Abstract: In examples, a device includes a cascade of integrators (COI) filter including an accumulator having an output and a decimator having an input coupled to the output of the accumulator. An output of the decimator is an output of the COI filter. The device includes a SINC filter including the accumulator and the decimator of the COI filter. The SINC filter further includes a differentiator having an input coupled to the output of the decimator, in which an output of the differentiator is an output of the SINC filter. The device also includes a multiplexer having an output and first and second inputs. The first input of the multiplexer is coupled to the output of the COI filter, and the second input of the multiplexer is coupled to the output of the SINC filter.

Abstract: In examples, a device includes a cascade of integrators (COI) filter including an accumulator having an output and a decimator having an input coupled to the output of the accumulator. An output of the decimator is an output of the COI filter. The device includes a SINC filter including the accumulator and the decimator of the COI filter. The SINC filter further includes a differentiator having an input coupled to the output of the decimator, in which an output of the differentiator is an output of the SINC filter. The device also includes a multiplexer having an output and first and second inputs. The first input of the multiplexer is coupled to the output of the COI filter, and the second input of the multiplexer is coupled to the output of the SINC filter.

Abstract: A package substrate includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the package substrate and includes a first contact pad coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the package substrate and includes a second contact pad coupled to the second circuit element.