Abstract: This invention has an object of providing a method for producing a multilayer substrate or an electronic part wherein decrease in the thickness has been enabled without causing the problem of insufficient strength or the like in the handling, as well as the electronic part. Such object has been attained by a method for producing a multilayer substrate or an electronic part comprising the steps of adhering a conductor layer to a transfer film, patterning the conductor layer to form a predetermined pattern, placing the transfer film overlaid with the patterned conductor layer on a prepreg so that the side of the conductor layer faces the prepreg, and then adhering the transfer film to the prepreg by applying heat and pressure and peeling the transfer film to produce the prepreg having the conductor layer formed thereon; and the multilayer electronic part produced by such method.

Abstract: The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates are made by forming a resin or a compound material made by mixing powder-like functional materials with this resin into thin plates, and hardening them. Conductor patterns are formed on at least any of front and back surfaces of the core substrates through any of an evaporation process, an ion plating process, an ion beam process, a sputtering process, and a vapor deposition process, followed by patterning. Half-hardened prepregs are produced by forming the resin or the compound material made by mixing powder-like functional materials with this resin into the thin plates. The prepregs and the core substrates are alternately laminated and laminated layers are made by unifying through a hot pressing.

Abstract: A laminated electronic component including at least one inductance element and produced from a laminate having electrical insulators and electrical conductors laminated alternately. The inductance element is formed as a helical coil having a plurality of turns each constituted by four sides. The inductance element has pairs of parallel conductor pieces and pairs of bridging conductor pieces. Each pair of parallel conductor pieces form two of the four sides of one turn of the coil. Each pair of bridging conductor pieces form the other two sides of one turn of the coil. Grooves are formed in the laminate to thereby form the parallel conductor pieces. The grooves are filled with an electrically insulating material. The bridging conductor pieces are formed on the electrically insulating material.

Abstract: A ferrite fine powder having a mean particle size of 0.1 to 30 &mgr;m and made of spherical single-crystal particles. The ferrite fine powder has superior physical properties and excellent magnetic properties desirable for use as a raw material for a dust core of coils, transformers, etc. The powder is prepared by forming a solution or suspension containing a compound or compounds of at least one of the metals forming the ferrite into fine droplets, and thermally decomposing the droplets at elevated temperatures.

Abstract: The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates are made by forming a resin or a compound material made by mixing powder-like functional materials with this resin into thin plates, and hardening them. Conductor patterns are formed on at least any of front and back surfaces of the core substrates through any of an evaporation process, an ion plating process, an ion beam process, a sputtering process, and a vapor deposition process, followed by patterning. Half-hardened prepregs are produced by forming the resin or the compound material made by mixing powder-like functional materials with this resin into the thin plates. The prepregs and the core substrates are alternately laminated and laminated layers are made by unifying through a hot pressing.

Abstract: Using plural layers selected from among composite resin substrates having a fully high or low dielectric constant, composite resin substrates having a fully high magnetic permeability, and composite resin substrate layers having a fully high Q value, the invention provides a multilayer electronic part of small size having high performance and improved overall electrical characteristics. The multilayer electronic part includes constituent layers of at least two types formed of composite materials and a conductor layer formed on at least one composite material layer, wherein the conductor layer constructs a predetermined electric circuit.

Abstract: The present invention relates to a module component for which degradation of electrical properties caused by absorption of moisture in the air can be prevented. An intermediate layer comprises a first layer, a second layer and a core layer. The core layer comprises a material having a higher strength than the first layer and the second layer, has a network structure that extends out in planar fashion, has an outer periphery thereof positioned further to the inside than the outer peripheries of the first layer and the second layer, and is sealed between the first layer and the second layer. An upper layer is laminated on the upper surface of the intermediate layer. A lower layer is laminated on the lower surface of the intermediate layer. Mounted components are mounted on any one of the upper layer and the lower layer.

Abstract: This invention has an object of providing a method for producing a multilayer substrate or an electronic part wherein decrease in the thickness has been enabled without causing the problem of insufficient strength or the like in the handling, as well as the electronic part. Such object has been attained by a method for producing a multilayer substrate or an electronic part comprising the steps of adhering a conductor layer to a transfer film, patterning the conductor layer to form a predetermined pattern, placing the transfer film overlaid with the patterned conductor layer on a prepreg so that the side of the conductor layer faces the prepreg, and then adhering the transfer film to the prepreg by applying heat and pressure and peeling the transfer film to produce the prepreg having the conductor layer formed thereon; and the multilayer electronic part produced by such method.

Abstract: An object of the invention is to provide a substrate for an electronic part and an electronic part which have higher dielectric constant compared to conventional materials, which do not suffer from reduced strength, and which enjoy the advantages of small size, excellent performance and improved overall electrical characteristics; a substrate for an electronic part and an electronic part wherein the material used for the production exhibits reduced lot-to-lot variation in the electric properties, and in particular, in the dielectric constant, and wherein wearing of the mold in the production of the material has been suppressed; and a substrate for an electronic part and an electronic part which have a high withstand voltage. In order to attain such object, the substrate for an electronic part and the electronic part are constituted to comprise a composite dielectric material wherein at least a dielectric material having a circular, oblate circular or oval projection shape is dispersed in a resin.

Abstract: A method for manufacturing single crystal ceramic powder is provided. The method includes a powder supply step for supplying powder consisting essentially of ceramic ingredients to a heat treatment area with a carrier gas, a heat treatment step for heating the powder supplied to the heat treatment area at temperatures required for single-crystallization of the powder to form a product, and a cooling step for cooling the product obtained in the heat treatment step to form single crystal ceramic powder. The method provides single crystal ceramic powder consisting of particles with a very small particle size and a sphericity being 0.9 or higher.

Abstract: A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.

Abstract: A method for manufacturing spherical ceramic powder is provided. The method includes essentially a spray drying step and a sintering step. In the spray drying step, a spray nozzle is used to spray slurry containing powdered raw material consisting essentially of ceramic ingredients to form liquid droplets, and liquid contents in the liquid droplets are heated and removed to obtain ceramic granular powder. In the sintering step, the ceramic granular powder is sintered to form spherical ceramic powder. The method provides ceramic powder having a mean particle size of about 1-50 &mgr;m and a sphericity of about 0.8 or higher, which is suited for mixing with resin material to form a compound. The ceramic powder has high dispersant and filling properties against the resin material.

Abstract: A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

Abstract: The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates are made by forming a resin or a compound material made by mixing powder-like functional materials with this resin into thin plates, and hardening them. Conductor patterns are formed on at least any of front and back surfaces of the core substrates through any of an evaporation process, an ion plating process, an ion beam process, a sputtering process, and a vapor deposition process, followed by patterning. Half-hardened prepregs are produced by forming the resin or the compound material made by mixing powder-like functional materials with this resin into the thin plates. The prepregs and the core substrates are alternately laminated and laminated layers are made by unifying through a hot pressing.

Abstract: Generally spherical metal particles (1) consisting essentially of single crystal grains, having a mean particle size of 0.1 to 10 &mgr;m are surface coated with an insulating or dielectric layer (2a or 2b) as by a spray pyrolysis process, and the coated metal particles are dispersed in a resin to form a composite magnetic or dielectric material. The composite magnetic material is highly insulating, easy to prepare, free of corrosion and has improved high-frequency characteristics and withstanding voltage. The composite dielectric material has a high dielectric constant even at a reduced content of dielectric. There are also provided a molding material, powder compression molding material, paint, prepreg, and substrate.

Abstract: A ferrite fine powder having a mean particle size of 0.1 to 30 &mgr;m and consisting of spherical single-crystal particles. The ferrite fine powder has superior physical properties and excellent magnetic properties desirable for the use as a raw material for a dust core of coils, transformers, etc. The powder is prepared by forming a solution or suspension containing a compound or compounds of at least one of the metals composing ferrite into fine droplets, and thermally decomposing the droplets at elevated temperatures.

Abstract: Using plural layers selected from among composite resin substrates having a fully high or low dielectric constant, composite resin substrates having a fully high magnetic permeability, and composite resin substrate layers having a fully high Q value, the invention provides a multilayer electronic part of small size having high performance and improved overall electrical characteristics. The multilayer electronic part includes constituent layers of at least two types formed of composite materials and a conductor layer formed on at least one composite material layer, wherein the conductor layer constructs a predetermined electric circuit.

Abstract: The present invention relates to a laminated chip bead element demonstrating noise absorption characteristics over a broad range in a high frequency range of GHz or higher. An insulating body is constituted of a material achieved by mixing ferrite powder and an insulating resin. At least one signal conductor is embedded in the insulating body. It is desirable that the insulating body includes a plurality of composite members.

Abstract: An organic PTC thermistor having a positive temperature coefficient of resistivity, which comprises a PTC composition comprising an organic polymer having dispersed therein a conductive substance, and at least one pair of electrodes, wherein the conductive substance is tungsten carbide powder; or the electrodes each comprise a metal mesh and a metal layer.

Abstract: A composite winding type inductor having a stacked-layer structure formed by stacking a plurality of sets of electrically conductive strips for forming plural sets of coils alternately with a plurality of electrically insulting members. The electrically conductive strips in each of the sets are connected to the adjacent ones by way of edges of the electrically insulating members to thereby form a coil. A plurality of the coils thus formed turn around substantially a generally common axis. At least two of the plural sets of the electrically conducting strips are stacked in layers in such a manner as to follow spiral paths in the directions apposite to each other. The coils formed by at least two sets of the electrically conductive strips are connected to each other at least at one of a start end portion, an intermediate portion and a terminal end portion of the coil.