Abstract: A heat-resistant synthetic resin composition, which comprises (A) 15 to 60% by weight of a film-forming synthetic resin soluble in a phenolic solvent and (B) 85 to 40% by weight of a phenolic solvent, said film-forming synthetic resin containing at least 30% by weight of a polyamide imide type resin obtained by causing (a) a tricarboxylic acid and/or an anhydride thereof containing citric acid and (b) a diisocyanate and/or a derivative obtained by masking diisocyanate with a phenolic compound in amounts of substantially equal moles to react in the phenolic solvent.

Abstract: Insulating varnishes capable of forming a film possessing excellent electrical and mechanical properties can be obtained by reacting a reaction product of (1) a reactant of a dicarboxylic acid or a tricarboxylic acid or a derivative thereof comprising an aromatic dicarboxylic acid or a derivative thereof in an amount of at least 95 equivalent % [the term "equivalent" as used herein means (number of moles) x (number of reactive functional groups in one molecule)] of the total of the (1), (2) a primary diol and (3) an aliphatic polyhydric alcohol having at least 3 hydroxyl groups with (4) an aromatic teracarboxylic acid or derivative thereof, and subsequently dispersing the reaction product into an aqueous solution containing ammonia or an organic amine.