Patents by Inventor Minoru Tosaka

Minoru Tosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8673428
    Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: March 18, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Susumu Naoyuki, Hisashige Kanbara, Minoru Tosaka, Kyosuke Suzuki, Toshirou Okamura, Yoshihito Kikuhara, Masami Negishi, Tadayasu Fujieda, Kouichi Tsuyama
  • Publication number: 20100021695
    Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.
    Type: Application
    Filed: December 27, 2007
    Publication date: January 28, 2010
    Inventors: Susumu Naoyuki, Hisashige Kanbara, Minoru Tosaka, Kyosuke Suzuki, Toshirou Okamura, Yoshihito Kikuhara, Masami Negishi, Tadayasu Fujieda, Kouichi Tsuyama
  • Patent number: 6207266
    Abstract: Provided is bonding film in the form of web which has a high electromagnetic shielding effect for electromagnetic radiation from the front surface of a display device, and other favorable properties such as an infrared blocking property, a transparency, a invisibility and a favorable bonding property. The bonding film typically includes base film, a geometrically patterned electroconductive layer placed over the base film so as to achieve an aperture ratio of 80% of more, and a bonding layer for attaching the assembly to an object. The film may be applied to the surface of a transparent sheet member for the convenience of handling, and such an assembly has a symmetric structure so that the warping of the assembly may be minimized. The bonding film may be interposed between a pair transparent base sheets, or the bonding film may be applied over two sides a transparent base sheet. The assembly may further include an infrared blocking layer and an anti-glare layer.
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: March 27, 2001
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hisashige Kanbara, Akishi Nakaso, Minoru Tosaka
  • Patent number: 6197408
    Abstract: Provided is electromagnetic shielding bonding film which has an electromagnetic shielding capability, infrared blocking capability, transparency, invisibility and favorable bonding property, and an electromagnetic shielding assembly and a display device using such bonding film. The electromagnetic shielding bonding film is characterized by plastic film carrying a bonding agent layer which flows under specific conditions, and an electroconductive metallic material layer which is geometrically patterned by micro-lithography so as to have an aperture ratio of 50% or more. This electromagnetic shielding bonding film is combined with a plastic plate to obtain an electromagnetic shielding assembly. Also is provided a display device such as CRT, PDP, LCD, or EL which has the electromagnetic shielding bonding film or the electromagnetic shielding assembly on the display screen.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: March 6, 2001
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hisashige Kanbara, Hiroyuki Hagiwara, Minoru Tosaka
  • Patent number: 6086979
    Abstract: An electromagnetic sheilding bonding film has a substantially transparent base film and an electroconductive metallic material layer geometrically patterned on the base film to have an aperture ratio of 50% or more. A bonding agent layer is placed at least over a part of the plastic base film not covered by the electroconductive metallic material layer and has a predetermined selectively given fluidity.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: July 11, 2000
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hisashige Kanbara, Hiroyuki Hagiwara, Minoru Tosaka