Abstract: An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

Abstract: An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

Abstract: A cable unit includes a first casing body, a second connector body, a first connector, a second casing, and a cable. The first casing body forms an open shape that includes a first main wall and a first peripheral side-wall. The second casing body forms an open shape that includes a second main wall and a second peripheral side-wall. The second casing body is fitted together with the first casing body such that the second casing body and the first casing body configure a box-shaped casing that expands and contracts along a direction in which the first main wall and the second main wall face each other. The first connector is provided to the first main wall. The second connector is provided to the second main wall. The cable is housed in the casing and connects the first connector with the second connector.

Abstract: A cable unit includes a first casing body, a second connector body, a first connector, a second casing, and a cable. The first casing body forms an open shape that includes a first main wall and a first peripheral side-wall. The second casing body forms an open shape that includes a second main wall and a second peripheral side-wall. The second casing body is fitted together with the first casing body such that the second casing body and the first casing body configure a box-shaped casing that expands and contracts along a direction in which the first main wall and the second main wall face each other. The first connector is provided to the first main wall. The second connector is provided to the second main wall. The cable is housed in the casing and connects the first connector with the second connector.

Abstract: An optical connection box includes, a plurality of first optical connectors to which a plurality of first optical paths are respectively connected, a plurality of second optical connectors that respectively include an operation unit protruding from a peripheral edge side position further from a position of the plurality of first optical connectors on a first surface of the optical connection box, and that are respectively connected to a plurality of receptacle optical connectors which are disposed in the plurality of second optical paths, a plurality of relay optical fibers in which any one of the plurality of first optical connectors is disposed in the first terminal and any one of the plurality of second optical connectors is disposed in the second terminal, and a fitting structure with respect to a substrate in which the receptacle optical connectors are disposed.

Abstract: An electronic device includes: an air-cooled substrate on which an air-cooled component that is cooled by an airflow is mounted; a liquid-cooled substrate that is set apart from the air-cooled substrate in plan view, the liquid-cooled substrate being mounted thereon a liquid-cooled component that is cooled by a liquid; and a refrigerant supply member that is disposed above the liquid-cooled substrate, the refrigerant supply member supplying a refrigerant that cools the liquid-cooled component.

Abstract: An optical connection box includes, a plurality of first optical connectors to which a plurality of first optical paths are respectively connected, a plurality of second optical connectors that respectively include an operation unit protruding from a peripheral edge side position further from a position of the plurality of first optical connectors on a first surface of the optical connection box, and that are respectively connected to a plurality of receptacle optical connectors which are disposed in the plurality of second optical paths, a plurality of relay optical fibers in which any one of the plurality of first optical connectors is disposed in the first terminal and any one of the plurality of second optical connectors is disposed in the second terminal, and a fitting structure with respect to a substrate in which the receptacle optical connectors are disposed.

Abstract: An apparatus includes a cooling device that cools, by using refrigerant, heating components mounted over a circuit board and has different use-temperature conditions, wherein the circuit board is provided with a first area in which a first group of heating components having an operating condition of generating heat less than a given-heat quantity and operating in a temperature range lower than a first temperature is arranged, a second area in which a second group of heating components having an operating condition of generating heat equal not less than the given-heat quantity and operating in a temperature range between the first temperature and a second temperature exceeding the first temperature is arranged, and a third area in which a third group of heating components having an operating condition of generating heat equal to or less than the given-heat quantity and operating in a temperature range exceeding the second temperature is arranged.

Abstract: An electronic device includes: substrate unit including a signal terminal provided over a first edge of a substrate body, and a power terminal provided over a second edge that is different from the first edge; and a case including an insertion unit into which the substrate unit is inserted from the first edge, a signal connection member to which the signal terminal is coupled when the substrate unit is inserted into the insertion unit, and a power connection member to which the power terminal is coupled when the substrate unit is inserted into the insertion unit.

Abstract: An electronic apparatus includes: an electronic device including a housing that accommodates a heat producing part, a heat transfer member configured to be exposed to an outer surface of the housing, and a heat pipe accommodated in the housing and configured to connect the heat producing part and the heat transfer member; and a cooling member, in contact with the heat transfer member, that is disposed on an outside of the housing, the cooling member in which a coolant circulating to and from an external coolant supply part.

Abstract: An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

Abstract: A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.

Abstract: An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

Abstract: A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract: A semiconductor device includes a semiconductor bare chip and an electrically-insulative board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract: A semiconductor device includes a semiconductor bare chip and a board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.