Patents by Inventor Misaki Komatsu

Misaki Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230177207
    Abstract: According to one embodiment, an information processing apparatus includes a processor configured to: acquire a record that is at least one of a record related to a process for data and a record related to consent to the process for the data, from a first storage system that stores the record; acquire a log of an operation performed in relation to at least one of the process and the consent, from a second storage system that stores the log; and verify consistency of the acquired record, based on the acquired log.
    Type: Application
    Filed: September 6, 2022
    Publication date: June 8, 2023
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tomoko YONEMURA, Tsukasa OMINO, Misaki KOMATSU, Yoshikazu HANATANI
  • Publication number: 20230118762
    Abstract: An information processing apparatus includes: a receiver to receive a verification request of consistency for an object of verification being a handling consent record or a handling execution record related to a handling of data; a searcher to search a storage system storing at least one handling consent record and at least one handling execution record on a basis of the verification request, and acquire the handling consent record or the handling execution record which is the object of verification and a handling consent record and a handling execution record related to the object of verification; a period calculator to calculate at least one of a consent period or a non-consent period on a basis of acquired handling consent record(s); and a verifier to verify the consistency on a basis of acquired handling execution record(s) and at least one of the consent period or the non-consent period.
    Type: Application
    Filed: September 12, 2022
    Publication date: April 20, 2023
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tsukasa OMINO, Tomoko YONEMURA, Misaki KOMATSU, Yoshikazu Hanatani
  • Patent number: 11627115
    Abstract: In a case where data is provided to a plurality of third parties, an embodiment of the present invention provides a method and the like for checking the consent and disclosure history of disclosure to the third parties while also reducing the disadvantages from a data leak. An information processing method according to an embodiment of the present invention includes writing, to a blockchain, a consent record indicating a consent with respect to the handling of data and a related party related to the consent or the data. In the case where executing the handling in the consent record would allow the data to be usable by a third party that is neither the executing party executing the handling nor the related party, the consent record is written such that the identifier is changed to a different identifier uniquely corresponding to the third party.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: April 11, 2023
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomoko Yonemura, Tsukasa Omino, Yoshikazu Hanatani, Taihei Yamaguchi, Misaki Komatsu
  • Publication number: 20220147651
    Abstract: According to one embodiment, a data management method performed by a computer, includes: receiving first request information for requesting to execute a first process on first data, the first data being data regarding a person; and determining whether the first process is executable, based on the first request information and consent information, the consent information including a first condition that the person consents to perform the first process.
    Type: Application
    Filed: September 8, 2021
    Publication date: May 12, 2022
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tsukasa OMINO, Tomoko YONEMURA, Yoshikazu HANATANI, Taihei YAMAGUCHI, Misaki KOMATSU
  • Publication number: 20220147655
    Abstract: According to one embodiment, an information processing method performed by a computer includes receiving a holding request that includes target data and first identification information regarding the target data to generate second identification information different from the first identification information; generating first pseudonymized data that includes the second identification information and the target data, and holding the first pseudonymized data in a first hardware holding device; generating first pseudonymous association data that associates the first identification information with the second identification information, and storing the first pseudonymous association data in a first hardware storage; calculating a first value by an operation based on the first pseudonymous association data; and providing first record information for a storage system, the storage system being configured to store the first record information, the first record information including the first value and including first
    Type: Application
    Filed: September 8, 2021
    Publication date: May 12, 2022
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Misaki KOMATSU, Yoshikazu Hanatani, Tsukasa Omino, Tomoko Yonemura
  • Publication number: 20220141197
    Abstract: In a case where data is provided to a plurality of third parties, an embodiment of the present invention provides a method and the like for checking the consent and disclosure history of disclosure to the third parties while also reducing the disadvantages from a data leak. An information processing method according to an embodiment of the present invention includes writing, to a blockchain, a consent record indicating a consent with respect to the handling of data and a related party related to the consent or the data. In the case where executing the handling in the consent record would allow the data to be usable by a third party that is neither the executing party executing the handling nor the related party, the consent record is written such that the identifier is changed to a different identifier uniquely corresponding to the third party.
    Type: Application
    Filed: August 26, 2021
    Publication date: May 5, 2022
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tomoko Yonemura, Tsukasa Omino, Yoshikazu Hanatani, Taihei Yamaguchi, Misaki Komatsu
  • Patent number: 11289403
    Abstract: A multi-layer substrate includes: a first insulating layer; a conductor layer that is provided on an upper surface of the first insulating layer and that has a penetrating portion; a second insulating layer that covers the conductor layer and that is stacked on the upper surface of the first insulating layer; a via hole that penetrates the second insulating layer from an upper surface of the second insulating layer to reach an inside of the first insulating layer and that includes the penetrating portion; and an insulating member with which the via hole is filled. The conductor layer has a portion exposed in the via hole, and the insulating member covers an upper surface and a lower surface of the conductor layer exposed in the via hole through the penetrating portion of the conductor layer.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 29, 2022
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Misaki Komatsu, Katsuya Fukase
  • Publication number: 20200219794
    Abstract: A multi-layer substrate includes: a first insulating layer; a conductor layer that is provided on an upper surface of the first insulating layer and that has a penetrating portion; a second insulating layer that covers the conductor layer and that is stacked on the upper surface of the first insulating layer; a via hole that penetrates the second insulating layer from an upper surface of the second insulating layer to reach an inside of the first insulating layer and that includes the penetrating portion; and an insulating member with which the via hole is filled. The conductor layer has a portion exposed in the via hole, and the insulating member covers an upper surface and a lower surface of the conductor layer exposed in the via hole through the penetrating portion of the conductor layer.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 9, 2020
    Inventors: Misaki Komatsu, Katsuya Fukase