Patents by Inventor Mio OHMURA

Mio OHMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8648246
    Abstract: According to one embodiment, a thermoelectric module includes a housing and a power generation member. The housing has a first temperature layer and a second temperature layer, the first temperature layer and the second temperature layer being stacked, the housing further having a cylindrical through-hole provided so as to penetrate the first temperature layer and the second temperature layer. The power generation member has thermoelectric materials stacked such that current flows in one direction in the power generation member, the power generation member being provided in the through-hole so that opposite ends of each of the thermoelectric materials are positioned at the first temperature layer and the second temperature layer, respectively.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: February 11, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Mio Ohmura, Jun Karasawa, Naruhito Kondo, Osamu Tsuneoka, Yasuhito Saito
  • Publication number: 20110247670
    Abstract: According to one embodiment, a thermoelectric module includes a housing and a power generation member. The housing has a first temperature layer and a second temperature layer, the first temperature layer and the second temperature layer being stacked, the housing further having a cylindrical through-hole provided so as to penetrate the first temperature layer and the second temperature layer. The power generation member has thermoelectric materials stacked such that current flows in one direction in the power generation member, the power generation member being provided in the through-hole so that opposite ends of each of the thermoelectric materials are positioned at the first temperature layer and the second temperature layer, respectively.
    Type: Application
    Filed: January 19, 2011
    Publication date: October 13, 2011
    Inventors: Mio OHMURA, Jun Karasawa, Naruhito Kondo, Osamu Tsuneoka, Yasuhito Saito