Patents by Inventor Miryoung KANG

Miryoung KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8808599
    Abstract: Provided is a method of manufacturing a damper assembly. In the method, a case constituting an appearance of the damper assembly and having an open surface is molded, the case is inserted in a jig, the case is filled with a thermal insulating material to blow and mold the thermal insulating material, and a closing plate is coupled to the case to cover the open surface of the case. The closing plate contacts the discharge duct when the damper assembly closes the discharge duct. Accordingly, dimension stability, a defect rate, and sealing and insulating performances of the damper assembly are improved.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: August 19, 2014
    Assignee: LG Electronics Inc.
    Inventors: Jaeyoul Lee, Ilyoong Park, Changbong Choi, Miryoung Kang, Manho Park
  • Publication number: 20120025418
    Abstract: Provided is a method of manufacturing a damper assembly. In the method, a case constituting an appearance of the damper assembly and having an open surface is molded, the case is inserted in a jig, the case is filled with a thermal insulating material to blow and mold the thermal insulating material, and a closing plate is coupled to the case to cover the open surface of the case. The closing plate contacts the discharge duct when the damper assembly closes the discharge duct. Accordingly, dimension stability, a defect rate, and sealing and insulating performances of the damper assembly are improved.
    Type: Application
    Filed: July 25, 2011
    Publication date: February 2, 2012
    Applicant: LG ELECTRONICS INC.
    Inventors: Jaeyoul LEE, Ilyoong PARK, Changbong CHOI, Miryoung KANG, Manho PARK