Abstract: A cooling system for maintaining the temperature within electronic equipment has a circulation system for pumping a cooling liquid, such as water, through the electronic equipment where it picks up heat generated by the electronic equipment. The cooling liquid is pumped through a plurality of heat exchangers using a refrigerant which is, in turn, pumped through a compressor-condensor combination, each heat exchanger having approximately the same cooling capacity. A central control selects the number of heat exchangers which are to operate at any given time, on a basis of the differential in the temperature of the water being pumped into and out of the electronic equipment. This maintains a desired and relatively wide range of temperatures. A heating element selectively and controllably heats the cooled water to bring the wide range of temperatures to a selected and fixed temperature.

Abstract: A mounting structure for electronic circuit modules includes electronic circuit modules each having a back panel, heat-generating electronic components each having a heat sink for heat radiation and mounted on one surface of the back panel, and first connectors mounted on the other surface of the back panel. A frame has first holes and a hollow inside structure for mounting the electronic circuit modules. Cable assemblies having second connectors at their ends pass through one of the first holes to connect with the first connectors within the frame. The electronic circuit modules are mounted onto the frame. The modules may be mounted onto the frame by second holes penetrating the back panel and guide pins formed on the frame in one-to-one correspondence with the second holes. A heat radiating structure may include openings opposed to the heat sinks in one-to-one correspondence, and fans for sucking air from the vicinity of the heat sinks into the inside of the heat radiating structure through the openings.