Abstract: An XY table used in a semiconductor manufacturing apparatus including lower (X table) fixed to an X movable element and an upper table (Y table) fixed to a Y movable element, in which the upper table (Y table) is supported movably in a Y direction and immovably in an X direction on the lower table (X table), the X movable element is immovable in the Y direction with respect to the X motor main body, the Y movable element is movable in the X direction with respect to the Y motor main body. Furthermore, the Y motor main body is provided with a permanent magnet that covers an entire region of movement of a magnetic action component (coils) of the Y movable element in the X direction.

Abstract: An XY table used in a semiconductor manufacturing apparatus including lower (X table) fixed to an X movable element and an upper table (Y table) fixed to a Y movable element, in which the upper table (Y table) is supported movably in a Y direction and immovably in an X direction on the lower table (X table), the X movable element is immovable in the Y direction with respect to the X motor main body, the Y movable element is movable in the X direction with respect to the Y motor main body. Furthermore, the Y motor main body is provided with a permanent magnet that covers an entire region of movement of a magnetic action component (coils) of the Y movable element in the X direction.

Abstract: A wire bonding capillary (1), which is able to decrease wire extraction resistance and suitable for a long and low loop wire bonding process, comprises a through bore (5) for feeding a bonding wire, a funnel-shaped bore (3) for guiding the wire to the through bore, and a tapered portion (11) formed at an exit of the through bore. The through bore length is between 0.2 and 1.5 times the through bore diameter. The tapered portion is tapered in two steps.

Abstract: A guide rail mechanism for a bonding apparatus for transferring a workpiece such as a lead frame, etc. including a pair of guide rails each comprising an edge surface guide rail element for guiding the edge surface of the workpiece and an undersurface guide rail element disposed beneath the edge surface guide rail element so as to support the undersurface of the edge portion of the workpiece. A driver for the undersurface guide rail element comprised of a rotational shaft with an eccentric cam portion and other parts is installed so as to move the undersurface guide rail element, thus changing the positional relationship between the edge surface guide rail element and the undersurface guide rail element for workpieces of different thicknesses.

Abstract: A guide rail mechanism used for, for instance, a die boding apparatus and a wire bonding apparatus, including a pair of guide rail sections that face each other and convey a workpiece such as a lead frame in between. The guide rail sections include rail height adjustment spacers held by spring force between guide rails and guide rail stands, and this rail height adjustment spacer is replaced for other rail height adjustment spacers of different thicknesses by moving guide rail raising-and-lowering shafts by way of overcoming the spring forces of the springs provided thereon, thus assuring the same upper surface height level of workpieces of different thicknesses to be conveyed.

Abstract: In a wire cutting and feeding device used in a wire bonding apparatus, piezo-electric actuators are used as the driving source of a slide block which moves wire clamper toward and away from a workpiece upon which bonding is performed. The piezo-electric actuators include a feeding piezo-electric actuator, which causes expansion and contraction of the slide block, and two clamping piezo-electric actuators, which are alternately operated and clamp the slide block. The slide block is caused to move by means of respective power-"on"/power-"off" combinations of the feeding piezo-electric actuator and the two clamping piezo-electric actuators.

Abstract: A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper is closed temporarily during the reverse operation so as to apply tension to the wire, thus forming a strong kink at an uppermost point of the neck height portion of a resulting wire loop between the first and second bonding points.

Abstract: In a wire bonding apparatus that includes an air-blower connected to a compressor via an electromagnetic valve so as to provide a bonding wire with back tension by blowing air to the bonding wire, a preparatory tank which can store air is installed between the air-blower and the electromagnetic valve so as to avoid abrupt fluctuations or periodic fluctuations of the air supplied to the air-blower.

Abstract: A bonding apparatus including a pair of guide rails, a main heating block and a pair of pre-stage and after-stage heating blocks so as to heat a lead frame conveyed on the pair of guide rails, and the pre-stage and after-stage heating blocks can be moved in the direction of width of the lead frame together with one of the pair of guide rails and are installed so that they are positioned beneath the other frame guide rail.

Abstract: A capillary for a wire bonding apparatus having a wire threading hole and a chamfer, in which the wire threading hole is formed in two stages as first and second wire threading holes, the diameter of the first wire threading hole which is located above the second wire threading hole exceeds the diameter of a bonding wire by no more than 3 to 8 microns, the diameter of the second wire threading hole is 5 to 10 microns greater than the first hole diameter, and the depth of the second wire threading hole is 10 to 50 microns.

Abstract: In a capillary used in a wire bonding apparatus that has a wire threading hole through which a bonding wire of 10 to 30 .mu.m diameter passes and is provided with two chamfers, i.e., lower and upper chamfers, near the tip end of the wire threading hole, the upper chamfer has a chamfer angle of 3 to 19 degrees and a depth of 20 to 50 microns.

Abstract: A clamping device used in, for instance, a bonding machine, using a piezo-electric element for opening and closing a pair of clamping claws for holding, for instance, bonding wires in between. The clamping device includes a pressure adjustment screw which applies a preparatory pressure to the piezo-electric element via a contact plate, and the contact plate is connected, via flexible sections which are capable of expansion and contraction, to a screw attachment with which the pressure adjustment screw is screw-engaged.

Abstract: A device for applying tension to a bonding wire installed between a wire spool and a capillary of a wire bonding apparatus including a nozzle for blowing out a gas for applying tension to the wire and a single gas guide plate installed along the direction of the flow of the gas blown out of the nozzle so as to guide the gas to the bonding wire.

Abstract: A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Abstract: A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Abstract: A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Abstract: A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Abstract: A wire clamper used in a wire bonding apparatus including a pair of open/close clamping arms and a pair of clamping elements provided at terminal ends of the clamping arms so as to clamp a bonding wire in between, and at least one of the clamper arms is opened and closed by the electric strain or magnetic strain effect of a piezoelectric element. In addition, a clamping load adjustment screw is installed at the root end of the wire clamper so that it can set an initial clamping load of the clamping elements.

Abstract: A non-contact type moving table system comprising a guide table and a moving table. The guide table and the moving table have air holes and vacuum holes on the surfaces facing each other, and compressed air is blown out of the air holes so that a space is created between the moving table and the guide tale, thus the moving table can move above the guide table without making contact with the guide table. In addition, vacuum suction is applied between the guide table and the moving table so that the moving table is stabilized on the guide table. Several modifications are obtained by combining pairs of the guide table and the moving table so that the moving table is moved in any desired horizontal direction. The non-contact type moving table can be simple in structure, compact in size, light in weight and is manufactured at low costs.

Abstract: This invention is intended to reduce the size of a bonding apparatus and includes a first means which is to construct the bonding apparatus by swingably mounting a lifter arm 4 for holding a horn 2 to the upper Y table 9 of an X-Y table 10. The second means is to construct the apparatus by using the upper Y table of the X-Y table as a bottom plate of a bonding head, and the third means is that in addition to the second means, it is further arranged so that a linear motor 15 is fixed such that a part or the entire portion of a magnet section 16 of the linear motor 15 is embedded in the Y table 9, while a coil section 17 of the linear motor 15 is fixed to the lifter arm 4.