Patents by Inventor Mirei Toida

Mirei Toida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE TAPE ATACHING METHOD
    Publication number: 20130306215
    Abstract: An adhesive tape attaching method including an aligning step of positioning the central portion of a wafer directly below the central portion of an adhesive tape, a partial attaching step of pressing the adhesive tape on the front side of the wafer by using an attaching roller positioned so as to cover the diameter of the adhesive tape passing through the central portion of the adhesive tape, thereby attaching a part of the adhesive tape to the wafer at a position where the central portion of the adhesive tape is superimposed on the central portion of the wafer, and an attaching step of rotationally moving the attaching roller from the central portion of the wafer to the radially opposite outer circumferential portions of the wafer after performing the partial attaching step, thereby attaching the adhesive tape to the wafer.
    Type: Application
    Filed: May 6, 2013
    Publication date: November 21, 2013
    Applicant: Disco Corporation
    Inventor: Mirei TOIDA
  • Semiconductor wafer dividing method
    Patent number: 6593170
    Abstract: A method of dividing a semiconductor wafer of which the surface has a plurality of chips sectioned by streets, into individual chips, characterized in that it comprises a scribing step in which division guide lines are formed by drawing scribed lines along the streets on the surface of the semiconductor wafer, a tape sticking step in which a tape is stuck onto the surface having the division guide lines formed thereon, of the semiconductor wafer, and a back surface cutting step in which cutting grooves are formed in the back surface, to which the tape is stuck, of the semiconductor wafer such that a bit of uncut portions are left along the division guide lines.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: July 15, 2003
    Assignee: Disco Corporation
    Inventors: Satoshi Tateiwa, Mirei Toida
  • Semiconductor wafer dividing method
    Publication number: 20010041387
    Abstract: A method of dividing a semiconductor wafer of which the surface has a plurality of chips sectioned by streets, into individual chips, characterized in that it comprises a scribing step in which division guide lines are formed by drawing scribed lines along the streets on the surface of the semiconductor wafer, a tape sticking step in which a tape is stuck onto the surface having the division guide lines formed thereon, of the semiconductor wafer, and a back surface cutting step in which cutting grooves are formed in the back surface, to which the tape is stuck, of the semiconductor wafer such that a bit of uncut portions are left along the division guide lines.
    Type: Application
    Filed: May 2, 2001
    Publication date: November 15, 2001
    Inventors: Satoshi Tateiwa, Mirei Toida