Abstract: Provided is a device for cell culture, the device including: a base material including a culture section used for culturing hematopoietic stem cells or hematopoietic progenitor cells, or both the hematopoietic stem cells and the hematopoietic progenitor cells, wherein the culture section includes a plurality of pores, and wherein a Young's modulus of the culture section measured according to JIS K 7161-1 and JIS K 7161-2 is at least 3 GPa.

Abstract: In an anisotropic conductive adhesive including a magnetic powder such as nickel-coated resin particles used as conductive particles, the conductive particles are present in an insulating adhesive composition without being aggregated. The magnetic powder used as the conductive particles is at least partially composed of a magnetic material. In this case, demagnetization has been performed on the conductive particles in a powder form that have not been dispersed in the insulating adhesive composition, the conductive particles in a paste obtained by dispersing the conductive particles in the insulating adhesive composition, or the conductive particles in a film formed from the paste, before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive.

Abstract: A sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). In the formula (1), R1 is an aralkyl group, R2 is a lower alkyl group, and R3 is a lower alkoxycarbonyl group. X is a halogen atom, and n is an integer of from 1 to 3.

Abstract: An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R1 is an aralkyl group, and R2 is a lower alkyl group, provided that when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.

Abstract: In an anisotropic conductive adhesive including a magnetic powder such as nickel-coated resin particles used as conductive particles, the conductive particles are present in an insulating adhesive composition without being aggregated. The magnetic powder used as the conductive particles is at least partially composed of a magnetic material. In this case, demagnetization has been performed on the conductive particles in a powder form that have not been dispersed in the insulating adhesive composition, the conductive particles in a paste obtained by dispersing the conductive particles in the insulating adhesive composition, or the conductive particles in a film formed from the paste, before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive.

Abstract: A method for transferring an adhesive film, which contains: conveying the adhesive film to an area between the heating part and the adherend; pressurizing the adhesive film with the heating part from the side of the release layer and heating the adhesive layer up to a first heating temperature so as to bring the adhesive layer into contact with the adherend; bringing a high temperature heating part, which is disposed downstream of the heating part with respect to the conveyance direction of the adhesive film, into contact with the adhesive film from the side of the release layer, and heating the adhesive layer up to a second heating temperature so as to cut the adhesive layer; and releasing the release layer from the adhesive layer which is in contact with the adherend, and transferring the adhesive layer which is in contact with the adherend to the adherend.

Abstract: A novel sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). In the formula (1), R1 is an aralkyl group, R2 is a lower alkyl group, and R3 is a lower alkoxycarbonyl group. X is a halogen atom, and n is an integer of from 1 to 3.

Abstract: To provide both an excellent solvent-resistance and a conduction reliability to an insulation coated conductive particle that is suitable for use as a conductive particle in an anisotropic conductive adhesive, the insulation coated conductive particle is configured such that the surface of a conductive particle is coated with an insulating resin layer formed of an insulating resin having a carboxyl group, and the insulating resin layer is surface-treated with a polyfunctional aziridine compound. Examples of the aziridine compound include trimethylolpropane-tri-?-aziridinylpropionate, tetramethylolmethane-tri-?-aziridinylpropionate, and N,N-hexamethylene-1, 6-bis-1-aziridinecarboxamide. The insulating resin layer is preferably composed of an insulating resin having an acrylic acid monomer unit or a methacrylic acid monomer unit. Specifically, the preferable insulating resin is an acrylic acid-styrene copolymer.

Abstract: An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R1 is an aralkyl group, and R2 is a lower alkyl group, provided that when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.

Abstract: A method for transferring an adhesive film, which contains: conveying the adhesive film to an area between the heating part and the adherend; pressurizing the adhesive film with the heating part from the side of the release layer and heating the adhesive layer up to a first heating temperature so as to bring the adhesive layer into contact with the adherend; bringing a high temperature heating part, which is disposed downstream of the heating part with respect to the conveyance direction of the adhesive film, into contact with the adhesive film from the side of the release layer, and heating the adhesive layer up to a second heating temperature so as to cut the adhesive layer; and releasing the release layer from the adhesive layer which is in contact with the adherend, and transferring the adhesive layer which is in contact with the adherend to the adherend.

Abstract: An anisotropic conductive adhesive film and method for anisotropically and conductively connecting a connection terminal of a circuit board to a connection portion of an electronic device ensuring the fluidity of an anisotropic conductive adhesive film during electrical connection of the connection terminals of circuit boards to the connection portions of electronic devices using the anisotropic conductive adhesive film, in such a manner that the conductive particles are effectively confined, that the pressure required for compression bonding is not increased, and that the temporary bonding of the circuit boards to the electronic devices is effected at sufficient strength.

Abstract: A method for mounting through an anisotropic conductive film defined as an adhesive sheet an electronic component on a printed circuit board (flexible board) provided with a wiring pattern. The anisotropic conductive film is bonded to an area of the flexible board to be mounted with the electronic component in a state where air intervening between the anisotropic conductive film and the flexible board is heated. Since the air confined between the anisotropic conductive film and the flexible board reduces in volume upon cooled down, occurrence of voids, exposure of the wiring pattern, or the like is avoided. Consequently, reliability can be enhanced without complicating the mounting.

Abstract: A method for mounting through an anisotropic conductive film defined as an adhesive sheet an electronic component on a printed circuit board (flexible board) provided with a wiring pattern. The anisotropic conductive film is bonded to an area of the flexible board to be mounted with the electronic component in a state where air intervening between the anisotropic conductive film and the flexible board is heated. Since the air confined between the anisotropic conductive film and the flexible board reduces in volume upon cooled down, occurrence of voids, exposure of the wiring pattern, or the like is avoided. Consequently, reliability can be enhanced without complicating the mounting.

Abstract: The invention ensures fluidity of an anisotropic conductive adhesive film during electrical connection of the connection terminals of circuit boards to the connection portions of electronic devices using the anisotropic conductive adhesive film, in such a manner that the conductive particles are effectively confined, that the pressure required for compression bonding is not increased, and that the temporary bonding of the circuit boards to the electronic devices is effected at sufficient strength.

Abstract: To provide both an excellent solvent-resistance and a conduction reliability to an insulation coated conductive particle that is suitable for use as a conductive particle in an anisotropic conductive adhesive, the insulation coated conductive particle is configured such that the surface of a conductive particle is coated with an insulating resin layer formed of an insulating resin having a carboxyl group, and the insulating resin layer is surface-treated with a polyfunctional aziridine compound. Examples of the aziridine compound include trimethylolpropane-tri-?-aziridinylpropionate, tetramethylolmethane-tri-?-aziridinylpropionate, and N,N-hexamethylene-1, 6-bis-1-aziridinecarboxamide. The insulating resin layer is preferably composed of an insulating resin having an acrylic acid monomer unit or a methacrylic acid monomer unit. Specifically, the preferable insulating resin is an acrylic acid-styrene copolymer.

Abstract: The present invention relates to photopolymerizable resin composition inducing substantially no chemical degradation in metals in tight contract with the resin. Further, the present invention relates to optical recording media using the photopolymerizable resins. In one embodiment, a photopolymerizable resin composition includes a photopolymerizable resin based on acrylic ester, and an additive based on at least one selected from the group consisting of benzotriazole and a derivative of benzotriazole, and a photointiator.

Abstract: A ridgy resin film made of a resin is formed. On a flat substrate, a first concave and a second concave are formed such as to be spaced a given distance apart from each other. Then, a resin liquid is supplied onto a land being part of the substrate exposed between the first and second concaves. Due to its surface tension, the resin liquid supplied onto the land bulges, and a ridgy resin film even in width is formed by curing the resin liquid in this state. Along the edges of the openings of the first concave and the second concave, ridges are formed. Since the resin liquid is supplied onto the land between the ridges, it does not drip nor overflow.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Abstract: An adhesive prepared by blending a hardening resin serving as the main component with an urethane resin having a polycarbonate structure. The addition of the urethane resin with the polycarbonate structure makes it possible to give an adhesive which has a high solvent resistance and a good low temperature impact resistance and achieves good adhesion between vinyl chloride and a steel plate. This urethane resin can be obtained by reacting a polyol with an isocyanate compound. It is advantageous to use the urethane resin in an amount of 5 to 35% by weight.

Abstract: The present invention provides photopolymerizable resin compositions inducing no chemical degradation in metals in tight contact therewith and optical recording media using the photopolymerizable resin compositions.