Abstract: The present invention provides a black photosensitive composition which has excellent residue suppressibility in a case where a pattern is formed and which makes it possible to form a pattern having excellent adhesiveness with a smaller exposure amount, a production method for a black photosensitive composition, a cured film, a color filter, a light shielding film, an optical element, a solid-state imaging element, and a headlight unit. The black photosensitive composition according to the present invention is a black photosensitive composition containing a black pigment, a resin, a carboxylic acid anhydride, and a polymerizable compound, in which the carboxylic acid anhydride has a molecular weight of 50 to 550, the carboxylic acid anhydride has a content of 0.30% to 10.0% by mass with respect to a total solid content of the black photosensitive composition, and the black pigment has an average particle diameter of 250 nm or less.

Abstract: Provide are a composition with which a pattern (patterned cured film) with excellent light shielding properties and suppressed undercut can be formed; a light shielding film; a solid-state imaging element; an image display device; and a method for manufacturing a cured film. The composition includes carbon black, barium sulfate, one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative, an acid generator, and a crosslinking agent having a crosslinkable group which is crosslinked by an acid.

Abstract: Provided are a composition with which a cured film having excellent light shielding properties and low reflection properties can be produced; a light shielding film; a solid-state imaging element; an image display device; and a method for manufacturing a cured film. The composition including carbon black, barium sulfate, one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative, a resin, and a solvent, in which the solvent includes a solvent A having a boiling point of 180° C. or higher, a solvent B having a boiling point of 140° C. or higher and lower than 180° C., and a solvent C having a boiling point of 100° C. or higher and lower than 140° C.