Abstract: A battery capable of changing its form safely is provided. A bendable battery having a larger thickness is provided. A battery with increased capacity is provided. For an exterior body of the battery, a film in the shape of a periodic wave in one direction is used. A space is provided in an area surrounded by the exterior body and between an end portion of the electrode stack that is not fixed and an interior wall of the exterior body. Furthermore, the phases of waves of a pair of portions of the exterior body between which the electrode stack is located are different from each other. In particular, the phases are different from each other by 180 degrees so that wave crest lines overlap with each other and wave trough lines overlap with each other.

Abstract: A secondary battery, suitable for a portable information terminal or a wearable device is provided. An electronic device having a novel structure which can have various forms and a secondary battery that fits the forms of the electronic device are provided. In the secondary battery, sealing is performed using a film provided with depressions or projections that ease stress on the film due to application of external force. A pattern of depressions or projections is formed on the film by pressing, e.g., embossing.

Abstract: In a microstrip antenna in which a ground conductor is provided to be opposed to patch conductors, wedge shapes angled to intersect with an antenna polarization plane are provided at edges of the ground conductor in a repeated manner.

Abstract: An emblem includes a first thickness portion having a first thickness and a second thickness portion having a second thickness thinner than the first thickness. The first thickness is equal to an integral multiple of a half of an in-medium wavelength of the radar wave inside the first thickness portion. The second thickness is a thickness equal to an integral multiple of a half of the in-medium wavelength of the radar wave inside the second thickness portion. A difference between the first thickness and the second thickness is set to an integral multiple of a free-space wavelength of the radar wave.

Abstract: In a microstrip antenna in which a ground conductor is provided to be opposed to patch conductors, wedge shapes angled to intersect with an antenna polarization plane are provided at edges of the ground conductor in a repeated manner.

Abstract: An emblem includes a first thickness portion having a first thickness and a second thickness portion having a second thickness thinner than the first thickness. The first thickness is equal to an integral multiple of a half of an in-medium wavelength of the radar wave inside the first thickness portion. The second thickness is a thickness equal to an integral multiple of a half of the in-medium wavelength of the radar wave inside the second thickness portion. A difference between the first thickness and the second thickness is set to an integral multiple of a free-space wavelength of the radar wave.

Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.

Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.

Abstract: A balun includes a first conductive layer disposed on a top surface of a substrate, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, a substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and the third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.

Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.

Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.

Abstract: An object of the invention is to provide a disc holding apparatus which can securely hold an information recording disc and effectively prevent a breakage from being generated at a time of being taken out. In a disc holding apparatus provided within a main body and provided for holding an information recording disc, the disc holding apparatus is provided with a holding body protruded from the main body by a supporting line having an elasticity, provided so as to move close to and apart from the main body and engaging with a center hole of the disc in such a manner as to put in and take out with respect to an inner portion of the center hole, and a disc receiving portion for receiving the disc is provided so as to protrude from the main body at a time when the holding body moves close to a side of the main body, in an outer side of the holding body.

Abstract: A pair of dielectric windows are respectively formed in a side wall of a metallic package of an optical module in an almost U shape on the side wall surface by packing a dielectric substance in the dielectric windows, and each dielectric window is used as a feed through unit through which a high-frequency signal or a voltage signal is transmitted from the outside to an optical semiconductor element of the optical module. An electromagnetic wave can be transmitted through each dielectric window, and a cutoff frequency of the dielectric window for the electromagnetic wave is considerably lowered as compared with that of a rectangular electromagnetic window in which a length of a longer side is the same as that of the dielectric window.

Abstract: A balun comprises a first conductive layer disposed on a top surface of a substrate, the first conductive layer having first and second end portions, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, the first end portion of the second conductive layer serving as a balanced transmission line in cooperation with the first end portion of the first conductive layer, the substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and a second end portion that serves as an unbalanced transmission line in cooperation with the second end portion of the first conductive layer, and the third c

Abstract: An optical signal is output from an optical semiconductor element according to a high frequency signal. The optical semiconductor element is surrounded by a metallic package having a package base, a package cover and a seal ring so as to separate the optical semiconductor element from the outside air. An electromagnetic wave absorptive element is arranged on an inner surface of the metallic package to attenuate the high frequency signal leaking into the cavity of the metallic package, and the electromagnetic wave absorptive element is covered with a seal element so as to hermetically seal the electromagnetic wave absorptive element from the cavity. The seal element allows the high frequency signal to be transmitted through the seal element. The high frequency signal leaking into the cavity is transmitted through the seal element and is converted into heat energy in the electromagnetic wave absorptive element.

Abstract: An object of the invention is to provide a disc holding apparatus which can securely hold an information recording disc and effectively prevent a breakage from being generated at a time of being taken out. In a disc holding apparatus provided within a main body and provided for holding an information recording disc, the disc holding apparatus is provided with a holding body protruded from the main body by a supporting line having an elasticity, provided so as to move close to and apart from the main body and engaging with a center hole of the disc in such a manner as to put in and take out with respect to an inner portion of the center hole, and a disc receiving portion for receiving the disc is provided so as to protrude from the main body at a time when the holding body moves close to a side of the main body, in an outer side of the holding body.

Abstract: A DC block circuit comprises a conductive line (3) disposed on one surface of a dielectric substrate (1), via which an electrical signal is passed, an interdigital capacitor (6) forming a part of the conductive line (3), and a chip capacitor (4) that is disposed so that the interdigital capacitor (6) is sandwiched between the chip capacitor (4) and the dielectric substrate (1), and that is connected to the conductive line (3) so that the chip capacitor (4) is in parallel with the interdigital capacitor (6).

Abstract: A polyolefin-based matte film or sheet can be prepared from a polymeric blend of the preset invention comprising a propylene polymer or copolymer as component (A), a specific ethylene-.alpha.-olefin copolymer (E.alpha.O, so-called "super low-density polyethylene") as component (B), and a high-pressure radical polymerization process ethylene polymer or copolymer and/or a modified polyolefin-based resin as component (C). The above blend of the present invention may further comprise an inorganic filler as component (D) and a flame retardant as component (E). The matte films or sheets prepared from these polymeric blends are excellent in tensile modulus, flexibility, impact resistance, thermal resistance, laminating properties, flame resistance, chalking resistance, covering power, scratch resistance, and widely used for fabricating adhesive tapes, covers or cases for stationery, fashion bags, sheets for interior finish work in construction and automobile industries, and sheets for dressing steel plates.

Abstract: The present invention provides a polypropylene film having high transparency and heat-sealability and superior in the balance between stiffness (tensile modulus) and impact resistance which polypropylene film comprises a) 80-99.5% by weight of a propylene polymer and b) 0.5-20% by weight of an ethylene/.alpha.-olefin copolymer prepared by the copolymerization of ethylene and an .alpha.-olefin having a 3 to 12 carbon atoms, said ethylene/.alpha.-olefin copolymer satisfying the following conditions (i) to (iii):(i) a density of 0.860 to 0.910 g/cm.sup.3 ;(ii) a maximum peak temperature of not lower than 100.degree. C. as measured by differential scanning calorimetry (DSC); and(iii) an insolubles content in boiling n-hexane of not lower than 10% by weight.

Abstract: In a microstrip antenna in which a ground conductor is provided to be opposed to patch conductors, wedge shapes angled to intersect with an antenna polarization plane are provided at edges of the ground conductor in a repeated manner.