Patents by Inventor Misaki Tabata

Misaki Tabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240332822
    Abstract: An antenna device includes: a dielectric layer; radiation conductors provided to the dielectric layer; and a plurality of columnar conductors disposed around the radiation conductor in plan view seen from a normal direction of the radiation conductor, and peripheral conductors are disposed on an outer side of the plurality of columnar conductors in plan view seen from the normal direction.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 3, 2024
    Applicant: TDK Corporation
    Inventors: Kenichi TEZUKA, Yasuharu MIYAUCHI, Yousuke FUTAMATA, Misaki TABATA
  • Publication number: 20240332823
    Abstract: An antenna device includes: a dielectric layer; radiation conductors and a ground conductor disposed at the dielectric layer; and side surface conductors in which a plurality of conductor patterns are laminated, the side surface conductors are disposed on an outer side of the ground conductors in a first direction in plan view seen from a normal direction of the radiation conductors, and the dimensions of the side surface conductors in a second direction perpendicular to the first direction are larger than the dimensions in the second direction of the radiation conductors.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 3, 2024
    Applicant: TDK Corporation
    Inventors: Kenichi TEZUKA, Yasuharu Miyauchi, Yousuke Futamata, Misaki Tabata
  • Patent number: 9966342
    Abstract: The object of the present invention is to provide a black marker composition capable of forming non-metal marker which sufficiently ensures the adhering strength and the contrast against the foundation; the electronic component comprising the marker made of said black marker composition, and further the communication device comprising said electronic component. The marker composition according to the present invention comprises a borosilicate glass, and a black oxide including Cr, Mn and one or more elements selected from the group consisting of Fe, Ni, Cu and Co.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: May 8, 2018
    Assignee: TDK CORPORATION
    Inventors: Misaki Tabata, Kazunari Kimura
  • Patent number: 8864925
    Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: October 21, 2014
    Assignee: TDK Corporation
    Inventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
  • Publication number: 20140299016
    Abstract: The object of the present invention is to provide a black marker composition capable of forming non-metal marker which sufficiently ensures the adhering strength and the contrast against the foundation; the electronic component comprising the marker made of said black marker composition, and further the communication device comprising said electronic component. The marker composition according to the present invention comprises a borosilicate glass, and a black oxide including Cr, Mn and one or more elements selected from the group consisting of Fe, Ni, Cu and Co.
    Type: Application
    Filed: March 20, 2014
    Publication date: October 9, 2014
    Applicant: TDK CORPORATION
    Inventors: Misaki TABATA, Kazunari KIMURA
  • Publication number: 20130266758
    Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
    Type: Application
    Filed: July 21, 2011
    Publication date: October 10, 2013
    Applicant: TDK Corporation
    Inventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
  • Publication number: 20130115411
    Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
    Type: Application
    Filed: July 21, 2011
    Publication date: May 9, 2013
    Applicant: TDK Corporation
    Inventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
  • Publication number: 20120313743
    Abstract: A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.
    Type: Application
    Filed: September 7, 2011
    Publication date: December 13, 2012
    Applicant: TDK Corporation
    Inventors: Kazunari Kimura, Shigemitsu Tomaki, Misaki Tabata, Isao Abe