Abstract: The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more.

Abstract: A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern.

Abstract: A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern.

Abstract: It is an object of the present invention to provide a curable resin composition for a column spacer which has excellent developability and solubility and is capable of forming a clearly patterned column spacer without leaving a development residue at the time of pattern formation of the column spacer to be used in producing a liquid crystal display panel. The present invention is directed to a curable resin composition for a column spacer, which contains a compound having two or more polymerizable unsaturated bonds in a molecule, an alkali-soluble polymer compound, and a photo-reaction initiator, the compound having two or more polymerizable unsaturated bonds in a molecule being an oxide-modified compound having two or more polymerizable unsaturated bonds in a molecule.

Abstract: An object of the present invention is to provide the column spacer capable of forming a liquid crystal display element which does not produce the color irregularity due to gravity defect and the cold bubbling and exhibits the high durability when the column spacer is used as a spacer for maintaining a gap between two glass substrates at a constant distance in a liquid crystal display element, the liquid crystal display element using the column spacers and the curable resin composition for column spacers from which the column spacer can be produced. The present invention is directed a column spacer for maintaining a gap between two glass substrates at a constant distance in a liquid crystal display element, which comprises an elastic modulus of 0.2 to 1.0 GPa in compressing by 15% at 25° C.

Abstract: The present invention is an electrically conductive paint composition comprising 100 parts by weight of a (meth)acrylate compound having at least two (meth)acryloyl groups in one molecule, 0.1 to 30 parts by weight of a particulate anilinic electrically conductive polymer, 1 to 100 parts by weight of an alkyl (meth)acrylate resin, 0.01 to 10 parts by weight of a photopolymerization initiator and 0 to 2000 parts by weight of an organic solvent. The compositions can be easily cured by active rays of light. The resulting electrically conductive film is excellent in surface hardness, transparency, resistance to chemicals, and abrasion resistance, and the paint compositions being excellent in storability. Thus, the electrically conductive paint compositions are suitable for antistatic materials in semiconductor-preparating processes.

Abstract: A transparent conductive coating composition comprises a conductive powder (a) and a binder resin (b) containing (meth)acrylate compound as a main component. The composition may further comprise a dispersant (c), a photopolymerization initiator (d) or a titanium coupling agent (e). A transparent antistatic molded article is made of a substrate having a transparent conductive film comprising the transparent conductive coating composition described above.

Abstract: An electrically conductive composition of the invention comprises 100 parts by weight of a (meth)acrylate compound possessing at least two (meth)acryloyl groups, 1 to 100 parts by weight of an anilinic electrically conductive polymer, and 0.1 to 20 parts by weight of a photopolymerization initiator sensitized by active rays. This electrically conductive composition may also comprise an unsaturated compound possessing any one group selected from the group consisting of a phosphoric acid group, a sulfonic acid group and a carboxyl group. Between the surface of a form to be coated and the coating layer made of the electrically conductive composition formed thereon, an inorganic electrically conductive layer composed of the tin oxide powder containing antimony with mean particle size of 0.01 to 0.4 .mu.m, or the barium sulfate powder coated with tin oxide containing antimony with mean particle size of 0.01 to 2 .mu.m, and a synthetic resin may be provided.

Abstract: The present invention provides a photo-setting conductive coating composition which is used as an antistatic material constituting articles wherein static electrification must be avoided, such as storage vessels for semi-conductor wafers, electronic/electric parts, floor/wall coverings for a production factory of semi-conductors, etc.The photo-setting conductive coating composition comprising 100 parts by weight of an antimony oxide-containing tin oxide powder (a) having a particle size of 0.01 to 0.4 .mu.m, 10 to 100 parts by weight of a (meth)acrylate compound (b) having at least two (meth)acryloyl groups in a molecule, 10 to 100 parts by weight of an acetal resin (c) having a residual hydroxyl group of 20 to 80 molar %, 0.1 to 10 parts by weight of a photopolymerization initiator (d) and 100 to 1000 parts by weight of an organic solvent (e).