Abstract: The present invention relates to a support pole assembly for mounting an antenna and, particularly, to a support pole assembly for mounting an antenna, comprising: a support pole which is formed in a hollow structure and has an antenna device mounting hole formed at the circumferential surface thereof; an antenna device which is mounted to the support pole while passing through and covering the antenna device mounting hole and the rear portion of which is placed in the inner space of the support pole. Accordingly, the present invention provides an advantage in that the protrusion amount of the antenna device with respect to the support pole is reduced and thus the space required for mounting the antenna device can be reduced.

Abstract: A wireless communication device support assembly is disclosed, including a support pole comprising a hollow interior, a first frame having a polygonal shape disposed on top of the support pole, a plurality of wireless communication devices disposed inside the first frame, at least one or more rotational advertising apparatuses controllably elevated in a direction parallel to a longitudinal direction of the support pole, a drive unit configured to elevate or lower the rotational advertising apparatus, and a plurality of lift ropes having first ends connected with tops of the rotational advertising apparatuses and second ends connected with the drive unit.

Abstract: The present disclosure relates to a healable superplastic amorphous alloy, and specifically, to a healable superplastic amorphous alloy capable of exhibiting superplastic behavior and unique healable behavior by maximizing the complexity of the amorphous structure for an Icosahedral quenched-in nuclei quasi-crystal cluster to be formed in the amorphous matrix through the composition limitation and additive element control of Zr—Cu—Ni—Al alloy.

Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Abstract: A method and system of estimating multi-tasking performance performed in multi-processor are described. The method includes dividing a plurality of tasks into a plurality of sub tasks in accordance with predefined operation types, arranging the plurality of sub tasks in accordance with a predecessor-successor structure based on the operation types of the plurality of sub tasks, and estimating multi-tasking performance of the plurality of tasks using the arranged plurality of sub tasks.

Abstract: A method for modeling a Discrete Event System includes the steps of: a) receiving the user-defined requirement and specification of a Discrete Event System; b) extracting events and action from the user-defined requirement and specification and storing the events and action; c) generating a tree-type data structure including start node; d) searching the stored events to determine existence of allowable events from the event represented by a leaf node. which quits the generation of the tree-type data structure when there is no allowable event; e) when there is the allowable event in the stored events, generating a child node of the leaf node, the child node representing to allowable event and F) iterating the step of searching and the step of generating a child node for all the leaf nodes of the tree-type data structure.

Abstract: Method for modeling a Discrete Event System using event flow chart, which can completely describe the Discrete Event System at ease only by describing event flow without using the concept of state of the Discrete Event System.