Patents by Inventor Minoru Tajima

Minoru Tajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11101492
    Abstract: In the case where a film, which has lower strength than a metal can, is used as an exterior body of a secondary battery, a current collector provided in a region surrounded by the exterior body, an active material layer provided on a surface of the current collector, or the like might be damaged when force is externally applied to the secondary battery. A secondary battery that is durable even when force is externally applied thereto is provided. A cushioning material is provided in a region surrounded by an exterior body of a secondary battery. Specifically, a cushioning material is provided on the periphery of a current collector such that a sealing portion of an exterior body (film) is located outside the cushioning material.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: August 24, 2021
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Minoru Takahashi, Ryota Tajima, Takuya Miwa, Yuugo Goto
  • Patent number: 8907848
    Abstract: In a microstrip antenna in which a ground conductor is provided to be opposed to patch conductors, wedge shapes angled to intersect with an antenna polarization plane are provided at edges of the ground conductor in a repeated manner.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: December 9, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Minoru Tajima
  • Patent number: 8487820
    Abstract: An emblem includes a first thickness portion having a first thickness and a second thickness portion having a second thickness thinner than the first thickness. The first thickness is equal to an integral multiple of a half of an in-medium wavelength of the radar wave inside the first thickness portion. The second thickness is a thickness equal to an integral multiple of a half of the in-medium wavelength of the radar wave inside the second thickness portion. A difference between the first thickness and the second thickness is set to an integral multiple of a free-space wavelength of the radar wave.
    Type: Grant
    Filed: January 21, 2008
    Date of Patent: July 16, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventor: Minoru Tajima
  • Publication number: 20120256795
    Abstract: In a microstrip antenna in which a ground conductor is provided to be opposed to patch conductors, wedge shapes angled to intersect with an antenna polarization plane are provided at edges of the ground conductor in a repeated manner.
    Type: Application
    Filed: February 1, 2011
    Publication date: October 11, 2012
    Applicant: Mitsubishi Electric Corporation
    Inventor: Minoru Tajima
  • Publication number: 20100085271
    Abstract: An emblem includes a first thickness portion having a first thickness and a second thickness portion having a second thickness thinner than the first thickness. The first thickness is equal to an integral multiple of a half of an in-medium wavelength of the radar wave inside the first thickness portion. The second thickness is a thickness equal to an integral multiple of a half of the in-medium wavelength of the radar wave inside the second thickness portion. A difference between the first thickness and the second thickness is set to an integral multiple of a free-space wavelength of the radar wave.
    Type: Application
    Filed: January 21, 2008
    Publication date: April 8, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Minoru Tajima
  • Patent number: 6963123
    Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: November 8, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toru Nagase, Minoru Tajima, Nobuhiro Tokumori
  • Patent number: 6940155
    Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: September 6, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toru Nagase, Minoru Tajima, Nobuhiro Tokumori
  • Patent number: 6646518
    Abstract: A balun includes a first conductive layer disposed on a top surface of a substrate, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, a substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and the third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: November 11, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Minoru Tajima
  • Publication number: 20030197257
    Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.
    Type: Application
    Filed: May 2, 2003
    Publication date: October 23, 2003
    Inventors: Toru Nagase, Minoru Tajima, Nobuhiro Tokumori
  • Publication number: 20030122228
    Abstract: There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.
    Type: Application
    Filed: May 22, 2002
    Publication date: July 3, 2003
    Inventors: Toru Nagase, Minoru Tajima, Nobuhiro Tokumori
  • Patent number: 6550612
    Abstract: An object of the invention is to provide a disc holding apparatus which can securely hold an information recording disc and effectively prevent a breakage from being generated at a time of being taken out. In a disc holding apparatus provided within a main body and provided for holding an information recording disc, the disc holding apparatus is provided with a holding body protruded from the main body by a supporting line having an elasticity, provided so as to move close to and apart from the main body and engaging with a center hole of the disc in such a manner as to put in and take out with respect to an inner portion of the center hole, and a disc receiving portion for receiving the disc is provided so as to protrude from the main body at a time when the holding body moves close to a side of the main body, in an outer side of the holding body.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: April 22, 2003
    Inventor: Minoru Tajima
  • Publication number: 20030039456
    Abstract: A pair of dielectric windows are respectively formed in a side wall of a metallic package of an optical module in an almost U shape on the side wall surface by packing a dielectric substance in the dielectric windows, and each dielectric window is used as a feed through unit through which a high-frequency signal or a voltage signal is transmitted from the outside to an optical semiconductor element of the optical module. An electromagnetic wave can be transmitted through each dielectric window, and a cutoff frequency of the dielectric window for the electromagnetic wave is considerably lowered as compared with that of a rectangular electromagnetic window in which a length of a longer side is the same as that of the dielectric window.
    Type: Application
    Filed: February 4, 2002
    Publication date: February 27, 2003
    Inventor: Minoru Tajima
  • Publication number: 20020196096
    Abstract: A balun comprises a first conductive layer disposed on a top surface of a substrate, the first conductive layer having first and second end portions, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, the first end portion of the second conductive layer serving as a balanced transmission line in cooperation with the first end portion of the first conductive layer, the substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and a second end portion that serves as an unbalanced transmission line in cooperation with the second end portion of the first conductive layer, and the third c
    Type: Application
    Filed: October 16, 2001
    Publication date: December 26, 2002
    Inventor: Minoru Tajima
  • Publication number: 20020172476
    Abstract: An optical signal is output from an optical semiconductor element according to a high frequency signal. The optical semiconductor element is surrounded by a metallic package having a package base, a package cover and a seal ring so as to separate the optical semiconductor element from the outside air. An electromagnetic wave absorptive element is arranged on an inner surface of the metallic package to attenuate the high frequency signal leaking into the cavity of the metallic package, and the electromagnetic wave absorptive element is covered with a seal element so as to hermetically seal the electromagnetic wave absorptive element from the cavity. The seal element allows the high frequency signal to be transmitted through the seal element. The high frequency signal leaking into the cavity is transmitted through the seal element and is converted into heat energy in the electromagnetic wave absorptive element.
    Type: Application
    Filed: October 10, 2001
    Publication date: November 21, 2002
    Inventors: Tohru Nagase, Minoru Tajima, Hiroshi Aruga, Hideyuki Oohashi, Masaki Noda, Shinichi Kaneko
  • Publication number: 20020162760
    Abstract: An object of the invention is to provide a disc holding apparatus which can securely hold an information recording disc and effectively prevent a breakage from being generated at a time of being taken out. In a disc holding apparatus provided within a main body and provided for holding an information recording disc, the disc holding apparatus is provided with a holding body protruded from the main body by a supporting line having an elasticity, provided so as to move close to and apart from the main body and engaging with a center hole of the disc in such a manner as to put in and take out with respect to an inner portion of the center hole, and a disc receiving portion for receiving the disc is provided so as to protrude from the main body at a time when the holding body moves close to a side of the main body, in an outer side of the holding body.
    Type: Application
    Filed: May 31, 2001
    Publication date: November 7, 2002
    Inventor: Minoru Tajima
  • Publication number: 20020105395
    Abstract: A DC block circuit comprises a conductive line (3) disposed on one surface of a dielectric substrate (1), via which an electrical signal is passed, an interdigital capacitor (6) forming a part of the conductive line (3), and a chip capacitor (4) that is disposed so that the interdigital capacitor (6) is sandwiched between the chip capacitor (4) and the dielectric substrate (1), and that is connected to the conductive line (3) so that the chip capacitor (4) is in parallel with the interdigital capacitor (6).
    Type: Application
    Filed: February 13, 2002
    Publication date: August 8, 2002
    Inventor: Minoru Tajima
  • Patent number: 5473016
    Abstract: A polyolefin-based matte film or sheet can be prepared from a polymeric blend of the preset invention comprising a propylene polymer or copolymer as component (A), a specific ethylene-.alpha.-olefin copolymer (E.alpha.O, so-called "super low-density polyethylene") as component (B), and a high-pressure radical polymerization process ethylene polymer or copolymer and/or a modified polyolefin-based resin as component (C). The above blend of the present invention may further comprise an inorganic filler as component (D) and a flame retardant as component (E). The matte films or sheets prepared from these polymeric blends are excellent in tensile modulus, flexibility, impact resistance, thermal resistance, laminating properties, flame resistance, chalking resistance, covering power, scratch resistance, and widely used for fabricating adhesive tapes, covers or cases for stationery, fashion bags, sheets for interior finish work in construction and automobile industries, and sheets for dressing steel plates.
    Type: Grant
    Filed: July 13, 1994
    Date of Patent: December 5, 1995
    Assignee: Nippon Petrochemicals Co., Ltd.
    Inventors: Koichi Fujii, Koichi Komaki, Shigeki Komori, Minoru Tajima
  • Patent number: 5268220
    Abstract: The present invention provides a polypropylene film having high transparency and heat-sealability and superior in the balance between stiffness (tensile modulus) and impact resistance which polypropylene film comprises a) 80-99.5% by weight of a propylene polymer and b) 0.5-20% by weight of an ethylene/.alpha.-olefin copolymer prepared by the copolymerization of ethylene and an .alpha.-olefin having a 3 to 12 carbon atoms, said ethylene/.alpha.-olefin copolymer satisfying the following conditions (i) to (iii):(i) a density of 0.860 to 0.910 g/cm.sup.3 ;(ii) a maximum peak temperature of not lower than 100.degree. C. as measured by differential scanning calorimetry (DSC); and(iii) an insolubles content in boiling n-hexane of not lower than 10% by weight.
    Type: Grant
    Filed: March 3, 1992
    Date of Patent: December 7, 1993
    Assignee: Nippon Petrochemicals Company, Limited
    Inventors: Minoru Tajima, Koichi Fujii, Noboru Yamaoka
  • Patent number: 5181040
    Abstract: A method of and an apparatus for measuring the null angle in the difference vs. sum pattern and in the difference pattern of a monopulse antenna. The null angle of the monopulse antenna in the radiation pattern is acquired by transmitting an RF signal from a plurality of antenna elements to the monopulse antenna, acquiring the sum signal and difference signals in the directions of the respective antenna elements and acquiring the null angle in accordance with the sum and difference signals. The apparatus comprises a rotator for changing the direction of the monopulse antenna and a transmitting antenna facing the monopulse antenna for transmitting a test signal to the monopulse antenna.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: January 19, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masato Inoue, Minoru Tajima, Nobutake Orime, Takashi Katagi
  • Patent number: RE47068
    Abstract: In a microstrip antenna in which a ground conductor is provided to be opposed to patch conductors, wedge shapes angled to intersect with an antenna polarization plane are provided at edges of the ground conductor in a repeated manner.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 2, 2018
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Minoru Tajima