Abstract: A temperature regulation plate 106 is divided into at least two areas, a heater 408 for applying a temperature load in correspondence with such areas and its control system are divided and controlled independently to set temperatures, and a cooling source is controlled by comparing the measurements from temperature sensors 409 arranged in respective areas for controlling the heater 408 and switching the measurement for calculating the control output sequentially thus reducing variation in in-plane temperature of a wafer due to heating when an electric load is applied. Since consumption and burning of a probe are prevented, highly reliable wafer level burn-in method and apparatus can be provided.

Abstract: Provided is a probe card for semiconductor IC test on one principal surface of which are formed a plurality of probe electrodes, such as bump electrodes (5), and which has, in a peripheral portion thereof, a thin film sheet (9) fixed to a support, such as a ceramics ring (7). A local tension-changed portion (12) is formed in the thin film sheet (9) fixed to the ceramics ring (7) so that a tensile strain is generated, and the plurality of bump electrodes (5) are arranged in prescribed positions that connect electrically to electrodes of each semiconductor IC element of the semiconductor wafer. The tensile strain of the thin film sheet (9) is changed positively and in a sustained manner, whereby the bump electrodes (5) are rearranged in desired positions.

Abstract: Temperature control in wafer-level burn-in is performed such that a set temperature used for the temperature control is corrected using a correction value calculated from the generated heat density of a wafer (101). Thus it is possible to eliminate a difference between the temperature of the wafer heated when an electrical load is applied and a control temperature for applying a thermal load, not depending on the distribution of good devices formed on the wafer (101) and the power consumption of the devices. As a result, the wear and burn of a probe can be prevented and highly reliable screening can be achieved.

Abstract: A temperature regulation plate 106 is divided into at least two areas, a heater 408 for applying a temperature load in correspondence with such areas and its control system are divided and controlled independently to set temperatures, and a cooling source is controlled by comparing the measurements from temperature sensors 409 arranged in respective areas for controlling the heater 408 and switching the measurement for calculating the control output sequentially thus reducing variation in in-plane temperature of a wafer due to heating when an electric load is applied. Since consumption and burning of a probe are prevented, highly reliable wafer level burn-in method and apparatus can be provided.

Abstract: Provided is a probe card for semiconductor IC test on one principal surface of which are formed a plurality of probe electrodes, such as bump electrodes (5), and which has, in a peripheral portion thereof, a thin film sheet (9) fixed to a support, such as a ceramics ring (7). A local tension-changed portion (12) is formed in the thin film sheet (9) fixed to the ceramics ring (7) so that a tensile strain is generated, and the plurality of bump electrodes (5) are arranged in prescribed positions that connect electrically to electrodes of each semiconductor IC element of the semiconductor wafer. The tensile strain of the thin film sheet (9) is changed positively and in a sustained manner, whereby the bump electrodes (5) are rearranged in desired positions.

Abstract: A semiconductor test device comprises a substrate having a opposed-wafer surface on which a semiconductor wafer with a plurality of the embedded semiconductor devices is placing opposite when a burn-in test is implemented, a wiring layer provided on the substrate, and a temperature sensor for measuring a temperature of the semiconductor wafer in the state here the semiconductor wafer is placing opposite on the substrate, wherein the wiring layer includes a wiring which is connected to the semiconductor wafer in the state where the semiconductor wafer is placing opposite on the substrate, and supplies a signal and a voltage for the burn-in test to the semiconductor wafer, and the temperature sensor is provided on the substrate in vicinity of the opposed-wafer surface.

Abstract: The present invention provides a motor and a stator structure of the motor and an assembly method of the stator structure and a method of installing the motor. The stator structure of the motor contains a stator substrate having a double-layer structure of a printed circuit board and a magnetic plate jointed together at a plurality of calking sections, wherein a centroid is determined with respect to the plurality of calking sections on the printed circuit board, and a vacant area having no electric parts provided is determined nearby the centroid on the printed circuit board to allow the vacant area to be supported by a retainer of a calking jig.

Abstract: The invention relates to an antibiotic comprising a compound having the formula: ##STR1## wherein R.sup.1 is a straight chain, branched chain, or cyclic lower alkyl group which may be substituted by a carboxyl group, and R.sup.2 designates vicinal dihydroxyl groups or diacetoxy groups; or a pharmaceutically acceptable salt, physiologically hydrolyzable ester or solvate thereof.