Patents by Inventor Misuhiko SUGANE

Misuhiko SUGANE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board manufacturing method
    Patent number: 8631568
    Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: January 21, 2014
    Assignee: Fujitsu Limited
    Inventors: Tetsuro Yamada, Takahiro Ooi, Yoshihiro Morita, Akiko Matsui, Misuhiko Sugane, Takahide Mukoyama
  • Printed wiring board manufacturing method
    Patent number: 8595926
    Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: December 3, 2013
    Assignee: Fujitsu Limited
    Inventors: Tetsuro Yamada, Takahiro Ooi, Yoshihiro Morita, Akiko Matsui, Misuhiko Sugane, Takahide Mukoyama
  • Printed Wiring Board Manufacturing Method and Printed Wiring Board
    Publication number: 20110232949
    Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 29, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Tetsuro YAMADA, Takahiro OOI, Yoshihiro MORITA, Akiko MATSUI, Misuhiko SUGANE, Takahide MUKOYAMA