Patents by Inventor Misato Oonishi

Misato Oonishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Negative photosensitive resin composition and cured product of same
    Patent number: 9411229
    Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 9, 2016
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
  • Photosensitive resin composition and cured product thereof
    Patent number: 9223212
    Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: December 29, 2015
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
  • Photosensitive resin composition and cured product thereof
    Patent number: 8865392
    Abstract: Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: October 21, 2014
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Misato Oonishi, Naoko Imaizumi, Ryo Sakai, Nao Honda, Tadayuki Kiyoyanagi
  • Photosensitive Resin Composition And Cured Product Thereof
    Publication number: 20140186765
    Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.
    Type: Application
    Filed: July 26, 2012
    Publication date: July 3, 2014
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
  • Negative Photosensitive Resin Composition And Cured Product Of Same
    Publication number: 20140099581
    Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.
    Type: Application
    Filed: June 19, 2012
    Publication date: April 10, 2014
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
  • Photosensitive Resin Composition And Cured Product Thereof
    Publication number: 20130108961
    Abstract: Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).
    Type: Application
    Filed: July 13, 2011
    Publication date: May 2, 2013
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Misato Oonishi, Naoko Imaizumi, Ryo Sakai, Nao Honda, Tadayuki Kiyoyanagi