Patents by Inventor Mirko Lehmann
Mirko Lehmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11382182Abstract: A planar heating element comprising a PTC resistive structure, which is arranged in a defined surface region of a first surface of a support substrate. The electrical connection contacts for connection to an electrical voltage source are associated with the PTC resistive structure, wherein the PTC resistive structure—starting from the two electrical connection contacts—has at least one internal conductive trace and a parallel connected, external conductive trace. The internal conductive trace has a greater resistance than the external conductive trace and the resistances of the internal conductive trace and external conductive trace are so sized that upon applying a voltage an essentially uniform temperature distribution is present within the defined surface region.Type: GrantFiled: June 9, 2020Date of Patent: July 5, 2022Assignee: Innovative Sensor Technology IST AGInventors: Jiri Holoubek, Mirko Lehmann, Josef Vik
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Publication number: 20200305240Abstract: A planar heating element comprising a PTC resistive structure, which is arranged in a defined surface region of a first surface of a support substrate. The electrical connection contacts for connection to an electrical voltage source are associated with the PTC resistive structure, wherein the PTC resistive structure—starting from the two electrical connection contacts—has at least one internal conductive trace and a parallel connected, external conductive trace. The internal conductive trace has a greater resistance than the external conductive trace and the resistances of the internal conductive trace and external conductive trace are so sized that upon applying a voltage an essentially uniform temperature distribution is present within the defined surface region.Type: ApplicationFiled: June 9, 2020Publication date: September 24, 2020Inventors: Jiri Holoubek, Mirko Lehmann, Josef Vlk
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Patent number: 10694585Abstract: The invention relates to a planar heating element (1) comprising a PTC resistive structure (2), which is arranged in a defined surface region (3) of a first surface (4) of a support substrate (5), wherein electrical connection contacts (6) for connection to an electrical voltage source (7) are associated with the PTC resistive structure (2), wherein the PTC resistive structure (2)—starting from the two electrical connection contacts (6)—has at least one internal conductive trace (8) and a parallel connected, external conductive trace (9), wherein the internal conductive trace (8) has a greater resistance than the external conductive trace (9) and wherein the resistances of the internal conductive trace (8) and external conductive trace (9) are so sized that upon applying a voltage an essentially uniform temperature distribution is present within the defined surface region (3).Type: GrantFiled: June 12, 2015Date of Patent: June 23, 2020Assignee: Innovative Sensor Technology IST IGInventors: Jiri Holoubek, Mirko Lehmann, Josef Vlk
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Publication number: 20180152989Abstract: The invention relates to a planar heating element (1) comprising a PTC resistive structure (2), which is arranged in a defined surface region (3) of a first surface (4) of a support substrate (5), wherein electrical connection contacts (6) for connection to an electrical voltage source (7) are associated with the PTC resistive structure (2), wherein the PTC resistive structure (2)—starting from the two electrical connection contacts (6)—has at least one internal conductive trace (8) and a parallel connected, external conductive trace (9), wherein the internal conductive trace (8) has a greater resistance than the external conductive trace (9) and wherein the resistances of the internal conductive trace (8) and external conductive trace (9) are so sized that upon applying a voltage an essentially uniform temperature distribution is present within the defined surface region (3).Type: ApplicationFiled: June 12, 2015Publication date: May 31, 2018Inventors: Jiri Holoubek, Mirko Lehmann, Josef Vlk
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Patent number: 9543606Abstract: The present invention pertains to a fuel cell with a storage unit (4) for storing hydrogen (Hx), with a proton conductive layer, which covers a surface of the storage unit (4), and with a cathode (7) on a side of the proton conductive layer, which side is located opposite, wherein the storage unit (4) is directly coupled with an anode and/or the storage unit (4) is incorporated in a substrate (1) of a semiconductor. The storage unit (4) is preferably connected to the substrate (1) at least via a stress compensation layer (3).Type: GrantFiled: March 21, 2014Date of Patent: January 10, 2017Assignee: Micronas GmbHInventors: Mirko Lehmann, Claas Mueller, Holger Reinecke, Mirko Frank, Gilbert Erdler
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Publication number: 20140205927Abstract: The present invention pertains to a fuel cell with a storage unit (4) for storing hydrogen (Hx), with a proton conductive layer, which covers a surface of the storage unit (4), and with a cathode (7) on a side of the proton conductive layer, which side is located opposite, wherein the storage unit (4) is directly coupled with an anode and/or the storage unit (4) is incorporated in a substrate (1) of a semiconductor. The storage unit (4) is preferably connected to the substrate (1) at least via a stress compensation layer (3).Type: ApplicationFiled: March 21, 2014Publication date: July 24, 2014Applicant: Micronas GmbHInventors: Mirko LEHMANN, Claas MUELLER, Holger REINECKE, Mirko FRANK, Gilbert ERDLER
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Patent number: 8715884Abstract: The present invention pertains to a fuel cell with a storage unit (4) for storing hydrogen (Hx), with a proton conductive layer, which covers a surface of the storage unit (4), and with a cathode (7) on a side of the proton conductive layer, which side is located opposite, wherein the storage unit (4) is directly coupled with an anode and/or the storage unit (4) is incorporated in a substrate (1) of a semiconductor. The storage unit (4) is preferably connected to the substrate (1) at least via a stress compensation layer (3).Type: GrantFiled: October 10, 2008Date of Patent: May 6, 2014Assignee: Micronas GmbHInventors: Mirko Lehmann, Claas Muller, Holger Reinecke, Mirko Frank, Gilbert Erdler
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Patent number: 8329104Abstract: A measurement device has at least one sensor for detecting a parameter, a data storage unit, and a power supply for said sensor and data storage unit. In addition to the first sensor, the measurement device has at least one second sensor connected to the power supply and to the data storage unit. The second sensor is provided for detecting a physical quantity acting on the first sensor and is capable of permanently altering the measurement characteristic of the first sensor. An evaluator functions coactively with the second sensor and the data storage unit so that the permanent alteration of the measurement characteristic of the first sensor is recordable as a function of the measurement signal of the second sensor.Type: GrantFiled: June 26, 2008Date of Patent: December 11, 2012Assignees: Micronas GmbH, Micronas Holding GmbHInventors: Mirko Lehmann, Ingo Freund, Sonja Mohry, Holger Klapproth
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Patent number: 8324913Abstract: The invention relates to a moisture sensor which comprises a receiving area on its surface for a moisture film, the layer thickness of which is dependent on the relative humidity in the surrounding of the receiving area. The moisture sensor has a signal source which is connected to at least one control electrode at at least one infeed, the electrode abutting the receiving area, for providing a control voltage to the moisture film. The moisture sensor comprises at least one potential sensor which has at least one sensor area, under the receiving area, which is spaced apart from the at least one infeed. The sensor area is electrically insulated from the receiving area by an insulation layer, located between the sensor area and the receiving area, in such a way that an electrical potential can be capacitively detected by means of the potential sensor, the potential being dependent on the layer thickness of the moisture film and the control voltage.Type: GrantFiled: April 2, 2008Date of Patent: December 4, 2012Assignee: Micronas GmbHInventors: Mirko Lehmann, Heinz-Peter Frerichs, Ingo Freund
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Patent number: 8084792Abstract: An electric component comprising a sensor and/or actuator chip with a substrate on which a passivating layer and a sensor and/or actuator structure consisting of an active surface area is arranged. The chip is surrounded by an encapsulation having an opening which forms an access to the at least one active surface area. A layer stack is arranged on the substrate, said stack of layers comprising from the passivating layer to the substrate at least one first strip conductor layer, a first electric insulating layer, a second strip conductor layer and a second electric insulating layer. The first conductor strip layer is fully arranged outside the area of the chip covered by the opening. At least one conductor strip of the second conductor strip layer is connected to the sensor and/or actuator structure.Type: GrantFiled: July 21, 2010Date of Patent: December 27, 2011Assignee: Micronas GmbHInventors: Mirko Lehmann, Ingo Freund
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Publication number: 20100283087Abstract: An electric component comprising a sensor and/or actuator chip with a substrate on which a passivating layer and a sensor and/or actuator structure consisting of an active surface area is arranged. The chip is surrounded by an encapsulation having an opening which forms an access to the at least one active surface area. A layer stack is arranged on the substrate, said stack of layers comprising from the passivating layer to the substrate at least one first strip conductor layer, a first electric insulating layer, a second strip conductor layer and a second electric insulating layer. The first conductor strip layer is fully arranged outside the area of the chip covered by the opening. At least one conductor strip of the second conductor strip layer is connected to the sensor and/or actuator structure.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Applicant: MICRONAS GMBHInventors: Mirko Lehmann, Ingo Freund
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Patent number: 7795012Abstract: A device for investigating activities of cell cultures in a liquid culture medium includes a receptacle for the culture medium, and one or more sensors for measurement of cell culture activities. An opening for adding and removing liquid culture medium is provided. A separating element can be placed close to the receptacle bottom, forming a partial space with a small volume relative to the entire volume. A flow channel that communicates with the small volume and the reservoir and/or the sensors are placed in the small volume partial space. By adjustment of the separating element distance from the receptacle bottom, a microreaction volume exactly fitting the current requirements is obtained. For regeneration of the cell culture solution in the small volume partial space, the separating element can be elevated and depressed, or liquid can be injected into the small volume by the through-flow channel, providing convective mixing of fresh and spent medium.Type: GrantFiled: December 7, 2007Date of Patent: September 14, 2010Assignee: Micronas GmbHInventors: Mirko Lehmann, Martin Brischwein, Werner Baumann, Ralf Ehret, Ingo Freund
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Patent number: 7777283Abstract: An electric component comprising a sensor and/or actuator chip with a substrate on which a passivating layer and a sensor and/or actuator structure consisting of an active surface area is arranged. The chip is surrounded by an encapsulation having an opening which forms an access to the at least one active surface area. A layer stack is arranged on the substrate, said stack of layers comprising from the passivating layer to the substrate at least one first strip conductor layer, a first electric insulating layer, a second strip conductor layer and a second electric insulating layer. The first conductor strip layer is fully arranged outside the area of the chip covered by the opening. At least one conductor strip of the second conductor strip layer is connected to the sensor and/or actuator structure.Type: GrantFiled: November 26, 2004Date of Patent: August 17, 2010Assignee: Micronas GmbHInventors: Mirko Lehmann, Ingo Freund
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Patent number: 7767443Abstract: A device includes a carrier element with a surface prepared for direct or indirect coupling or receiving of cells, at least one optical detector to receive a luminescence signal, the detector being integrated into the carrier element below the prepared surface, a cover covering the prepared surface to form a cavity, the cover having an inlet opening and an outlet opening, and an excitation source connected to the inlet opening. The excitation source constitutes a reservoir for a chemical or biological excitation substance or medium that influences the metabolism of the cell, with metabolic processes being made visible by luminescence and detected by at the least one optical detector.Type: GrantFiled: March 5, 2003Date of Patent: August 3, 2010Assignee: Micronas GmbHInventors: Mirko Lehmann, Holger Klapproth
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Publication number: 20100176826Abstract: The invention relates to a moisture sensor which comprises a receiving area on its surface for a moisture film, the layer thickness of which is dependent on the relative humidity in the surrounding of the receiving area. The moisture sensor has a signal source which is connected to at least one control electrode at at least one infeed, the electrode abutting the receiving area, for providing a control voltage to the moisture film. The moisture sensor comprises at least one potential sensor which has at least one sensor area, under the receiving area, which is spaced apart from the at least one infeed. The sensor area is electrically insulated from the receiving area by an insulation layer, located between the sensor area and the receiving area, in such a way that an electrical potential can be capacitively detected by means of the potential sensor, the potential being dependent on the layer thickness of the moisture film and the control voltage.Type: ApplicationFiled: April 2, 2008Publication date: July 15, 2010Applicant: MICRONAS GMBHInventors: Mirko Lehmann, Heinz-Peter Frerichs, Ingo Freund
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Patent number: 7692914Abstract: A microsystem consists of at least one sensor and/or actuator, a signal processor and/or control mechanism linked therewith, a timer, and an electrical energy storage unit providing a current source for at least the signal processor and/or control mechanism. The signal processor and/or control mechanism has a mode switching mechanism, by means of which it can be set to an operating mode and a resting mode that consumes less current compared with the operating mode. The mode switching mechanism has at least one control signal input which is electrically connected to the timer for application of a mode switching signal. The timer is a mechanical timer, which has at least one micromechanical cantilever, which is coupled with at least one electrical element connected to the at least one control signal input of the signal processor and/or control mechanism in such a way that said electrical element is time-dependently set.Type: GrantFiled: February 18, 2008Date of Patent: April 6, 2010Assignee: Micronas GmbHInventor: Mirko Lehmann
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Patent number: 7687111Abstract: In a method for structuring the surface of a substrate, a substrate is elastically expanded by the application of a tensile stress so that a surface area of the substrate in which a structure is to be created, is enlarged. Then, in the surface area, a structure is produced that is larger than the structure to be produced. For this purpose at least one solution is applied to the substrate, which solvent contains at least one solid substance dissolved in a solvent. The solvent is then removed from the surface of the substrate so that the solid substance remains behind. The expansion of the substrate is at least partly reversed by the reduction or removal of the tensile stress so that the size of the structure is reduced to the size of the structure to be produced. In the material of the substrate, a compression stress can also be created to reduce the size of the structure to the size of the structure to be produced.Type: GrantFiled: June 30, 2004Date of Patent: March 30, 2010Assignee: Micronas GmbHInventor: Mirko Lehmann
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Publication number: 20090325038Abstract: The present invention pertains to a fuel cell with a storage unit (4) for storing hydrogen (Hx), with a proton conductive layer, which covers a surface of the storage unit (4), and with a cathode (7) on a side of the proton conductive layer, which side is located opposite, wherein the storage unit (4) is directly coupled with an anode and/or the storage unit (4) is incorporated in a substrate (1) of a semiconductor. The storage unit (4) is preferably connected to the substrate (1) at least via a stress compensation layer (3).Type: ApplicationFiled: October 10, 2008Publication date: December 31, 2009Applicant: MICRONAS GmbHInventors: Mirko Lehmann, Claas Muller, Holger Reinecke, Mirko Frank, Gilbert Erdler
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Publication number: 20090317917Abstract: The present invention concerns in general a biosensor in the form of a microchip for the optical detection of analytes and a method using this biosensor. In particular the invention concerns biosensors for detecting an analyte by time-resolved luminescence measurement and a corresponding method.Type: ApplicationFiled: April 14, 2009Publication date: December 24, 2009Inventors: Holger Klapproth, Mirko Lehmann
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Patent number: 7592195Abstract: In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers.Type: GrantFiled: February 7, 2003Date of Patent: September 22, 2009Assignee: Micronas GmbHInventors: Markus Rogalla, Ingo Freund, Mirko Lehmann