Patents by Inventor Misao Tanaka
Misao Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11925968Abstract: A method for manufacturing a press-formed article (100) includes a first step for forming a base sheet portion, a first rising portion, and a first strip portion from a sheet-shaped workpiece having a first edge portion and a second edge portion; and a second step for forming a second rising portion by causing a strip-shaped first zone including the second edge portion to be disposed between a first upper die and a first lower die from both sides, causing a second zone adjacent to the first zone to be disposed between a second upper die and a second lower die from both sides, and moving the first upper die and the first lower die relative to the second upper die and the second lower die, wherein, in the second step, a part of the second rising portion which is connected to a vertical ridge line (108) is shear-deformed.Type: GrantFiled: September 23, 2020Date of Patent: March 12, 2024Assignee: NIPPON STEEL CORPORATIONInventors: Ryo Kuroda, Yasuharu Tanaka, Takashi Miyagi, Misao Ogawa
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Patent number: 7463969Abstract: An estimated quantity of soot deposited near a movable part of a variable capacity mechanism and an estimated quantity of soot burnt off therefrom are determined in advance in accordance with values of parameters (engine rotation speed or similar) that express the engine operating condition, and stored in storage means. Then actual values of the parameter are measured, and an estimated deposition quantity Sa and an estimated burn off quantity Sb corresponding to the measured values are determined from the storage means. An estimated remaining quantity of soot Kn is determined by obtaining the difference between the estimated deposition quantity and the estimated burn off quantity, and a movable vane is forcibly driven to open and close in accordance with the estimated remaining quantity Kn.Type: GrantFiled: October 4, 2005Date of Patent: December 9, 2008Assignee: Isuzu Motors LimitedInventors: Kazumi Yamaguchi, Misao Tanaka
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Publication number: 20080035112Abstract: An estimated quantity of soot deposited near a movable part of a variable capacity mechanism and an estimated quantity of soot burnt off therefrom are determined in advance in accordance with values of parameters (engine rotation speed or similar) that express the engine operating condition, and stored in storage means. Then actual values of the parameter are measured, and an estimated deposition quantity Sa and an estimated burn off quantity Sb corresponding to the measured values are determined from the storage means. An estimated remaining quantity of soot Kn is determined by obtaining the difference between the estimated deposition quantity and the estimated burn off quantity, and a movable vane is forcibly driven to open and close in accordance with the estimated remaining quantity Kn.Type: ApplicationFiled: October 4, 2005Publication date: February 14, 2008Applicant: Isuzu Motors LimitedInventors: Kazumi Yamaguchi, Misao Tanaka
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Patent number: 6412682Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.Type: GrantFiled: June 22, 2001Date of Patent: July 2, 2002Assignee: Denso CorporationInventors: Ataru Ichikawa, Tatsuya Kubo, Atsushi Furumoto, Kenji Arai, Mitsuhiro Sugiura, Misao Tanaka
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Publication number: 20010032869Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.Type: ApplicationFiled: June 22, 2001Publication date: October 25, 2001Applicant: DENSO CorporationInventors: Ataru Ichikawa, Tatsuya Kubo, Atsushi Furumoto, Kenji Arai, Mitsuhiro Sugiura, Misao Tanaka
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Patent number: 6273319Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.Type: GrantFiled: January 13, 1999Date of Patent: August 14, 2001Assignee: Denso CorporationInventors: Ataru Ichikawa, Tatsuya Kubo, Atsushi Furumoto, Kenji Arai, Mitsuhiro Sugiura, Misao Tanaka
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Patent number: 6273317Abstract: In a flow soldering apparatus, a substrate is clamped by a pair of nails of a chuck mechanism and transferred over a molten solder barrel while being held in contact with a molten solder. The nails are held resiliently to each other, so that the substrate is allowed to expand thermally between the nails without bowing. The chuck mechanism has a scraper nail which extends transversely over the entire lateral length of the substrate at the front side of the substrate in a substrate transfer direction to push away an oxide film formed on the molten solder. The chuck mechanism is constructed to allow the molten solder to enter underneath the substrate in the lateral direction with respect to the substrate transfer direction. After completing one soldering operation, the nails change the set of the opposing two sides to another set of two opposing sides of the substrate, so that the substrate is subjected to the soldering operation from a direction different from the preceding soldering operation.Type: GrantFiled: October 19, 1999Date of Patent: August 14, 2001Assignee: Denso CorporationInventors: Kenji Arai, Ataru Ichikawa, Atsushi Furumoto, Tatuya Kubo, Misao Tanaka, Mitsuhiro Sugiura
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Patent number: 6257480Abstract: In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.Type: GrantFiled: June 29, 1999Date of Patent: July 10, 2001Assignee: Denso CorporationInventors: Atushi Furumoto, Ataru Ichikawa, Tatsuya Kubo, Misao Tanaka, Mitsuhiro Sugiura, Kenji Arai