Patents by Inventor Minoru Yoshikawa

Minoru Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190277572
    Abstract: A phase-change cooling apparatus according to an exemplary aspect of the present invention includes an evaporator a condenser; a refrigerant liquid driving means for circulating the refrigerant liquid; a first piping section configured to connect the evaporator and the condenser; a second piping section configured to connect the condenser to the refrigerant liquid driving means; a third piping section configured to connect the refrigerant liquid driving means to the evaporator; a refrigerant pooling means for pooling the refrigerant liquid, the refrigerant pooling means being located in a flow path constituted by the second piping section; and a fourth piping section, with one end of the fourth piping section connected to the first piping section at a first connecting point, and another end of the fourth piping section connected to the refrigerant pooling means at a second connecting point.
    Type: Application
    Filed: September 15, 2017
    Publication date: September 12, 2019
    Applicant: NEC Corporation
    Inventors: Arihiro MATSUNAGA, Minoru YOSHIKAWA, Masaki CHIBA, Hisato SAKUMA, Masanori SATO, Mizuki WADA, Koichi TODOROKI
  • Patent number: 10409345
    Abstract: With a phase change cooling device, it is difficult to obtain reliable high-efficiency cooling performance due to a change in heat exchange performance.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: September 10, 2019
    Assignee: NEC Corporation
    Inventors: Masanori Sato, Minoru Yoshikawa, Akira Shoujiguchi, Arihiro Matsunaga
  • Publication number: 20190145667
    Abstract: Since improving heat exchange between a gas-phase refrigerant and a liquid-phase refrigerant in a refrigeration system could instead result in a reduction in the efficiency of the whole refrigeration system, a heat exchange device (201) of the present invention includes: a refrigerant supply means (210) for supplying a first-temperature liquid-phase refrigerant (R11) and a second-temperature gas-phase refrigerant (R12) in one circulation system; a plurality of heat exchange means (220A, 220B) which are each configured so as to perform heat exchange between the liquid-phase refrigerant and the gas-phase refrigerant; and refrigerant circulation means (231, 232, 242) for circulating the gas-phase refrigerant (R12) in such a manner that the gas-phase refrigerant (R12) flows in parallel in the plurality of heat exchange means, and circulating the liquid-phase refrigerant (R11) in such a manner that the liquid-phase refrigerant (R11) flows in series in the plurality of heat exchange means.
    Type: Application
    Filed: March 23, 2017
    Publication date: May 16, 2019
    Applicant: NEC CORPORATION
    Inventors: Arihiro MATSUNAGA, Minoru YOSHIKAWA, Hisato SAKUMA, Masato YANO, Asuka MATSUBA, Takafumi NATSUMEDA
  • Patent number: 10215456
    Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: February 26, 2019
    Assignees: NEC Corporation, NEC Platforms, Ltd.
    Inventors: Arihiro Matsunaga, Masaki Chiba, Minoru Yoshikawa, Tadao Hosaka, Shunsuke Fujii, Akira Shoujiguchi, Kenichi Inaba, Masanori Sato
  • Patent number: 10182517
    Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: January 15, 2019
    Assignee: NEC Corporation
    Inventors: Minoru Yoshikawa, Kenichi Inaba, Masanori Sato, Akira Shoujiguchi, Arihiro Matsunaga, Masaki Chiba
  • Publication number: 20190003776
    Abstract: It is impossible, in a phase-change cooling apparatus in which a refrigerant flows in a gas-liquid two-phase state, to enhance cooling capacity sufficiently even though a heat-radiating region is enlarged; therefore, a heat radiation apparatus according to an exemplary aspect of the present invention includes gas-phase refrigerant diffusion means into which a refrigerant in a gas-liquid two-phase state flowing, the gas-phase refrigerant diffusion means being filled with a gas-phase refrigerant included in the refrigerant in the gas-liquid two-phase state; heat-radiating means including a first header, a second header, and a plurality of heat-radiating pipes connecting the first header to the second header, the gas-phase refrigerant flowing through the plurality of heat-radiating pipes; and gas-phase-side connection means for connecting the gas-phase refrigerant diffusion means to the first header, the gas-phase refrigerant flowing in the gas-phase-side connection means.
    Type: Application
    Filed: December 19, 2016
    Publication date: January 3, 2019
    Applicant: NEC Corporation
    Inventors: Arihiro MATSUNAGA, Masaki CHIBA, Masanori SATO, Koichi TODOROKI, Mizuki WADA, Minoru YOSHIKAWA
  • Publication number: 20180363968
    Abstract: In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid r
    Type: Application
    Filed: December 16, 2016
    Publication date: December 20, 2018
    Applicant: NEC Corporation
    Inventors: Minoru YOSHIKAWA, Hisato SAKUMA, Masaki CHIBA
  • Publication number: 20180266744
    Abstract: A cooling performance of a phase-change cooling system that circulates a refrigerant liquid using a driving source is remarkably lowered immediately after the startup.
    Type: Application
    Filed: September 21, 2016
    Publication date: September 20, 2018
    Applicant: NEC CORPORATION
    Inventors: Hisato SAKUMA, Minoru YOSHIKAWA, Masaki CHIBA
  • Publication number: 20180259232
    Abstract: A cooling system which combines a plurality of refrigeration cycles has a fluctuating cooling capacity. Therefore, a cooling system according to the present invention includes: a first cooling means including a first refrigerant transportation means for circulating a refrigerant that receives heat from an object to be cooled; a second refrigerant transportation means connected to the first refrigerant transportation means, for circulating a diverted refrigerant being a part of the refrigerant; a second cooling means for receiving heat from the refrigerant circulating through the first refrigerant transportation means, and cooling the diverted refrigerant; and a flowrate control means for controlling a flowrate of the diverted refrigerant.
    Type: Application
    Filed: September 21, 2015
    Publication date: September 13, 2018
    Applicant: NEC CORPORATION
    Inventors: Hisato SAKUMA, Masato YANO, Minoru YOSHIKAWA, Masaki CHIBA
  • Patent number: 9968003
    Abstract: A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: May 8, 2018
    Assignee: NEC Corporation
    Inventors: Hitoshi Sakamoto, Minoru Yoshikawa, Mahiro Hachiya
  • Publication number: 20180073764
    Abstract: A cooling system employing a phase-change cooling apparatus together with an air conditioner becomes complex and increases in cost if it is configured to maximize the efficiency of the entire cooling system; therefore, a phase-change cooling apparatus according to an exemplary aspect of the present invention includes a heat receiving means for vaporizing refrigerant liquid stored and producing refrigerant vapor by receiving heat exhausted from a heating section having breathed in cold air; a heat radiation means for liquefying the refrigerant vapor and producing refrigerant liquid by radiating heat of the refrigerant vapor to cooling air by a fan; a vapor tube connecting the heat receiving means to the heat radiation means, the refrigerant vapor mainly flowing through the vapor tube; a liquid tube connecting the heat receiving means to the heat radiation means, the refrigerant liquid mainly flowing through the liquid tube; and a control means for controlling a rotation rate of the fan, wherein the control mea
    Type: Application
    Filed: March 30, 2016
    Publication date: March 15, 2018
    Applicants: NEC Corporation, NEC Facilities, Ltd.
    Inventors: Minoru YOSHIKAWA, Kazuo WATANABE, Masanori SATO, Arihiro MATSUNAGA
  • Publication number: 20180059746
    Abstract: With a phase change cooling device, it is difficult to obtain reliable high-efficiency cooling performance due to a change in heat exchange performance.
    Type: Application
    Filed: March 17, 2016
    Publication date: March 1, 2018
    Inventors: Masanori SATO, Minoru YOSHIKAWA, Akira SHOUJGUCHI, Arhiro MATSUNAGA
  • Publication number: 20180054919
    Abstract: To address the problem of deterioration of cooling performance of a phase-change cooling apparatus cooling a plurality of heat-emitting bodies because of changes in the amount of heat emitted by the plurality of heat-emitting bodies, a refrigerant supply device according to the present invention includes: a first reservoir for storing refrigerant liquid caused to flow by a drive pump; and a refrigerant liquid amount adjustment means for adjusting the flow rate of the refrigerant liquid flowing out of the first reservoir to a heat reception unit wherein the reservoir includes a branch outlet, wherein the branch outlet is provided in a position higher than the refrigerant liquid amount adjustment means, and wherein refrigerant liquid stored in the first reservoir flows out of the branch outlet to a second reservoir disposed in a position lower than the first reservoir.
    Type: Application
    Filed: March 9, 2016
    Publication date: February 22, 2018
    Inventors: Minoru YOSHIKAWA, Masanori SATO, Akira SHOUJIGUCH!, Arihiro MATSUNAGA, Masaki CHIBA
  • Patent number: 9820407
    Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: November 14, 2017
    Assignee: NEC Corporation
    Inventors: Hitoshi Sakamoto, Minoru Yoshikawa, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba, Arihiro Matsunaga
  • Publication number: 20170311485
    Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a heat source efficiently using a natural-circulation type phase-change cooling device; therefore, a cooling device according to an exemplary aspect of the present invention includes a heat receiving unit for receiving heat; a condensing unit for releasing heat; and a refrigerant intermediary unit for connecting the heat receiving unit with the condensing unit, and transporting refrigerant circulating between the heat receiving unit and the condensing unit, wherein the refrigerant intermediary unit includes a refrigerant retaining unit for retaining the refrigerant, a primary tube connecting the refrigerant retaining unit with the condensing unit, and a secondary tube connecting the refrigerant retaining unit with the heat receiving unit and including a bendable tube.
    Type: Application
    Filed: September 15, 2015
    Publication date: October 26, 2017
    Inventors: Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Masaki CHIBA, Arihiro MATSUNAGA, Masanori SATO
  • Publication number: 20170303432
    Abstract: If a gas-liquid separation structure is introduced into a phase-change cooling device to prevent the cooling performance from decreasing, manufacturing costs increase; therefore, a refrigerant intermediary device according to an exemplary aspect of the present invention includes a refrigerant container configured to contain refrigerant; a first inlet, provided for an outer periphery of the refrigerant container, through which a vapor-phase refrigerant and a first liquid-phase refrigerant flowing in; a first outlet, provided for the outer periphery of the refrigerant container, through which the vapor-phase refrigerant flowing out; a second inlet, provided for the outer periphery of the refrigerant container, through which a second liquid-phase refrigerant flowing in; and a second outlet, provided for the outer periphery of the refrigerant container, through which the first liquid-phase refrigerant and the second liquid-phase refrigerant flowing.
    Type: Application
    Filed: September 15, 2015
    Publication date: October 19, 2017
    Inventors: Arihiro MATSUNAGA, Masanori SATO, Akira SHOUJIGUCHI, Masaki CHIBA, Minoru YOSHIKAWA
  • Publication number: 20170280585
    Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrig
    Type: Application
    Filed: August 20, 2015
    Publication date: September 28, 2017
    Applicant: NEC Corporation
    Inventors: Akira SHOUJIGUCHI, Minoru YOSHIKAWA, Masaki CHIBA, Arihiro MATSUNAGA, Masanori SATO
  • Publication number: 20170280590
    Abstract: In a natural-circulation type phase-change cooling device, the cooling performance is degraded if the number of heat sources to be cooled increases; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units for respectively holding refrigerant receiving heat from a plurality of heat sources; a condensing unit for generating refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure configured to connect the heat receiving units to the condensing unit and transport the refrigerant vapor; a refrigerant liquid transport structure configured to connect the heat receiving units to the condensing unit and transport the refrigerant liquid; wherein the refrigerant vapor transport structure includes a plurality of sub-vapor-pipes respectively connected to the plurality of heat receiving units, a vapor joining portion connected to
    Type: Application
    Filed: August 19, 2015
    Publication date: September 28, 2017
    Applicant: NEC Corporation
    Inventors: Masaki CHIBA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Arihiro MATSUNAGA, Masanori SATO
  • Publication number: 20170280594
    Abstract: A rack louver 120 controls an air flow of outside air external to an enclosure 10 taken into the enclosure 10, flowing from an inlet 20 to an outlet 30 in a rack 60. An outlet louver 130 controls an air flow of inside air internal to the enclosure 10 flowing out from the outlet 30 to outside the enclosure 10. A system control unit 150 adjusts motive power of a blowing unit 40, a degree of opening of the rack louver 120, and a degree of opening of the outlet louver 130 in accordance with an outside-air temperature measured by an outside-air temperature sensor 50 and electronic equipment power consumption measured by a power sensor 100. Consequently, electronic equipment in the rack can be cooled with higher energy efficiency while suppressing temperature rise in the electronic equipment.
    Type: Application
    Filed: August 20, 2015
    Publication date: September 28, 2017
    Applicant: NEC Corporation
    Inventors: Masanori SATO, Kenichi INABA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Masaki CHIBA, Arihiro MATSUNAGA
  • Patent number: 9727101
    Abstract: The cooling apparatus (10) for electronic-device exhaustion includes an evaporator unit (201), a fluid piping (306) and a vapor piping (305). A plurality of evaporator units (201) is disposed in a rack (100) in the height direction, and have a dimension in height of any of 2U, 3U, and 4U with 1U being 44.45 mm. The evaporator unit causes a coolant fluid thereinside to vaporize and produce a coolant vapor by heat of the exhaust air from an electronic device loaded in the rack (100), and cools the exhaust air. The fluid piping (306) is a supply route of the coolant fluid to the evaporator units (201), the vapor piping (305) is a discharging route of the coolant vapor from the evaporator units (201), and both are commonly connected to the plurality of evaporator units (201).
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: August 8, 2017
    Assignee: NEC Corporation
    Inventors: Minoru Yoshikawa, Kenichi Inaba