Patents by Inventor Miroslaw Florjanczyk
Miroslaw Florjanczyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11867946Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400° C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.Type: GrantFiled: December 26, 2022Date of Patent: January 9, 2024Assignee: POET Technologies, Inc.Inventors: William Ring, Miroslaw Florjanczyk
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Publication number: 20230152519Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.Type: ApplicationFiled: January 3, 2023Publication date: May 18, 2023Inventors: William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
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Publication number: 20230135231Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400° C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.Type: ApplicationFiled: December 26, 2022Publication date: May 4, 2023Inventors: William Ring, Miroslaw Florjanczyk
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Patent number: 11592621Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: GrantFiled: April 12, 2021Date of Patent: February 28, 2023Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Patent number: 11585984Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: GrantFiled: April 12, 2021Date of Patent: February 21, 2023Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Patent number: 11543588Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.Type: GrantFiled: October 25, 2021Date of Patent: January 3, 2023Inventors: William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
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Patent number: 11536904Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.Type: GrantFiled: April 19, 2021Date of Patent: December 27, 2022Inventors: William Ring, Miroslaw Florjanczyk
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Publication number: 20220043210Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.Type: ApplicationFiled: October 25, 2021Publication date: February 10, 2022Inventors: William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
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Patent number: 11156779Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.Type: GrantFiled: July 20, 2020Date of Patent: October 26, 2021Assignee: POET Technologies, Inc.Inventors: William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
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Publication number: 20210255396Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: ApplicationFiled: April 12, 2021Publication date: August 19, 2021Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Publication number: 20210255386Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.Type: ApplicationFiled: April 19, 2021Publication date: August 19, 2021Inventors: William Ring, Miroslaw Florjanczyk
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Publication number: 20210231877Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: ApplicationFiled: April 12, 2021Publication date: July 29, 2021Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Patent number: 10983277Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.Type: GrantFiled: January 18, 2020Date of Patent: April 20, 2021Assignee: POET Technologies, Inc.Inventors: William Ring, Miroslaw Florjanczyk
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Patent number: 10976497Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: GrantFiled: September 25, 2019Date of Patent: April 13, 2021Assignee: POET Technologies, Inc.Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Patent number: 10976496Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: GrantFiled: August 6, 2019Date of Patent: April 13, 2021Assignee: POET Technologies, Inc.Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Publication number: 20200348468Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.Type: ApplicationFiled: July 20, 2020Publication date: November 5, 2020Inventors: William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
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Publication number: 20200257054Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: ApplicationFiled: September 25, 2019Publication date: August 13, 2020Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Publication number: 20200257053Abstract: The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.Type: ApplicationFiled: August 6, 2019Publication date: August 13, 2020Inventors: Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
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Patent number: 10718905Abstract: A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.Type: GrantFiled: January 25, 2019Date of Patent: July 21, 2020Assignee: POET Technologies, Inc.Inventors: William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
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Publication number: 20200225414Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.Type: ApplicationFiled: January 18, 2020Publication date: July 16, 2020Inventors: William Ring, Miroslaw Florjanczyk