Patents by Inventor Misaki Imai

Misaki Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and electronic component device
    Patent number: 10818579
    Abstract: There is provided a lead frame. The lead frame includes: a die pad; a lead terminal that is separated from the die pad and disposed around the die pad; and a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and the lead terminal. The resin layer has an opening portion that exposes at least a lower surface of the lead terminal.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: October 27, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shintaro Hayashi, Kentaro Kaneko, Tsukasa Nakanishi, Misaki Imai
  • LEAD FRAME AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20190115288
    Abstract: There is provided a lead frame. The lead frame includes: a die pad; a lead terminal that is separated from the die pad and disposed around the die pad; and a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and the lead terminal. The resin layer has an opening portion that exposes at least a lower surface of the lead terminal.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 18, 2019
    Inventors: Shintaro Hayashi, Kentaro Kaneko, Tsukasa Nakanishi, Misaki Imai