Patents by Inventor Mirek Boruta

Mirek Boruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi cut wafer saw process
    Patent number: 5786266
    Abstract: A method of cutting a plate-like wafer, particularly a semiconductor wafer, while removing a deposited material from along a scribe line. The deposited material having a width generally greater than the width of the saw blade. The method includes making one scribing cut to one side of the scribe line, making a second scribing cut to the other side of the scribe line, and making a severing cut along the scribe line to dice the wafer.
    Type: Grant
    Filed: September 16, 1996
    Date of Patent: July 28, 1998
    Assignee: LSI Logic Corporation
    Inventor: Mirek Boruta
  • High pressure lid seal clip apparatus
    Patent number: 5716493
    Abstract: A lid is sealed to an integrated circuit package using a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The secondary jig attaches to the fabrication boat at a position indexed to apply optimal assembly force at the package center normal of the package lid plane.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: February 10, 1998
    Inventors: Sutee Vongfuangfoo, Mirek Boruta, Galen Kirkpatrick
  • Method of centering a high pressure lid seal
    Patent number: 5695593
    Abstract: A lid is sealed to an integrated circuit package by a method that uses a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The pressure foot is retracted against the spring bias while secondary jig index pins are meshed with corresponding sockets in the fabrication boat that are aligned with the package position on the boat. When the pins and sockets are meshed, the pressure foot is released to apply optimal assembly force at the package center normal of the package lid plane.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: December 9, 1997
    Assignee: LSI Logic Corporation
    Inventors: Sutee Vongfuangfoo, Mirek Boruta, Galen Kirkpatrick
  • Method of centering a lid seal clip
    Patent number: 5632437
    Abstract: A lid is sealed to an integrated circuit package by a method that uses a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The pressure foot is retracted against the spring bias while secondary jig index pins are meshed with corresponding sockets in the fabrication boat that are aligned with the package position on the boat. When the pins and sockets are meshed, the pressure foot is released to apply optimal assembly force at the package center normal of the package lid plane.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: May 27, 1997
    Assignee: LSI Logic Corporation
    Inventors: Sutee Vongfuangfoo, Mirek Boruta, Galen Kirkpatrick
  • Centering lid seal clip apparatus
    Patent number: 5598775
    Abstract: A lid is sealed to an integrated circuit package using a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The secondary jig attaches to the fabrication boat at a position indexed to apply optimal assembly force at the package center normal of the package lid plane.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: February 4, 1997
    Assignee: LSI Logic Corporation
    Inventors: Sutee Vongfuangfoo, Mirek Boruta, Galen Kirkpatrick