Abstract: A surface-treated copper foil is capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. A resin substrate is provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil has a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 ?m.

Abstract: The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 ?m.

Abstract: The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 ?m.

Abstract: Provided is an oral composition that can sufficiently remove protein staining present on a tooth surface, can effectively prevent adhesion of protein staining on a tooth surface and can provide a good actual feeling of the cleaning effect in the oral cavity. The oral composition comprises the following components (A) and (B): (A) an N-acylamino acid or a salt thereof in an amount of 0.005 mass % or more and 0.3 mass % or less; and (B) pyrophosphoric acid or a salt thereof in an amount of 0.005 mass % or more and 0.5 mass % or less, in which a mass ratio ((B)/(A)) of the component (B) to the component (A) is 0.05 or more and 40 or less and a total content of the component (A) and the component (B) is 0.01 mass % or more and 0.6 mass % or less.

Abstract: Provided is an oral composition that can sufficiently remove protein staining present on a tooth surface, can effectively prevent adhesion of protein staining on a tooth surface and can provide a good actual feeling of the cleaning effect in the oral cavity. The oral composition comprises the following components (A) and (B): (A) an N-acylamino acid or a salt thereof in an amount of 0.005 mass % or more and 0.3 mass % or less; and (B) pyrophosphoric acid or a salt thereof in an amount of 0.005 mass % or more and 0.5 mass % or less, in which a mass ratio ((B)/(A)) of the component (B) to the component (A) is 0.05 or more and 40 or less and a total content of the component (A) and the component (B) is 0.01 mass % or more and 0.6 mass % or less.