Patents by Inventor Misuzu Sagawa
Misuzu Sagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210351562Abstract: An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.Type: ApplicationFiled: July 26, 2021Publication date: November 11, 2021Inventors: Hideo ARIMOTO, Koichiro ADACHI, Misuzu SAGAWA, Takanori SUZUKI, Hiroyasu SASAKI
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Patent number: 11075500Abstract: An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.Type: GrantFiled: September 28, 2018Date of Patent: July 27, 2021Assignee: Lumentum Japan, Inc.Inventors: Hideo Arimoto, Koichiro Adachi, Misuzu Sagawa, Takanori Suzuki, Hiroyasu Sasaki
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Patent number: 10662059Abstract: The invention is to reduce non-uniformity of a processing shape over a wide range of a single field-of-view. The invention is directed to a method of processing micro electro mechanical systems with a first step and a second step in a processing apparatus including an irradiation unit that irradiates a sample with a charged particle beam, a shape measuring unit that measures a shape of the sample, and a control unit. In the first step, the irradiation unit irradiates a plurality of single field-of-view points with the charged particle beam in a first region of the sample, the shape measuring unit measures the shape of a spot hole formed in the first region of the sample, and the control unit sets, based on measurement results of the shape of the spot hole, a scan condition of the charged particle beam or a forming mask of the charged particle beam at each of the single field-of-view points.Type: GrantFiled: June 22, 2018Date of Patent: May 26, 2020Assignee: HITACHI, LTD.Inventors: Keiji Watanabe, Hiroyasu Shichi, Misuzu Sagawa, Toshiyuki Mine, Daisuke Ryuzaki
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Patent number: 10538429Abstract: In a calculator in a MEMS manufacturing system, a stage control unit inclines a stage based on a stage angle 1 setting a stage inclination angle and a stage angle 2 of the inclination angle different from the stage angle 1. A stage-angle calculation unit calculates the stage inclination angles from first and second images acquired by a SEM apparatus when the stage control unit sets the stage at the stage angles 1 and 2. A 3D-data creation unit creates three-dimensional device data from a third image that is a device image acquired when the stage is set at the stage angle 1 and a fourth image that is a device image acquired when the stage is set at the stage angle 2. When the three-dimensional device data is created, a correction value calculated from the stage angles 1 and 2 and the first and second images is used.Type: GrantFiled: July 9, 2018Date of Patent: January 21, 2020Assignee: Hitachi, Ltd.Inventors: Misuzu Sagawa, Atsushi Isobe
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Patent number: 10410826Abstract: The invention is directed to a technique for reducing the time from the start of fabrication of a prototype structure to the completion of fabrication of a real structure. A device processing method includes steps of: fabricating a first structure using an ion beam under a first condition in a first region on a substrate; measuring a size of the first structure which is fabricated; comparing the measurement result with design data; determining a second condition from the comparison result; and fabricating a second structure using the ion beam under the second condition in a second region on the substrate.Type: GrantFiled: March 18, 2016Date of Patent: September 10, 2019Assignee: HITACHI, LTD.Inventors: Tetsufumi Kawamura, Misuzu Sagawa, Kazuki Watanabe, Keiji Watanabe, Shuntaro Machida, Nobuyuki Sugii, Daisuke Ryuzaki
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Publication number: 20190084830Abstract: In a calculator in a MEMS manufacturing system, a stage control unit inclines a stage based on a stage angle 1 setting a stage inclination angle and a stage angle 2 of the inclination angle different from the stage angle 1. A stage-angle calculation unit calculates the stage inclination angles from first and second images acquired by a SEM apparatus when the stage control unit sets the stage at the stage angles 1 and 2. A 3D-data creation unit creates three-dimensional device data from a third image that is a device image acquired when the stage is set at the stage angle 1 and a fourth image that is a device image acquired when the stage is set at the stage angle 2. When the three-dimensional device data is created, a correction value calculated from the stage angles 1 and 2 and the first and second images is used.Type: ApplicationFiled: July 9, 2018Publication date: March 21, 2019Inventors: Misuzu SAGAWA, Atsushi ISOBE
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Publication number: 20190062157Abstract: The invention is to reduce non-uniformity of a processing shape over a wide range of a single field-of-view. The invention is directed to a method of processing micro electro mechanical systems with a first step and a second step in a processing apparatus including an irradiation unit that irradiates a sample with a charged particle beam, a shape measuring unit that measures a shape of the sample, and a control unit. In the first step, the irradiation unit irradiates a plurality of single field-of-view points with the charged particle beam in a first region of the sample, the shape measuring unit measures the shape of a spot hole formed in the first region of the sample, and the control unit sets, based on measurement results of the shape of the spot hole, a scan condition of the charged particle beam or a forming mask of the charged particle beam at each of the single field-of-view points.Type: ApplicationFiled: June 22, 2018Publication date: February 28, 2019Inventors: Keiji WATANABE, Hiroyasu SHICHI, Misuzu SAGAWA, Toshiyuki MINE, Daisuke RYUZAKI
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Publication number: 20190036295Abstract: An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.Type: ApplicationFiled: September 28, 2018Publication date: January 31, 2019Inventors: Hideo ARIMOTO, Koichiro ADACHI, Misuzu SAGAWA, Takanori SUZUKI, Hiroyasu SASAKI
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Publication number: 20190013179Abstract: The invention is directed to a technique for reducing the time from the start of fabrication of a prototype structure to the completion of fabrication of a real structure. A device processing method includes steps of: fabricating a first structure using an ion beam under a first condition in a first region on a substrate; measuring a size of the first structure which is fabricated; comparing the measurement result with design data; determining a second condition from the comparison result; and fabricating a second structure using the ion beam under the second condition in a second region on the substrate.Type: ApplicationFiled: March 18, 2016Publication date: January 10, 2019Applicant: HITACHI, LTD.Inventors: Tetsufumi KAWAMURA, Misuzu SAGAWA, Kazuki WATANABE, Keiji WATANABE, Shuntaro MACHIDA, Nobuyuki SUGII, Daisuke RYUZAKI
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Patent number: 10002801Abstract: The device manufacturing method includes a length measuring step (S5) of, on the basis of an observation target image of an SEM image taken from a direction having a predetermined angle from a direction perpendicular to a plane of a substrate, measuring the thickness of a target object, or the depth of etching, formed on the substrate. In addition, in the length measuring step, an etching angle made by a cross section of the etching and the direction perpendicular to the plane of the substrate is calculated from processing data of the target object, and the thickness of the target object or the depth of the etching is measured on the basis of the calculated etching angle.Type: GrantFiled: May 17, 2017Date of Patent: June 19, 2018Assignee: HITACHI, LTD.Inventors: Misuzu Sagawa, Tetsufumi Kawamura
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Publication number: 20180005906Abstract: The device manufacturing method includes a length measuring step (S5) of, on the basis of an observation target image of an SEM image taken from a direction having a predetermined angle from a direction perpendicular to a plane of a substrate, measuring the thickness of a target object, or the depth of etching, formed on the substrate. In addition, in the length measuring step, an etching angle made by a cross section of the etching and the direction perpendicular to the plane of the substrate is calculated from processing data of the target object, and the thickness of the target object or the depth of the etching is measured on the basis of the calculated etching angle.Type: ApplicationFiled: May 17, 2017Publication date: January 4, 2018Inventors: Misuzu SAGAWA, Tetsufumi KAWAMURA
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Publication number: 20160111852Abstract: An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.Type: ApplicationFiled: December 16, 2015Publication date: April 21, 2016Inventors: Hideo ARIMOTO, Koichiro ADACHI, Misuzu SAGAWA, Takanori SUZUKI, Hiroyasu SASAKI
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Patent number: 9244231Abstract: An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.Type: GrantFiled: November 27, 2013Date of Patent: January 26, 2016Assignee: OCLARO JAPAN, INC.Inventors: Hideo Arimoto, Koichiro Adachi, Misuzu Sagawa, Takanori Suzuki, Hiroyasu Sasaki
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Patent number: 9052449Abstract: The light emitting device includes an active layer formed on a semiconductor substrate for emitting light, a semiconductor layer of a first conductivity type electrically connected to one end of the active layer, a semiconductor layer of a second conductivity type electrically connected to the other end of the active layer, first and second electrodes, a feedback mechanism for laser oscillation, and a waveguide for guiding the light emitted from the active layer, in which the active layer is made of a semiconductor having an affinity with a silicon CMOS process, and the semiconductor layer of the first conductivity type and the semiconductor layer of the second conductivity type, and the waveguide are each made of silicon as a part of the semiconductor substrate.Type: GrantFiled: November 24, 2013Date of Patent: June 9, 2015Assignee: Hitachi, Ltd.Inventors: Misuzu Sagawa, Katsuya Oda, Kazuki Tani
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Publication number: 20140241734Abstract: The light emitting device includes an active layer formed on a semiconductor substrate for emitting light, a semiconductor layer of a first conductivity type electrically connected to one end of the active layer, a semiconductor layer of a second conductivity type electrically connected to the other end of the active layer, first and second electrodes, a feedback mechanism for laser oscillation, and a waveguide for guiding the light emitted from the active layer, in which the active layer is made of a semiconductor having an affinity with a silicon CMOS process, and the semiconductor layer of the first conductivity type and the semiconductor layer of the second conductivity type, and the waveguide are each made of silicon as a part of the semiconductor substrate.Type: ApplicationFiled: November 24, 2013Publication date: August 28, 2014Applicant: Hitachi, Ltd.Inventors: Misuzu Sagawa, Katsuya Oda, Kazuki Tani
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Publication number: 20140153605Abstract: An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.Type: ApplicationFiled: November 27, 2013Publication date: June 5, 2014Applicant: Oclaro Japan, Inc.Inventors: Hideo ARIMOTO, Koichiro ADACHI, Misuzu SAGAWA, Takanori SUZUKI, Hiroyasu SASAKI
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Patent number: 8036533Abstract: An optical element mounting substrate where a plurality of light emitting elements have been mounted on the same plane, a lens array for collimating a plurality of light emitted from the plurality of light emitting elements, and a wavelength multiplexing/demultiplexing device are prepared. The wavelength multiplexing/demultiplexing device has typically mounted both a wavelength selecting filter and a mirror on front and rear planes of a transparent substrate. These three components are mounted within a package at a desirable angle position. Optical axes of respective wavelengths of the wavelength multiplexing/demultiplexing device are determined based upon a thickness and an angle of the light emitting element mounting substrate, and are arrayed on a straight line of a horizontal plane. As a consequence, if the respective light emitting elements are arranged on the optical axes which are exclusively determined by a design work, then optical multiplexing/demultiplexing operations can be carried out.Type: GrantFiled: October 20, 2008Date of Patent: October 11, 2011Assignee: Hitachi, Ltd.Inventors: Kazuhiko Hosomi, Misuzu Sagawa, Toshiki Sugawara, Masahiro Aoki
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Publication number: 20100178053Abstract: In an optical communications system in which an OLT transceiver and a plurality of ONU transceivers are connected to each other via an optical fiber and a TDMA system in which a signal from each of the ONU transceivers is issued at a timing assigned by the OLT transceiver is used, each of the ONU transceivers includes a light source which has modulation function of a Fabry-Perot laser that oscillates multi-mode lights of different wavelengths, the OLT transceiver includes a single-longitudinal-mode light source which has modulation function of a DFB laser that oscillates a single-longitudinal-mode light, and the light source which has modulation function included in each of the ONU transceivers and the single-longitudinal-mode light source which has modulation function included in the OLT transceiver are optically connected to each other via an optical fiber.Type: ApplicationFiled: January 13, 2010Publication date: July 15, 2010Applicant: HITACHI, LTD.Inventors: Misuzu SAGAWA, Toshiki SUGAWARA
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Publication number: 20090103923Abstract: An optical element mounting substrate where a plurality of light emitting elements have been mounted on the same plane, a lens array for collimating a plurality of light emitted from the plurality of light emitting elements, and a wavelength multiplexing/demultiplexing device are prepared. The wavelength multiplexing/demultiplexing device has typically mounted both a wavelength selecting filter and a mirror on front and rear planes of a transparent substrate. These three components are mounted within a package at a desirable angle position. Optical axes of respective wavelengths of the wavelength multiplexing/demultiplexing device are determined based upon a thickness and an angle of the light emitting element mounting substrate, and are arrayed on a straight line of a horizontal plane. As a consequence, if the respective light emitting elements are arranged on the optical axes which are exclusively determined by a design work, then optical multiplexing/demultiplexing operations can be carried out.Type: ApplicationFiled: October 20, 2008Publication date: April 23, 2009Inventors: Kazuhiko HOSOMI, Misuzu Sagawa, Toshiki Sugawara, Masahiro Aoki
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Publication number: 20090097847Abstract: An optical module comprising: a submount provided on a CAN stem; light-emitting device and a light-receiving device; a CAN cap or package; and an optical multiplexer/demultiplexer having a wavelength selective filter on a substrate that has transmissivity to passing light and a mirror, where an extending direction of the optical multiplexer/demultiplexer is fixed in the CAN cap or the package being tilted by an angle ? (??2N?, N=0, 1, 2, . . . ) in a two-dimensional cross section with respect to one surface of an optical device mounting board, outgoing light from the light-emitting device passes through the wavelength selective filter and the substrate and enters an optical fiber outside the cap, and outgoing light from the optical fiber enters the optical multiplexer/demultiplexer and is reflected by the wavelength selective filter and further reflected by the mirror, and then exits the optical multiplexer/demultiplexer to enter the light-receiving device.Type: ApplicationFiled: October 10, 2008Publication date: April 16, 2009Inventors: Kazuhiko HOSOMI, Misuzu SAGAWA, Toshiki SUGAWARA, Masahiro AOKI