Abstract: A server including a chassis, a motherboard, a heat source and a heat exchanger. The motherboard is disposed in the chassis. The heat source is disposed on and electrically connected to the motherboard. The heat exchanger includes a first chamber body, a plurality of heat dissipation plates and a plurality of heat dissipation fins. The first chamber body is in thermal contact with the heat source and has a first channel. The plurality of heat dissipation plates are in thermal contact with and inserted into the first chamber body. The plurality of heat dissipation plates each have a second channel. The first channel of the first chamber body is in fluid communication with the second channels of the plurality of heat dissipation plates. The plurality of heat dissipation fins are in thermal contact with the plurality of heat dissipation plates.