Abstract: A water-cooling device includes a water input/output module, a pump module, and multiple tubes. The water input/output module includes a first box, a water input connector, and a water output connector. The first box is divided into a water input chamber and a water output chamber by a separator plate. The water input connector communicates with the water input chamber. The water output connector communicates with the water output chamber. A lateral side of each of the water input chamber and the water output chamber is disposed with first openings. The pump module is arranged with the water input/output module at an interval. The pump module includes a second box and pumps in the second box. A lateral side of the second box is disposed with second openings. Two ends of each tube are separately connected to the first opening and the second opening.

Abstract: This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190° C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190° C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.

Abstract: A water-cooling heat dissipation device includes a water cooling head, a delivering structure, a water-cooling radiator, and a water pump. The water-cooling head includes a chamber. The delivering structure is disposed on the water-cooling head and includes a water delivery column. The water delivery column includes a first and a second water passages. The first and second water passages are connected to the chamber. Multiple first and second slot holes are disposed on the first and second water passages respectively. The water-cooling radiator includes multiple tubes. A window is formed in the water-cooling radiator by splitting each tube. The water delivery column inserts in the window. Each first and second slot holes are welded to the nozzles of the tubes. Therefore, the problem of water leakage may be solved effectively.

Abstract: The present invention discloses a flexible temperature-sensitive pressure sensor based on nanoparticle array quantum conductance, and an assembly method and application thereof. The sensor includes a high polymer film, metal nanoparticle arrays, metal microelectrodes, and an external circuit for conductance measurement; at least one group of metal nanoparticle arrays are deposited on upper and lower surfaces of the high polymer film, and in the same group, positions of metal nanoparticle arrays on the upper and lower surfaces are in one-to-one correspondence; the metal microelectrodes are arranged on two sides of each group of metal nanoparticle arrays and are symmetrically distributed on the upper and lower surfaces of the high polymer film; and the external circuit for conductance measurement is electrically connected to the metal microelectrodes. Conductance response signals of the nanoparticle arrays in the present invention have an exponential relationship with a distance between particles.

Abstract: The present invention provides a hotmelt adhesive composition, comprising: (A) an olefin block copolymer of ethylene and octene, having a melt index of 10 to 35 g/10 min @ 190° C., 2.16 kg, preferably 15 to 30 g/10 min @ 190° C., 2.16 kg, and (B) a wax modified with carboxylic acid and/or carboxylic acid anhydride.

Abstract: This invention relates to a hot melt adhesive composition. In particular, the present invention relates to a hot melt pressure sensitive adhesive composition having lower melt viscosity under lower application temperature, excellent peel strength when cured, and lower odour.

Abstract: This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190° C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190° C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.

Abstract: The present invention discloses a flexible temperature-sensitive pressure sensor based on nanoparticle array quantum conductance, and an assembly method and application thereof. The sensor includes a high polymer film, metal nanoparticle arrays, metal microelectrodes, and an external circuit for conductance measurement; at least one group of metal nanoparticle arrays are deposited on upper and lower surfaces of the high polymer film, and in the same group, positions of metal nanoparticle arrays on the upper and lower surfaces are in one-to-one correspondence; the metal microelectrodes are arranged on two sides of each group of metal nanoparticle arrays and are symmetrically distributed on the upper and lower surfaces of the high polymer film; and the external circuit for conductance measurement is electrically connected to the metal microelectrodes. Conductance response signals of the nanoparticle arrays in the present invention have an exponential relationship with a distance between particles.