Patents by Inventor Minru Gordon XIONG

Minru Gordon XIONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230285296
    Abstract: A multilayered liposome disclosed herein includes a liposome core defined by a lipid layer, and five or more coating layers surrounding the lipid layer, wherein the five or more coating layers include more than one positively charged polymeric layer and more than one negatively charged drug layer, wherein the more than one positively polymeric layer and the more than one negatively charged drug layer are deposited in an alternating manner, wherein one of the more than one positively charged polymeric layer is formed as an outmost coating layer, and wherein each of the more than one negatively charged drug layer includes insulin, an insulin-like factor, a growth factor, or a hormonal peptide. In one embodiment, an anion liposome core (HSPC/DPPG) is coated via a layer-by-layer approach with multilayers of oppositely charged insulin and chitosan layers.
    Type: Application
    Filed: July 23, 2021
    Publication date: September 14, 2023
    Inventors: Subramanian VENKATRAMAN, Yingying HUANG, Yiming ZHANG, Minru Gordon XIONG, Bernhard Otto BOEHM, Yusuf ALI
  • Publication number: 20230234050
    Abstract: A microfluidic chip is disclosed herein. In a specific embodiment, the microfluidic chip comprises at least one microfluidic reservoir having a wall portion and a heat transfer sealing layer cooperating with the wall portion for receiving a sample to be tested. The heat transfer sealing layer is arranged to be contiguous with the sample to be tested. The microfluidic chip further comprises an active temperature control device arranged to provide structural support to the heat transfer sealing layer and operable to control a temperature of the sample via transmission of heat through the heat transfer sealing layer. A detection module is also disclosed.
    Type: Application
    Filed: May 27, 2021
    Publication date: July 27, 2023
    Inventors: Chwee Teck LIM, Quoc Mai Phuong NGUYEN, Yongling Adelicia LI, Ming WANG, Nishanth VENUGOPAL MENON, Minru Gordon XIONG, Ali Asgar SALEEM BHAGAT, Jee Chin TEOH