Patents by Inventor Mio TOMIYAMA

Mio TOMIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120202348
    Abstract: A method for fabricating a semiconductor device according to an embodiment, includes forming a plurality of films above a substrate in a same chamber without transferring the substrate out of the chamber, forming a target film to be polished above the plurality of films, and polishing the target film by a chemical mechanical polishing (CMP) technique using a film on a front side among the plurality of films as a polishing stopper.
    Type: Application
    Filed: September 21, 2011
    Publication date: August 9, 2012
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Mio TOMIYAMA, Jun TAKAYASU, Katsuyasu SHIBA, Atsushi SHIGETA