Abstract: A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10–500 ?m and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.

Abstract: A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10-500 &mgr;m and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.

Abstract: A surface acoustic wave device which comprises: a plurality of interdigital transducers formed on a surface acoustic wave substrate; and a plurality of thin film electrodes disposed between the interdigital transducers and an end surface of the surface acoustic wave substrate and electrically independently of the interdigital transducers, at least one of distances between adjacent ones of the thin film electrodes being set to be smaller than a distance between the thin film electrodes and the interdigital transducers, so that the electrical performance of the device as well as the insulation resistance does not deteriorate, and the interdigital transducers can be prevented from being electrostatically broken.