Patents by Inventor Misao Matsuzawa

Misao Matsuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Saw wire assembly, cutting method utilizing the same, and system therefor
    Patent number: 6178962
    Abstract: A cutting system by which a material to be worked is cut off by the use of each of abrasive grain-bonded saw wires contained in a saw wire assembly prepared by arranging the abrasive grain-bonded saw wires on a long tape base material along the longitudinal direction thereof in such a way that they are disposed side by side in the direction perpendicular to the above described longitudinal direction, and bonding tentatively these abrasive grain-bonded saw wires onto the tape base material through an adhesive in a releasable manner, comprises means for releasing the tape base material from the saw wire assembly before it reaches the material to be worked; and means for applying a tension to the saw wire assembly and each of the abrasive grain-bonded saw wires.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: January 30, 2001
    Assignee: Hitachi Cable, Ltd.
    Inventors: Seishiro Ohashi, Misao Matsuzawa