Abstract: To provide a light-emitting unit having a semiconductor light-emitting device with a good responsiveness and a sufficient light emission quantity. The light-emitting unit comprises a plurality of semiconductor light-emitting devices, an n-wiring electrode and a p-wiring electrode respectively connecting the semiconductor light-emitting devices in parallel, an n-pad electrode connected to the n-wiring electrode, and a p-pad electrode connected to the p-wiring electrode. At least one of the Group III nitride semiconductor light-emitting devices has a light emission volume of 1 ?m3 to 14 ?m3.

Abstract: The present invention provides a light-emitting device suppressing the reduction in the light output while improving the response speed. As shown in FIG. 1, the light-emitting device comprises four square element regions arranged with the sides of the element regions aligned in a two by two lattice. The light-emitting regions are disposed in the vicinity of corners at the center side of the element regions, and the light-emitting regions are localized in the vicinity of the center in the entire element region. A plane pattern of each of the light-emitting regions is formed so that plane patterns of p-electrodes and n-electrodes are not disposed in a region sandwiched by the light-emitting regions.

Abstract: An emission efficiency of a light-emitting device is improved by reducing strains applied to a light-emitting layer. On a sapphire substrate, an n-type contact layer, an nESD layer, an n-type cladding layer, a light-emitting layer, a p-type cladding layer, and a p-type contact layer, are sequentially deposited. The light-emitting layer has a MQW structure in which a layer unit of a well layer, a capping layer, and a barrier layer sequentially deposited is repeatedly deposited. Of the well layers, the In composition ratio of only first well layer is reduced than the In composition ratios of other well layers, and the In composition ratios of the other well layers are equal to each other. The In composition ratio of the first well layer is designed so that the emission wavelength of the first well layer is equal to the emission wavelengths of other well layers.

Abstract: There is provided a Group III nitride semiconductor light-emitting device in which electrons and holes are suppressed to be captured by threading dislocation, and a production method therefor. The light-emitting device comprises an n-type semiconductor layer, a light-emitting layer on the n-type semiconductor layer, a p-type semiconductor layer on the light-emitting layer. The light-emitting device has a plurality of pits extending from the n-type semiconductor layer to the p-type semiconductor layer. The n-type semiconductor layer includes an n-side electrostatic breakdown preventing layer. The n-side electrostatic breakdown preventing layer comprises an n-type GaN layer containing starting point of the pits, and an ud-GaN layer disposed adjacent to the n-type GaN layer and containing a part of the pits. At least one of the n-type GaN layer and the ud-GaN layer has an In-doped layer. The In composition ratio of the In-doped layer is more than 0 and not more than 0.0035.

Abstract: The present invention provides a light-emitting device suppressing the reduction in the light output while improving the response speed. As shown in FIG. 1, the light-emitting device comprises four square element regions arranged with the sides of the element regions aligned in a two by two lattice. The light-emitting regions are disposed in the vicinity of corners at the center side of the element regions, and the light-emitting regions are localized in the vicinity of the center in the entire element region. A plane pattern of each of the light-emitting regions is formed so that plane patterns of p-electrodes and n-electrodes are not disposed in a region sandwiched by the light-emitting regions.

Abstract: To provide a light-emitting unit having a semiconductor light-emitting device with a good responsiveness and a sufficient light emission quantity. The light-emitting unit comprises a plurality of semiconductor light-emitting devices, an n-wiring electrode and a p-wiring electrode respectively connecting the semiconductor light-emitting devices in parallel, an n-pad electrode connected to the n-wiring electrode, and a p-pad electrode connected to the p-wiring electrode. At least one of the Group III nitride semiconductor light-emitting devices has a light emission volume of 1 ?m3 to 14 ?m3.

Abstract: On the well layer, a first InGaN protective layer is formed at the same temperature employed for the well layer through MOCVD. TMI is pulse supplied. A TMI supply amount is kept constant at a predetermined value of more than 0 ?mol/min and not more than 2 ?mol/min. Moreover, a duty ratio is kept constant at a predetermined value of more than 0 and not more than 0.95. The In composition ratio of the first protective layer is almost directly proportional to the duty ratio. The In composition ratio of the first protective layer can be easily and accurately controlled by controlling the duty ratio so as to have an In composition ratio within a range of more than 0 at % and not more than 3 at %.

Abstract: The present invention provides a Group III nitride semiconductor light-emitting device exhibiting improved emission performance. A light-emitting layer has a MQW structure in which a plurality of layer units are repeatedly deposited, each layer unit comprising a well layer, a protective layer, and a barrier layer sequentially deposited. The protective layer has a layered structure comprising a second protective layer disposed in contact with and on the well layer, and a first protective layer disposed in contact with and on the second protective layer. The second protective layer is formed of GaN. The first protective layer is formed of AlGaInN. The first protective layer has a bandgap larger than that of the well layer and not larger than that of the barrier layer. Moreover, the first protective layer has an In composition ratio of more than 0% and not more than 4%.

Abstract: An emission efficiency of a light-emitting device is improved by reducing strains applied to a light-emitting layer. On a sapphire substrate, an n-type contact layer, an nESD layer, an n-type cladding layer, a light-emitting layer, a p-type cladding layer, and a p-type contact layer, are sequentially deposited. The light-emitting layer has a MQW structure in which a layer unit of a well layer, a capping layer, and a barrier layer sequentially deposited is repeatedly deposited. Of the well layers, the In composition ratio of only first well layer is reduced than the In composition ratios of other well layers, and the In composition ratios of the other well layers are equal to each other. The In composition ratio of the first well layer is designed so that the emission wavelength of the first well layer is equal to the emission wavelengths of other well layers.

Abstract: There is provided a Group III nitride semiconductor light-emitting device in which electrons and holes are suppressed to be captured by threading dislocation, and a production method therefor. The light-emitting device comprises an n-type semiconductor layer, a light-emitting layer on the n-type semiconductor layer, a p-type semiconductor layer on the light-emitting layer. The light-emitting device has a plurality of pits extending from the n-type semiconductor layer to the p-type semiconductor layer. The n-type semiconductor layer includes an n-side electrostatic breakdown preventing layer. The n-side electrostatic breakdown preventing layer comprises an n-type GaN layer containing starting point of the pits, and an ud-GaN layer disposed adjacent to the n-type GaN layer and containing a part of the pits. At least one of the n-type GaN layer and the ud-GaN layer has an In-doped layer. The In composition ratio of the In-doped layer is more than 0 and not more than 0.0035.

Abstract: On the well layer, a first InGaN protective layer is formed at the same temperature employed for the well layer through MOCVD. TMI is pulse supplied. A TMI supply amount is kept constant at a predetermined value of more than 0 ?mol/min and not more than 2 ?mol/min. Moreover, a duty ratio is kept constant at a predetermined value of more than 0 and not more than 0.95. The In composition ratio of the first protective layer is almost directly proportional to the duty ratio. The In composition ratio of the first protective layer can be easily and accurately controlled by controlling the duty ratio so as to have an In composition ratio within a range of more than 0 at % and not more than 3 at %.

Abstract: The present invention provides a Group III nitride semiconductor light-emitting device exhibiting improved emission performance. A light-emitting layer has a MQW structure in which a plurality of layer units are repeatedly deposited, each layer unit comprising a well layer, a protective layer, and a barrier layer sequentially deposited. The protective layer has a layered structure comprising a second protective layer disposed in contact with and on the well layer, and a first protective layer disposed in contact with and on the second protective layer. The second protective layer is formed of GaN. The first protective layer is formed of AlGaInN. The first protective layer has a bandgap larger than that of the well layer and not larger than that of the barrier layer. Moreover, the first protective layer has an In composition ratio of more than 0% and not more than 4%.