Patents by Inventor Misato FUJII

Misato FUJII has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959161
    Abstract: A copper-based alloy material including a multiphase structure containing a matrix of a ? phase and a precipitation phase of a B2-type crystal structure dispersed in the matrix, where the copper-based alloy material includes a composition containing 8.6 to 12.6% by mass of Al, 2.9 to 8.9% by mass of Mn, 3.2 to 10.0% by mass of Ni, and Cu.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: April 16, 2024
    Assignees: FURUKAWA TECHNO MATERIAL CO., LTD., TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD.
    Inventors: Sumio Kise, Fumiyoshi Yamashita, Misato Fujii, Koji Ishikawa, Ryosuke Kainuma, Toshihiro Omori, Nobuyasu Matsumoto
  • Patent number: 11313732
    Abstract: A Ti—Ni-based alloy, which has a torsion angle for Interface I that is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°; a wire, an electrically conductive actuator, and a temperature sensor, each of which uses that alloy; and a method of producing the Ti—Ni-based alloy.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: April 26, 2022
    Assignees: FURUKAWA TECHNO MATERIAL CO., LTD., TOKYO INSTITUTE OF TECHNOLOGY, FURUKAWA ELECTRIC CO., LTD.
    Inventors: Sumio Kise, Fumiyoshi Yamashita, Misato Fujii, Tomonari Inamura, Hideki Hosoda, Yuri Shinohara, Masaki Tahara, Ryota Morishige, Keisuke Saito
  • Publication number: 20210317557
    Abstract: The present invention provides a highly fracture resistant, fatigue resistant copper-based alloy material and the like for which, for example, even when the material is subjected to repeated deformation consisting of loading of stress for applying a shape-memory alloy-specific strain and unloading of same followed return to the original shape, the alloy material is not susceptible to persistence of such strain. This copper-based alloy material has a multiphase structure in which a B2-type crystal structure precipitated phase is dispersed in a ?-phase-comprising matrix.
    Type: Application
    Filed: August 30, 2019
    Publication date: October 14, 2021
    Applicants: FURUKAWA TECHNO MATERIAL CO., LTD., TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD.
    Inventors: Sumio KISE, Fumiyoshi YAMASHITA, Misato FUJII, Koji ISHIKAWA, Ryosuke KAINUMA, Toshihiro OMORI, Nobuyasu MATSUMOTO
  • Patent number: 11118255
    Abstract: A Cu—Al—Mn-based alloy material (1) having a composition comprising: given contents of Al and Mn, and a given total content of at least one selected from Ni and the like; with the balance being Cu and unavoidable impurities, wherein the alloy material has a shape elongated in the working direction (RD), wherein a grain length ax in the RD is R/2 or less to the width or diameter (R), a grain length bx in a direction perpendicular to the RD is R/4 or less, and the amount of grains X (2) is 15% or less, and wherein a grain length a in the RD and a grain length b in the direction perpendicular to the RD satisfy: a?b, and an angle formed by the normal line of the (111) plane and the RD is 15° or larger, the amount of grains Y? (3) is 85% or more.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: September 14, 2021
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD., TOHOKU UNIVERSITY
    Inventors: Misato Fujii, Sumio Kise, Toyonobu Tanaka, Kenji Nakamizo, Koji Ishikawa, Toshihiro Omori, Ryosuke Kainuma
  • Publication number: 20200209068
    Abstract: A Ti—Ni-based alloy, which has a torsion angle for Interface I that is a junction plane between habit plane variants of a martensitic phase, of less than 1.00°; a wire, an electrically conductive actuator, and a temperature sensor, each of which uses that alloy; and a method of producing the Ti—Ni-based alloy.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 2, 2020
    Applicants: FURUKAWA TECHNO MATERIAL CO., LTD., TOKYO INSTITUTE OF TECHNOLOGY, FURUKAWA ELECTRIC CO., LTD.
    Inventors: Sumio Kise, Fumiyoshi Yamashita, Misato Fujii, Tomonari Inamura, Hideki Hosoda, Yuri Shinohara, Masaki Tahara, Ryota Morishige, Keisuke Saito
  • Patent number: 10400311
    Abstract: A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a ? value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a ? single phase; and the use thereof.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: September 3, 2019
    Assignees: FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD., TOHOKU UNIVERSITY
    Inventors: Sumio Kise, Toyonobu Tanaka, Kenji Nakamizo, Koji Ishikawa, Misato Fujii, Toshihiro Omori, Ryosuke Kainuma
  • Publication number: 20160376688
    Abstract: A Cu—Al—Mn-based alloy material (1) having a composition comprising: given contents of Al and Mn, and a given total content of at least one selected from Ni and the like; with the balance being Cu and unavoidable impurities, wherein the alloy material has a shape elongated in the working direction (RD), wherein a grain length ax in the RD is R/2 or less to the width or diameter (R), a grain length bx in a direction perpendicular to the RD is R/4 or less, and the amount of grains X (2) is 15% or less, and wherein a grain length a in the RD and a grain length b in the direction perpendicular to the RD satisfy: a?b, and an angle formed by the normal line of the (111) plane and the RD is 15° or larger, the amount of grains Y? (3) is 85% or more.
    Type: Application
    Filed: September 13, 2016
    Publication date: December 29, 2016
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD., Tohoku University
    Inventors: Misato FUJII, Sumio KISE, Toyonobu TANAKA, Kenji NAKAMIZO, Koji ISHIKAWA, Toshihiro OMORI, Ryosuke KAINUMA
  • Publication number: 20160130683
    Abstract: A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a ? value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a ? single phase; and the use thereof.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Applicants: FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD., Tohoku University
    Inventors: Sumio KISE, Toyonobu TANAKA, Kenji NAKAMIZO, Koji ISHIKAWA, Misato FUJII, Toshihiro OMORI, Ryosuke KAINUMA
  • Publication number: 20160060740
    Abstract: A Cu—Al—Mn-based alloy rod having superelastic characteristics and having a recrystallized microstructure substantially formed of a ? single phase, wherein, for a longitudinal direction cross section of the rod, a region, in which a grain size of each of grains is a radius of the rod or more, is 90% or more of the longitudinal direction cross section at any location of the rod, and wherein an average grain size of the grains, in which the grain size is the radius of the rod or more, is 80% or more of a diameter of the rod; a Cu—Al—Mn-based alloy sheet; a production method thereof; a vibration damping material using thereof; a vibration damping structure constructed by using the vibration damping material.
    Type: Application
    Filed: November 10, 2015
    Publication date: March 3, 2016
    Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD.
    Inventors: Toshihiro OMORI, Tomoe KUSAMA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Sumio KISE, Kenji NAKAMIZO, Koji ISHIKAWA, Misato FUJII, Satoshi TESHIGAWARA