Abstract: A method of planarizing a device having a surface topography with at least one material at a surface of the device is described. The method comprises the steps of depositing a stop layer over at least a portion of the at least one material which substantially retains the surface topography of the device. A sacrificial layer is deposited over at least a portion of the stop layer. A planarization process is performed on the device. The planarization process includes the steps of performing a chemical mechanical polish (CMP) on the top surface of the sacrificial layer. A physical removal step is conducted on the remainder portion of the sacrificial layer to form a planarized surface. A second CMP step and a second physical removal step are conducted, to form a planarized device.

Abstract: In one embodiment, a method for producing a graphene-containing composition is provided, the method comprising: (i) mixing a graphene oxide with a medium to form a mixture; and (ii) heating the mixture to a temperature above about 40° C., whereby a graphene-containing composition is formed from the mixture. Composites of polymers with disperse functionalized graphene sheets and the applications thereof are also described.