Patents by Inventor Misaki Matsumura

Misaki Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240059931
    Abstract: A hot-melt composition has excellent workability, hot flow resistance, balance between adhesion and detachability, volatility resistance, and hot creep resistance. The hot-melt composition includes: as thermoplastic elastomers, a styrene-based thermoplastic elastomer having a weight average molecular weight of 300,000 or more, a styrene-based thermoplastic elastomer having a styrene content of no greater than 20% by mass, and an olefin-based thermoplastic elastomer including an ethylene propylene rubber and/or butyl rubber; as tackifiers, an aromatic petroleum resin, a terpene phenol resin, and an amorphous polyalphaolefin; a high molecular weight paraffin oil having a weight average molecular weight of 1,000 or more; and a low molecular weight paraffin oil having a weight average molecular weight of less than 1,000.
    Type: Application
    Filed: December 6, 2021
    Publication date: February 22, 2024
    Applicant: SIKA TECHNOLOGY AG
    Inventor: Misaki MATSUMURA
  • Patent number: 11186755
    Abstract: The present technology provides a reactive hot-melt adhesive including a urethane prepolymer formed from a polyol and a polyisocyanate; and a thermoplastic poly (meth)acrylic resin; the polyol including a bifunctional polyol including polypropylene glycol and polyethylene glycol, a trifunctional polyol, and a polyester polyol having a glass transition temperature of from 20 to 60° C.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: November 30, 2021
    Inventor: Misaki Matsumura
  • Patent number: 11149172
    Abstract: The present technology provides a hot melt composition containing: styrene-based thermoplastic elastomer having a weight average molecular weight of 300000 or more; tackifier; a first paraffin oil having a weight average molecular weight of 1000 or more; and a second paraffin oil having a weight average molecular weight of less than 1000.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: October 19, 2021
    Inventors: Misaki Matsumura, Tomohiro Kawasaki
  • Publication number: 20200048514
    Abstract: The present technology provides a reactive hot-melt adhesive including a urethane prepolymer formed from a polyol and a polyisocyanate; and a thermoplastic poly (meth)acrylic resin; the polyol including a bifunctional polyol including polypropylene glycol and polyethylene glycol, a trifunctional polyol, and a polyester polyol having a glass transition temperature of from 20 to 60° C.
    Type: Application
    Filed: April 18, 2018
    Publication date: February 13, 2020
    Inventor: Misaki Matsumura
  • Publication number: 20190338169
    Abstract: The present technology provides a hot melt composition containing: styrene-based thermoplastic elastomer having a weight average molecular weight of 300000 or more; tackifier; a first paraffin oil having a weight average molecular weight of 1000 or more; and a second paraffin oil having a weight average molecular weight of less than 1000.
    Type: Application
    Filed: December 15, 2017
    Publication date: November 7, 2019
    Inventors: Misaki Matsumura, Tomohiro Kawasaki
  • Patent number: 10358586
    Abstract: A reactive hot-melt adhesive composition of the present technology is moisture curable and contains: a urethane prepolymer having an isocyanate group; a (meth)acrylic resin; and a liquid polymer containing (meth)acryloyloxy groups and/or isocyanate groups.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: July 23, 2019
    Assignee: The Yokohama Rubber Co., LTD.
    Inventor: Misaki Matsumura
  • Patent number: 10174233
    Abstract: A reactive hot-melt adhesive composition that is moisture curable contains: a urethane prepolymer having an isocyanate group, a (meth)acrylic resin, and an adhesion promoter containing at least an isocyanate group-containing (meth)acrylamide compound.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: January 8, 2019
    Assignee: The Yokohama Rubber Co., LTD.
    Inventor: Misaki Matsumura
  • Publication number: 20170174960
    Abstract: A reactive hot-melt adhesive composition that is moisture curable contains: a urethane prepolymer having an isocyanate group, a (meth)acrylic resin, and an adhesion promoter containing at least an isocyanate group-containing (meth)acrylamide compound.
    Type: Application
    Filed: May 7, 2015
    Publication date: June 22, 2017
    Inventor: Misaki MATSUMURA
  • Publication number: 20170158929
    Abstract: A reactive hot-melt adhesive composition of the present technology is moisture curable and contains: a urethane prepolymer having an isocyanate group; a (meth)acrylic resin; and a liquid polymer containing (meth)acryloyloxy groups and/or isocyanate groups.
    Type: Application
    Filed: May 26, 2015
    Publication date: June 8, 2017
    Inventor: Misaki Matsumura
  • Patent number: 9617420
    Abstract: The present technology is an epoxy resin composition containing an epoxy resin (A), a urethane resin (B) in which the terminal isocyanate of the urethane prepolymer is blocked by at least one of an ?-polycaprolactam, an oxime, or a pyrazole, and in which bisphenol A is included in the backbone of the aforementioned urethane prepolymer, and a curing agent (C).
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: April 11, 2017
    Assignee: The Yokohama Rubber Co., LTD.
    Inventors: Misaki Matsumura, Kazunori Ishikawa
  • Publication number: 20140031500
    Abstract: The present technology is an epoxy resin composition containing an epoxy resin (A), a urethane resin (B) in which the terminal isocyanate of the urethane prepolymer is blocked by at least one of an ?-polycaprolactam, an oxime, or a pyrazole, and in which bisphenol A is included in the backbone of the aforementioned urethane prepolymer, and a curing agent (C).
    Type: Application
    Filed: April 2, 2012
    Publication date: January 30, 2014
    Applicant: THE YOKOHAMA RUBBER Co., LTD.
    Inventors: Misaki Matsumura, Kazunori Ishikawa
  • Patent number: 7737203
    Abstract: A rubber composition, superior in the processability and rubber properties compared with a rubber composition using a conventional mercaptosilane coupling agent, containing 100 parts by weight of a diene-based rubber, 10 to 160 parts by weight of a reinforcing filler containing silica and 0.1 to 20% by weight, based upon the weight of silica, of a mercaptosilane coupling agent blocked with a compound having a vinyl ether group and a pneumatic tire using the same.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: June 15, 2010
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Yoshihiro Kameda, Misaki Matsumura
  • Publication number: 20090137730
    Abstract: A rubber composition, superior in the processability and rubber properties compared with a rubber composition using a conventional mercaptosilane coupling agent, containing 100 parts by weight of a diene-based rubber, 10 to 160 parts by weight of a reinforcing filler containing silica and 0.1 to 20% by weight, based upon the weight of silica, of a mercaptosilane coupling agent blocked with a compound having a vinyl ether group and a pneumatic tire using the same.
    Type: Application
    Filed: May 10, 2007
    Publication date: May 28, 2009
    Applicant: The Yokohama Rubber Co., Ltd
    Inventors: Yoshihiro Kameda, Misaki Matsumura
  • Publication number: 20090035580
    Abstract: An object of the invention is to provide an electropeeling composition which, when attached two adhered members, has an enough bond strength and can be easily detached the adherend members following use. An electropeeling composition includes an ionic liquid.
    Type: Application
    Filed: August 9, 2006
    Publication date: February 5, 2009
    Applicant: The Yokohama Rubber Co., Ltd.
    Inventors: Keisuke Chino, Misaki Matsumura