Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: Release liners and methods protect one or more adhesives, wherein the release liners and/or methods comprise at least one abhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance, wherein the getter material is at least one substance selected from the group consisting of lithium, beryllium, boron, sodium, magnesium, potassium, calcium, manganese, iron, nickel, zinc, gallium, germanium, cadmium, indium, caesium, barium, boron oxide, calcium oxide, chromium oxide, manganese oxide, iron oxide, copper oxide, silver oxide, indium oxide, barium oxide, lead oxide and mixtures of two or more of the above substances.

Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: An adhesive tape containing an adhesive comprising at least one polymer optionally a tackifier resin at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.

Abstract: Release liners and methods protect one or more adhesives, wherein the release liners and/or methods comprise at least one abhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance, wherein the getter material is at least one substance selected from the group consisting of lithium, beryllium, boron, sodium, magnesium, potassium, calcium, manganese, iron, nickel, zinc, gallium, germanium, cadmium, indium, caesium, barium, boron oxide, calcium oxide, chromium oxide, manganese oxide, iron oxide, copper oxide, silver oxide, indium oxide, barium oxide, lead oxide and mixtures of two or more of the above substances

Abstract: In the case of a liner for the protection of adhesives, the protective effect is to be enhanced in respect of permeates originating from the environment and also permeates included during winding or stacking and other processing steps. This enhancement is accomplished through provision of a liner which comprises at least one adhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance.

Abstract: Liner for protecting adhesives with respect to permeates originating from the surroundings or included during winding, stacking or other process steps, having at least one non-stick release layer and at least one getter material that is able to absorb at least one substance capable of permeation, the getter material being contained as a dispersed phase in at least one layer of the liner.

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract: An adhesive tape containing an adhesive comprising at least one polymer optionally a tackifier resin at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.

Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Abstract: A laminate made of two rigid substrates and an adhesive film arranged between them, at least one of the substrates being transparent, the thickness of the adhesive film being not greater than 80 ?m and the adhesive film comprising at least one adhesive layer made of an adhesive compound to which one or more plasticizers are added, at least one of which is a reactive plasticizer.

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract: An adhesive strip, with improved barrier effect, encapsulates electronic arrangements against permeates, whereby the composite system comprises at least (a) an adhesive strip containing at least one pressure-sensitive adhesive substance for direct application on a substrate; and (b) at least one release liner which lies directly upon the pressure-sensitive adhesive substance, wherein the surface of the release liner, that faces the pressure-sensitive adhesive substance, has a surface roughness of less that 100 nm, measured as an arithmetic mean Sa as per ISO/FDIS 25178-2:2011 of the amounts of at least 10,000 height values of the profile of a partial surface of at least 200 ?m×200 ?m. A method produces a release liner with a smooth surface for equipping barrier adhesive strips by removing the liner in order to encapsulate electronic arrangements with the adhesive strip.

Abstract: Liner for protecting adhesives with respect to permeates originating from the surroundings or included during winding, stacking or other process steps, having at least one non-stick release layer and at least one getter material that is able to absorb at least one substance capable of permeation, the getter material being contained as a dispersed phase in at least one layer of the liner.

Abstract: The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40° C.; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one acrylate- or methacrylate-based type of reactive resin with a softening temperature less than 40° C., preferably less than 20° C.; and (d) at least one type of photoinitiator for initiating radical curing.

Abstract: An adhesive and method for encapsulating an electronic arrangement with respect to permeants, wherein the adhesive and method have (a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which, considered as hypothetical homopolymer, has a softening temperature of greater than 40° C., (b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., preferably less than 20° C.

Abstract: An adhesive tape, with a carrier material, has an acrylate-based foam layer bearing at least one layer of pressure-sensitive adhesive. The pressure-sensitive adhesive (a) being composed of a mixture of at least two different synthetic rubbers, more particularly based on vinylaromatic block copolymers, (b) comprising a resin which is not soluble in the acrylates forming the foam layer, and (c) being chemically uncrosslinked.