solution] The automatic ice maker produces ice having a required shape by supplying ice-making water in circulation to an ice compartment 10 that is cooled by a cooling pipe 48. The automatic ice maker has an electroless nickel-phosphorus plated coating 23 formed in a thickness of 15 ?m or more on an outermost layer of the ice compartment 10, which coating 23 contains a 10% to 15% phosphorus component.

Abstract: An open/close control system for an inspection lid adapted not to open while a vehicle travels. An emergency release device is provided behind the inspection lid, where the emergency release device disables power transmission of a driver which opens and closes a side entrance/exit door of a railway vehicle. The emergency release device is installed in a space inside a wall surface inside the vehicle, and the space can be opened and closed by the inspection lid. The open/close control system has a locking device provided in the space inside the wall surface in order to restrict rotation of the inspection lid, and also has an open/close controller which detects traveling of the railway vehicle to actuate the locking device.

Abstract: An open/close control system for an inspection lid adapted not to open while a vehicle travels. The open/close control system has emergency release means which disables power transmission of drive means for opening and closing a side entrance/exit door of a railway vehicle. The emergency release means is installed in a space inside a wall surface inside the vehicle, and the space can be opened and closed by the inspection lid. The emergency release means has locking devices provided in the space inside the wall surface in order to restrict rotation of the inspection lid, and also has an open/close controller for detecting traveling of the railway vehicle to actuate the locking device.

Abstract: Present invention provides a diagnostic means for testing infection of adult in humans parasitized with adult Taenia solium and Taenia saginata. It was found that a hydrophobic ligand binding protein (HLBP) derived from an adult separated from tapeworms has an antigenicity. The present invention is a clinical diagnostic reagent for testing infection of adult Taenia solium and Taenia saginata, comprising, as a main ingredient, (a) a peptide containing at least residues 22-65 of residues 20-85 of any amino acid sequence of SEQ ID NOs: 1 to 4 or (b) a peptide containing an amino acid sequence of SEQ ID NO: 5. It is possible to examine the adult infection of Taenia solium and Taenia saginata by reacting the clinical diagnostic reagent with serum from a subject (human).

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 ?m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 ?m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 ?m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;M or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: Disclosed is a development device comprising a development sleeve of a non-magnetic material, a magnet having a plurality of magnetic poles and fixed within the sleeve, a mechanism for rotating the sleeve, a mechanism for agitating a developer composed of a magnetic carrier and a chargeable toner and supplying it to the sleeve, a mechanism for adjusting a magnetic brush formed on the sleeve to a predetermined brush length and supplying it to a development zone, and a mechanism for scraping off the magnetic brush which has gone past the development zone from the sleeve, said magnetic poles consisting of a main pole for development corresponding to the development zone and poles for conveying corresponding to a conveying zone ranging from the position of supplying the developer to the position of cutting the magnetic brush, said magnetic carrier being a ferrite carrier, and each said conveying magnetic pole having a magnetic flux density 50 to 86% of that of the main pole for development.