Patents by Inventor Minshik Kim

Minshik Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8652296
    Abstract: A side gas injector for a plasma reaction chamber is provided. The side gas injector includes a circular distribution plate and a cover plate. The circular distribution plate includes an injection hole for injecting a reaction gas and a distribution channel part for distributing the reaction gas such that the reaction gas introduced from the injection hole can be radially simultaneously jetted in a plurality of positions along an inner circumference surface of the distribution plate. The cover plate is coupled to a top of the distribution plate and seals a top of the distribution channel part.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: February 18, 2014
    Assignee: DMS Co., Ltd.
    Inventors: Minshik Kim, Sungyong Ko, Hwankook Chae, Kunjoo Park, Keehyun Kim, Weonmook Lee
  • Patent number: 8398783
    Abstract: A workpiece de-chucking device of a plasma reactor for dry-cleaning the inside of a reaction chamber and an ElectroStatic chuck (ESC) during workpiece de-chucking and a workpiece de-chucking method using the same are provided. The workpiece de-chucking device includes a lifting unit, an ICP source power unit, and a controller. The lifting unit lifts a workpiece mounted on a top surface of an ESC. The ICP source power unit forms a magnetic field in an inductive coil arranged outside a dielectric window. The controller outputs a source power control signal, a lift control signal, and a de-chucking control signal.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: March 19, 2013
    Assignee: DMS Co., Ltd.
    Inventors: Byoungil Lee, Hyeokjin Jang, Sungyong Ko, Minshik Kim
  • Patent number: 8323522
    Abstract: A plasma reactor and an etching method using the same are provided. The method includes a first changing step of changing the number or arrangement structure of inductive coils connecting to an RF source power supply unit, a step of applying RF source power and generating high density plasma, a first etching step of etching a first etch-target layer of a workpiece, a first stopping step of stopping applying the RF source power, a second changing step of changing the number or arrangement structure of the inductive coils, a step of applying RF source power to corresponding inductive coils and generating low density plasma, a second etching step of etching a second etch-target layer of the workpiece, and a second stopping step of stopping applying the RF source power.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: December 4, 2012
    Assignee: DMS Co., Ltd.
    Inventors: Hyeokjin Jang, Minshik Kim, Kwangmin Lee, Sungyong Ko, Hwankook Chae, Kunjoo Park, Keehyun Kim, Weonmook Lee
  • Publication number: 20110155694
    Abstract: A plasma reactor and an etching method using the same are provided. The method includes a first changing step of changing the number or arrangement structure of inductive coils connecting to an RF source power supply unit, a step of applying RF source power and generating high density plasma, a first etching step of etching a first etch-target layer of a workpiece, a first stopping step of stopping applying the RF source power, a second changing step of changing the number or arrangement structure of the inductive coils, a step of applying RF source power to corresponding inductive coils and generating low density plasma, a second etching step of etching a second etch-target layer of the workpiece, and a second stopping step of stopping applying the RF source power.
    Type: Application
    Filed: November 18, 2010
    Publication date: June 30, 2011
    Inventors: Hyeokjin JANG, Minshik KIM, Kwangmin LEE, Sungyong KO, Hwankook CHAE, Kunjoo PARK, Keehyun KIM, Weonmook LEE
  • Publication number: 20110154843
    Abstract: An apparatus for controlling the temperature of an electrostatic chuck is provided. The apparatus includes an electrostatic chuck including, as a fluid channel part for circulating a refrigerant, a first fluid channel formed in an outer circumference region of the internal and a second fluid channel formed in the whole internal region, and one or more chillers for supplying refrigerant controlled to different temperatures through the first fluid channel or the second fluid channel. The first and second fluid channels are formed in two up/down stages within the electrostatic chuck, thereby being independently capable of the temperatures of a center part and edge part of a wafer.
    Type: Application
    Filed: December 3, 2010
    Publication date: June 30, 2011
    Inventors: Sungyong KO, Minshik KIM, Kwangmin LEE, Hwankook CHAE, Dongseok LEE, Keehyun KIM, Weonmook LEE
  • Publication number: 20110079356
    Abstract: A side gas injector for a plasma reaction chamber is provided. The side gas injector includes a circular distribution plate and a cover plate. The circular distribution plate includes an injection hole for injecting a reaction gas and a distribution channel part for distributing the reaction gas such that the reaction gas introduced from the injection hole can be radially simultaneously jetted in a plurality of positions along an inner circumference surface of the distribution plate. The cover plate is coupled to a top of the distribution plate and seals a top of the distribution channel part.
    Type: Application
    Filed: August 30, 2010
    Publication date: April 7, 2011
    Inventors: Minshik Kim, Sungyong Ko, Hwankook Chae, Kunjoo Park, Keehyun Kim, Weonmook Lee
  • Publication number: 20110056514
    Abstract: A workpiece de-chucking device of a plasma reactor for dry-cleaning the inside of a reaction chamber and an ElectroStatic chuck (ESC) during workpiece de-chucking and a workpiece de-chucking method using the same are provided. The workpiece de-chucking device includes a lifting unit, an ICP source power unit, and a controller. The lifting unit lifts a workpiece mounted on a top surface of an ESC. The ICP source power unit forms a magnetic field in an inductive coil arranged outside a dielectric window. The controller outputs a source power control signal, a lift control signal, and a de-chucking control signal.
    Type: Application
    Filed: August 11, 2010
    Publication date: March 10, 2011
    Inventors: Byoungil LEE, Hyeokjin Jang, Sungyong Ko, Minshik Kim
  • Publication number: 20110049111
    Abstract: A control system for etching gas is provided. The control system includes a mass flow control unit, a flow rate control unit, and a tuning gas control unit. The mass flow control unit controls a mass flow of an etching gas input to a chamber. The flow rate control unit distributes the etching gas to an upper gas injector and a side gas injector connected with the mass flow control unit and installed in the chamber. The tuning gas control unit distributes and supplies a supplementary gas and tuning gas controlling an ion density and distribution of plasma within the chamber, to the mass flow control unit and the flow rate control unit.
    Type: Application
    Filed: August 11, 2010
    Publication date: March 3, 2011
    Inventors: Sungyong KO, Minshik KIM, Byoungil LEE, Heeseok MOON, Kwangmin LEE, Keehyun KIM, Weonmook LEE
  • Publication number: 20100110605
    Abstract: Provided is an electrostatic chuck assembly for a plasma reactor. The assembly includes an electrostatic chuck, an electrostatic chuck cover ring, and a cathode assembly cover ring. The electrostatic chuck includes a body part and a protrusion part. The body part has a disk shape of a first diameter. The protrusion part is formed integrally with the body part and protrudes from the body part, and has a disk shape of a second diameter less than the first diameter. The electrostatic chuck cover ring is disposed to surround an outer circumference of the protrusion part. The cathode assembly cover ring is disposed at an upper part of the cathode assembly to surround an outer circumference of the electrostatic chuck cover ring and an outer circumference of the body part.
    Type: Application
    Filed: October 15, 2009
    Publication date: May 6, 2010
    Inventors: Weonmook LEE, Hwankook CHAE, Kunjoo PARK, Sungyong KO, Minshik KIM, Keehyun KIM