Patents by Inventor Minxia DING

Minxia DING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12449301
    Abstract: A photoelectric detection device, including: a vacuum sealed housing, wherein the vacuum sealed housing includes a mounting interface for mounting the photodetector array so as to form a sealed space; the photodetector array has a detection surface facing an outside of the vacuum sealed housing and configured to receive multi-channel measurement optical signals; a photoelectric conversion and synchronous acquisition circuit and a high speed transmission circuit board are placed in the vacuum sealed housing, and the photodetector array is connected to the photoelectric conversion and synchronous acquisition circuit through a signal pin of the photodetector array; the photoelectric conversion and synchronous acquisition circuit is configured to synchronously convert the multi-channel measurement optical signals obtained by the photodetector array into multi-channel digital signals; and the high speed transmission circuit board is configured to perform a serial encoding processing on the converted multi-channel
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: October 21, 2025
    Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Jing Li, Huijuan Ma, Minxia Ding, Zhipeng Wu, Dan Wang
  • Publication number: 20230392982
    Abstract: A photoelectric detection device, including: a vacuum sealed housing, wherein the vacuum sealed housing includes a mounting interface for mounting the photodetector array so as to form a sealed space; the photodetector array has a detection surface facing an outside of the vacuum sealed housing and configured to receive multi-channel measurement optical signals; a photoelectric conversion and synchronous acquisition circuit and a high speed transmission circuit board are placed in the vacuum sealed housing, and the photodetector array is connected to the photoelectric conversion and synchronous acquisition circuit through a signal pin of the photodetector array; the photoelectric conversion and synchronous acquisition circuit is configured to synchronously convert the multi-channel measurement optical signals obtained by the photodetector array into multi-channel digital signals; and the high speed transmission circuit board is configured to perform a serial encoding processing on the converted multi-channel
    Type: Application
    Filed: November 30, 2020
    Publication date: December 7, 2023
    Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Jing LI, Huijuan MA, Minxia DING, Zhipeng WU, Dan WANG