Patents by Inventor Minyeul LEE

Minyeul LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dielectric structure and substrate processing apparatus including the same
    Patent number: 12713667
    Abstract: A dielectric structure may include: an insulating layer extending in a first direction; a plurality of conductor layers disposed on a first surface of the insulating layer and spaced apart from each other in the first direction; at least one semiconductor layer disposed on a second surface of the insulating layer, opposite to the first surface, and overlapping each of at least two conductor layers adjacent to each other among the plurality of conductor layers in a second direction intersecting the first direction; a first protective layer covering the plurality of conductor layers on the first surface of the insulating layer; and a second protective layer covering the at least one semiconductor layer on the second surface of the insulating layer.
    Type: Grant
    Filed: November 13, 2023
    Date of Patent: August 18, 2026
    Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science And Technology
    Inventors: Sungyoung Yoon, Jonghwa Shin, Minyeul Lee, Sungyeol Kim, Taekjin Kim, Meehyun Lim, Sungyong Lim
  • DIELECTRIC STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
    Publication number: 20240274661
    Abstract: A dielectric structure may include: an insulating layer extending in a first direction; a plurality of conductor layers disposed on a first surface of the insulating layer and spaced apart from each other in the first direction; at least one semiconductor layer disposed on a second surface of the insulating layer, opposite to the first surface, and overlapping each of at least two conductor layers adjacent to each other among the plurality of conductor layers in a second direction intersecting the first direction; a first protective layer covering the plurality of conductor layers on the first surface of the insulating layer; and a second protective layer covering the at least one semiconductor layer on the second surface of the insulating layer.
    Type: Application
    Filed: November 13, 2023
    Publication date: August 15, 2024
    Applicants: Samsung Electronics Co., Ltd., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sungyoung YOON, Jonghwa SHIN, Minyeul LEE, Sungyeol KIM, Taekjin KIM, Meehyun LIM, Sungyong LIM