Abstract: An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.

Abstract: An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.

Abstract: A resin sealing ceramic package 10 for resin sealing of a semiconductor element 14 mounted in a cavity 16, the ceramic package having a bleed-out-preventing metal pattern 24, to prevent bleed-out of a sealing resin filled in the cavity 16 from out of the cavity, which comprises a metallized layer 26 made of tungsten formed in a frame-shape on the surface of the ceramic package 10 along the edges of the cavity 16, and a metal plating layer 32 consisting of a nickel layer 28 of at least 1.5 .mu.m thickness and a gold layer 30 of at least 0.3 .mu.m thickness formed on the metallized layer 26.