Abstract: In an electronic device, at least a portion of a camera cover member is disposed inside a housing. The camera cover member includes a through-hole in fluid communication with the outside of the housing, and is formed to support a camera module disposed inside the housing. A microphone module is disposed inside the housing so as to be adjacent to the camera module, and includes a first circuit board disposed on the camera cover member and a microphone disposed on the first circuit board. A second circuit board is disposed to face the camera cover member with the microphone module therebetween, and includes a contact structure in contact with the first circuit board. The contact structure is configured to electrically connect the first circuit board to the second circuit board and can be disposed between the first circuit board and the second circuit board to surround the microphone.

Abstract: An electronic device is provided. The electronic device includes: a first housing; a display on a front surface of the first housing; a camera provided on the first housing; an upper speaker module provided on the first housing adjacent the camera; an upper sound hole that extends through an upper lateral surface of the first housing and is configured to emit sound generated by the upper speaker module to outside the electronic device; an upper conduit including a first conduit extending from the upper speaker module toward the upper sound hole in an extension direction, and a second conduit extending in a direction perpendicular to the extension direction of the first conduit; and an expansion portion extending from the upper conduit into the first housing to expand an internal volume of the upper conduit.

Abstract: In an electronic device, at least a portion of a camera cover member is disposed inside a housing. The camera cover member includes a through-hole in fluid communication with the outside of the housing, and is formed to support a camera module disposed inside the housing. A microphone module is disposed inside the housing so as to be adjacent to the camera module, and includes a first circuit board disposed on the camera cover member and a microphone disposed on the first circuit board. A second circuit board is disposed to face the camera cover member with the microphone module therebetween, and includes a contact structure in contact with the first circuit board. The contact structure is configured to electrically connect the first circuit board to the second circuit board and can be disposed between the first circuit board and the second circuit board to surround the microphone.