Patents by Inventor Minoru Ueshima
Minoru Ueshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11331759Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.Type: GrantFiled: September 3, 2020Date of Patent: May 17, 2022Assignee: Senju Metal Industry Co., Ltd.Inventors: Hans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma, Minoru Ueshima
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Patent number: 11217359Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.Type: GrantFiled: July 24, 2018Date of Patent: January 4, 2022Assignees: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITYInventors: Jinting Jiu, Minoru Ueshima, Katsuaki Suganuma, Wanli Li
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Publication number: 20210366627Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.Type: ApplicationFiled: August 9, 2021Publication date: November 25, 2021Applicants: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITYInventors: Jinting JIU, Minoru UESHIMA, Katsuaki SUGANUMA, Wanli LI
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Patent number: 11024598Abstract: A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.Type: GrantFiled: August 17, 2017Date of Patent: June 1, 2021Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Tetsu Takemasa, Minoru Ueshima
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Patent number: 10968932Abstract: A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.Type: GrantFiled: October 30, 2018Date of Patent: April 6, 2021Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Minoru Ueshima, Yoshie Tachibana
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Publication number: 20210008670Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.Type: ApplicationFiled: September 3, 2020Publication date: January 14, 2021Inventors: Hans-Jurgen Albrecht, Klaus Wilke, Katsuaki Suganuma, Minoru Ueshima
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Publication number: 20200381136Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.Type: ApplicationFiled: July 24, 2018Publication date: December 3, 2020Applicants: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITYInventors: Jinting JIU, Minoru UESHIMA, Katsuaki SUGANUMA, Wanli LI
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Publication number: 20200284282Abstract: A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.Type: ApplicationFiled: October 30, 2018Publication date: September 10, 2020Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Minoru UESHIMA, Yoshie TACHIBANA
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Patent number: 10658107Abstract: In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.Type: GrantFiled: October 11, 2017Date of Patent: May 19, 2020Assignee: Senju Metal Industry Co., Ltd.Inventors: Daisuke Sakuma, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa, Yoshie Tachibana
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Publication number: 20190393188Abstract: A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.Type: ApplicationFiled: August 17, 2017Publication date: December 26, 2019Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Tetsu TAKEMASA, Minoru UESHIMA
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Patent number: 10354944Abstract: A method for soldering a surface-mount component onto a circuit board. The melting of die-bonding solder material is prevented by using a mounting solder material when soldering a surface-mount component formed using the die-bonding solder material onto a printed circuit board. The surface-mount component, formed using (Sn—Sb)-based solder material having high melting point, the (Sn—Sb)-based solder material containing Cu but not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material or (Sn—Ag—Cu—Bi—In)-based solder material as the mounting solder material and with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C.Type: GrantFiled: December 22, 2010Date of Patent: July 16, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Minoru Ueshima, Minoru Toyoda
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Patent number: 10297539Abstract: The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.Type: GrantFiled: May 28, 2015Date of Patent: May 21, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Minoru Ueshima, Minoru Toyoda
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Patent number: 10272527Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: GrantFiled: April 2, 2015Date of Patent: April 30, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Minoru Ueshima, Takeshi Sakamoto, Rei Fujimaki
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Patent number: 10265807Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: GrantFiled: May 17, 2018Date of Patent: April 23, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Minoru Ueshima, Takeshi Sakamoto, Rei Fujimaki
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Patent number: 10090268Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.Type: GrantFiled: July 27, 2015Date of Patent: October 2, 2018Assignees: MURATA MANUFACTURING CO., LTD., SENJU METAL INDUSTRY CO., LTD.Inventors: Yasuyuki Sekimoto, Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima
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Publication number: 20180264601Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: ApplicationFiled: May 17, 2018Publication date: September 20, 2018Inventors: Minoru Ueshima, Takeshi Sakamoto, Rei Fujimaki
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Publication number: 20180102214Abstract: In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.Type: ApplicationFiled: October 11, 2017Publication date: April 12, 2018Inventors: Daisuke Sakuma, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa, Yoshie Tachibana
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Patent number: 9807889Abstract: An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.Type: GrantFiled: July 29, 2013Date of Patent: October 31, 2017Assignees: OSAKA UNIVERSITY, SENJU METAL INDUSTRY CO., LTD.Inventors: Kozo Fujimoto, Shinji Fukumoto, Michiya Matsushima, Satoshi Watanabe, Takeshi Kan, Minoru Ueshima, Takeshi Sakamoto, Shu Inoue
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Patent number: 9796053Abstract: Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.Type: GrantFiled: July 29, 2013Date of Patent: October 24, 2017Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Rei Fujimaki, Minoru Ueshima
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Publication number: 20170014955Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-40 of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: ApplicationFiled: April 2, 2015Publication date: January 19, 2017Inventors: Minoru UESHIMA, Takeshi SAKAMOTO, Rei FUJIMAKI