Abstract: A method of detecting a leak-induced abnormal condition in a semiconductor processing system comprising a subsystem. The method includes determining a performance characteristic of the semiconductor processing system. The method includes determining the leak-induced abnormal condition is present within the subsystem, wherein the determination of the presence of the leak-induced abnormal condition is based on the performance characteristic and a temperature characteristic of the subsystem. The method also includes performing a corrective action based on the determination of the presence of the leak-induced abnormal condition.

Abstract: A method of detecting a leak-induced abnormal condition in a fluid line system having a plurality of heaters includes determining a plurality of temperature characteristics at a plurality of locations of the fluid line system, where each temperature from among the plurality of temperature characteristics is associated with at least one heater from among the plurality of heaters and monitoring, for each of the plurality of heaters, an electrical characteristic of the heater. The method includes determining the leak-induced abnormal condition is present within the fluid line system in response to the electrical characteristic of a given heater from among the plurality of heaters and the temperature characteristic associated with the given heater satisfying a temperature-and-electrical characteristics (TEC) deviation condition and performing a corrective action in response to determining the leak-induced abnormal condition is present.

Abstract: A method for monitoring a surface condition of a component includes providing thermal energy to a component, determining a thermal response of the heater in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting the surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.

Abstract: A method includes providing thermal energy to a component, determining a thermal response of the component in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting a surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.

Abstract: A method of detecting a leak-induced abnormal condition in a fluid line system having a plurality of heaters includes determining a plurality of temperature characteristics at a plurality of locations of the fluid line system, where each temperature from among the plurality of temperature characteristics is associated with at least one heater from among the plurality of heaters and monitoring, for each of the plurality of heaters, an electrical characteristic of the heater. The method includes determining the leak-induced abnormal condition is present within the fluid line system in response to the electrical characteristic of a given heater from among the plurality of heaters and the temperature characteristic associated with the given heater satisfying a temperature-and-electrical characteristics (TEC) deviation condition and performing a corrective action in response to determining the leak-induced abnormal condition is present.

Abstract: A sensor for detecting material deposits in a fluid flow conduit includes a body and an array of pairs of temperature sensors disposed within the body, where each pair of temperature sensors is spaced a distance apart along a primary flow direction of the fluid flow conduit.

Abstract: A method of controlling a thermal system of an industrial process includes monitoring intermediate data, associating the intermediate data with correlation data, wherein the correlation data includes an internal process control input, an external heater control input, the output control, or a combination thereof. The method further includes generating a model that defines a relationship between the intermediate data and the correlation data, identifying a state of the heater system based on the model, and selectively performing a corrective action based on the identified state of the heater system.

Abstract: A method includes providing thermal energy to a component, determining a thermal response of the component in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting a surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.

Abstract: A method for monitoring a semiconductor processing system including a gas delivery system, a thermal system, and a fluid flow line includes obtaining a plurality of operational data from the gas delivery system, the thermal system, or a combination thereof and determining a performance characteristic of the fluid flow line based on one or more operational data of the plurality of operational data. The method includes identifying one or more locations associated with the one or more operational data in a reference virtual model and generating a dynamic state model of the fluid flow line based on the reference virtual model, the one or more identified locations, and the determined performance characteristic, where the dynamic state model is a digital representation of the fluid flow line.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. A spacing between the first member and the second member along the adjacent faces is less than 5 ?m and a surface roughness of the adjacent faces of the first and second ceramic members is between 5 mm and 100 nanometers.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 ?m.

Abstract: A method of joining is provided. the method includes preparing a first member, preparing a second member, and forming at least one trench in at least one of the first member and the second member. The method further includes placing a strip of solid aluminum material between the first member and the second member across the trench, bringing the first member and the second member together to contact the solid aluminum material and to form an assembly, and applying a force and heat to the assembly above a melting point of the solid aluminum material such that the solid aluminum material flows into the trench. Additionally, the method further includes applying additional heat to the assembly at or above a wetting temperature of the member in which the trench is formed to bond the first member to the second member along adjacent faces and cooling the assembly.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 ?m.