Abstract: A coil component includes an element body, and a first coil conductor and a second coil conductor disposed in the element body, in which the conductor has, in a cross section orthogonal to an extending direction of the first coil conductor and the second coil conductor, a first end portion and a second end portion in a width direction viewed from the extending direction, the first end portion forms a first angle, the second end portion forms a second angle, and the first angle and the second angle are different.

Abstract: An antenna device includes: a dielectric layer; radiation conductors provided to the dielectric layer; and a plurality of columnar conductors disposed around the radiation conductor in plan view seen from a normal direction of the radiation conductor, and peripheral conductors are disposed on an outer side of the plurality of columnar conductors in plan view seen from the normal direction.

Abstract: An antenna device includes: a dielectric layer; radiation conductors and a ground conductor disposed at the dielectric layer; and side surface conductors in which a plurality of conductor patterns are laminated, the side surface conductors are disposed on an outer side of the ground conductors in a first direction in plan view seen from a normal direction of the radiation conductors, and the dimensions of the side surface conductors in a second direction perpendicular to the first direction are larger than the dimensions in the second direction of the radiation conductors.

Abstract: The object of the present invention is to provide a black marker composition capable of forming non-metal marker which sufficiently ensures the adhering strength and the contrast against the foundation; the electronic component comprising the marker made of said black marker composition, and further the communication device comprising said electronic component. The marker composition according to the present invention comprises a borosilicate glass, and a black oxide including Cr, Mn and one or more elements selected from the group consisting of Fe, Ni, Cu and Co.

Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

Abstract: The object of the present invention is to provide a black marker composition capable of forming non-metal marker which sufficiently ensures the adhering strength and the contrast against the foundation; the electronic component comprising the marker made of said black marker composition, and further the communication device comprising said electronic component. The marker composition according to the present invention comprises a borosilicate glass, and a black oxide including Cr, Mn and one or more elements selected from the group consisting of Fe, Ni, Cu and Co.

Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

Abstract: A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.